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公开(公告)号:US20150064823A1
公开(公告)日:2015-03-05
申请号:US14466354
申请日:2014-08-22
Applicant: NICHIA CORPORATION
Inventor: Hiroaki TAMEMOTO , Chihiro JUASA
IPC: H01L33/00
CPC classification number: H01L33/007 , H01L33/0095 , H01L33/20 , H01L33/22 , H01L33/32
Abstract: A method for manufacturing a light emitting element that includes preparing a wafer having a substrate and a semiconductor structure, the substrate including a plurality of protrusions at positions corresponding to lattice points on a triangular lattice. The method includes forming a plurality of first modified parts in the substrate by irradiating the substrate with a laser beam along first dividing lines, forming a plurality of second modified parts in the substrate by irradiating the substrate with a laser beam along second dividing lines, and dividing the wafer along the first modified parts and the second modified parts to obtain a plurality of light emitting elements.
Abstract translation: 一种制造发光元件的方法,其包括制备具有基板和半导体结构的晶片,所述基板在对应于三角形格子上的格子点的位置处包括多个突起。 该方法包括通过沿着第一分割线用激光束照射基板,在基板中形成多个第一改质部分,通过沿着第二分割线用激光束照射基板,在基板中形成多个第二改性部分,以及 沿着第一修改部分和第二修改部分分割晶片以获得多个发光元件。
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公开(公告)号:US20170200855A1
公开(公告)日:2017-07-13
申请号:US15471244
申请日:2017-03-28
Applicant: NICHIA CORPORATION
Inventor: Hiroaki TAMEMOTO , Chihiro JUASA
CPC classification number: H01L33/007 , H01L33/0095 , H01L33/20 , H01L33/22 , H01L33/32
Abstract: A method for manufacturing a light emitting element that includes preparing a wafer having a substrate and a semiconductor structure, the substrate including a plurality of protrusions at positions corresponding to lattice points on a regular triangular lattice. The method includes forming a plurality of first modified parts in the substrate by irradiating the substrate with a laser beam along first dividing lines, forming a plurality of second modified parts in the substrate by irradiating the substrate with a laser beam along second dividing lines, and dividing the wafer along the first modified parts and the second modified parts to obtain a plurality of light emitting elements.
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