公开(公告)号：US20160013378A1

公开(公告)日：2016-01-14

申请号：US14795892

申请日：2015-07-10

Applicant: NICHIA CORPORATION

Inventor： Masahiro SAKAMOTO ,  Kazuhide YANASAKA ,  Satoshi SHICHIJO

IPC: H01L33/56 ,  H01L33/00 ,  H01L33/54 ,  H01L33/62 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L33/48 ,  H01L33/54 ,  H01L33/56 ,  H01L33/64 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265

Abstract: A semiconductor light emitting device includes a lead frame 1 covered by a resin package 2. The lead frame 1 includes first and second leads 1A and 1B facing each other. The first and second leads 1A and 1B include inner lead sections 11 and 12 covered with the package 2, respectively. The first and second leads 1A and 1B include outer lead sections 13 protruding from package 2 ends. First and second exposed surfaces 51 and 52 are exposed from the package 2 in the first and second lead lower surfaces, respectively. The first lead 1A is longer than the second lead 1B. An LED 3 is mounted on the first lead upper surface. The second lead 1B includes second end portions 15 extending in the second exposed surface 52 from the both ends of the facing surface toward the first lead 1A.

Abstract translation: 半导体发光器件包括由树脂封装2覆盖的引线框架1.引线框架1包括彼此面对的第一和第二引线1A和1B。 第一引线1A和第二引线1B分别包括被封装2覆盖的内引线部分11和12。 第一引线1A和第二引线1B包括从封装2端突出的外引线部分13。 第一和第二暴露表面51和52分别从第一和第二引线下表面中的封装2露出。 第一引线1A比第二引线1B长。 LED 3安装在第一引线上表面上。 第二引线1B包括在第二暴露表面52中从相对表面的两端朝向第一引线1A延伸的第二端部15。