公开(公告)号：US20240342999A1

公开(公告)日：2024-10-17

申请号：US18684869

申请日：2022-10-06

Applicant: NHK Spring Co., Ltd.

Inventor： Hidetoshi Mizuta ,  Atom Furuse ,  Kaoru Nagasawa ,  Fumitaka Arai

IPC: B29C65/14 ,  B29C65/00

CPC classification number: B29C65/1416 ,  B29C66/742 ,  B60G2206/821

Abstract: A bonding method bonds a buffer member to an adherend member, and includes: an adhesive application step of applying an adhesive to a part of the buffer member, the part being bonded to the adherend member; a first heating step of heating a part of the adherend member, the part being bonded to the buffer member; a second heating step of heating the part of the adherend member after the first heating step; and an attachment step of attaching the buffer member to the adherend member after the second heating step.

公开(公告)号：US20230166322A1

公开(公告)日：2023-06-01

申请号：US17696265

申请日：2022-03-16

Applicant: NHK Spring Co., Ltd.

Inventor： Ryuichi Numakunai ,  Kaoru Nagasawa ,  Fumitaka Arai ,  Kiyoaki Tanabe ,  Yukiya Mori ,  Katsunori Suzuki ,  Akira Okubo

IPC: B21J13/08 ,  B21J9/02 ,  B21J9/20

CPC classification number: B21J13/085 ,  B21J9/02 ,  B21J9/20

Abstract: A manufacturing method includes: conveying a target to a processing unit by using a conveying arm; conveying the target to a correction information acquiring unit provided in a position different from a position of the processing unit; acquiring position information relating to a position of the target conveyed to the correction information acquiring unit in a three-dimensional space; correcting a conveying position of the conveying arm to the processing unit based on the position information; and executing processing for the target conveyed to the corrected conveying position to manufacture a product.