BONDING METHOD
    2.
    发明公开
    BONDING METHOD 审中-公开

    公开(公告)号:US20240342999A1

    公开(公告)日:2024-10-17

    申请号:US18684869

    申请日:2022-10-06

    IPC分类号: B29C65/14 B29C65/00

    摘要: A bonding method bonds a buffer member to an adherend member, and includes: an adhesive application step of applying an adhesive to a part of the buffer member, the part being bonded to the adherend member; a first heating step of heating a part of the adherend member, the part being bonded to the buffer member; a second heating step of heating the part of the adherend member after the first heating step; and an attachment step of attaching the buffer member to the adherend member after the second heating step.

    Method and device for inspecting a joining surface

    公开(公告)号:US11745437B2

    公开(公告)日:2023-09-05

    申请号:US16624111

    申请日:2018-05-11

    发明人: Lennert Heilmann

    摘要: A method for inspecting a joining surface (14) of a substrate, wherein a component is to be adhered to the joining surface of the substrate by means of an adhesive material (27), wherein the method comprises the following steps: •—providing at least one planar test textile (20), which has a fiber material (21) and an adhesive primer (22), •—applying the planar test textile to at least one part of the joining surface of the substrate to which the component is to be adhered so that the adhesive primer of the planar test textile contacts the joining surface of the substrate, •—at least partially curing the adhesive primer of the planar test textile in order to integrally bond the planar test textile to the substrate by means of the adhesive primer, •—pulling off the planar test textile after at least partially curing the adhesive primer and inspecting the joining surface by means of a qualitative evaluation of the fracture pattern between the cured adhesive primer and the planar test textile and/or by means of a quantitative evaluation of the pull-off force determined when pulling off the planar test textile.