公开(公告)号：US20190273195A1

公开(公告)日：2019-09-05

申请号：US16288464

申请日：2019-02-28

Applicant: NICHIA CORPORATION

Inventor： Hiroaki UKAWA ,  Ryo IWASA

IPC: H01L33/62 ,  H01L25/075 ,  H01L25/16 ,  H01L23/00 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60 ,  H01L23/544

Abstract: A light emitting device includes a plurality of light emitting elements and a package. The package includes two metal parts on which the plurality of light emitting elements are disposed, and a resin body securing the two metal parts. The resin body has four sides and four connecting parts alternately connected to one another in a top view. Two subsequent sides are perpendicular to each other. Each of the two metal parts includes a die-pad on which one or more of the plurality of light emitting elements are disposed, and two extending portions extending from the die-pad. An end portion of each of the two extending portions is extended laterally outward from a respective one of the connecting parts of the resin body, and the end portion of each of the two extending portions is located inward of virtual extension lines of corresponding two sides of the resin body.

公开(公告)号：US20210343917A1

公开(公告)日：2021-11-04

申请号：US17375466

申请日：2021-07-14

Applicant: NICHIA CORPORATION

Inventor： Hiroaki UKAWA ,  Ryo IWASA

IPC: H01L33/62 ,  H01L33/60 ,  H01L33/54 ,  H01L33/48

Abstract: A light emitting device includes: a base member including: a first lead, a second lead, and resin member supporting the first lead and the second lead, wherein each of a surface of the first lead that includes a first surface, a surface of the second lead, and a surface of the resin member that includes a second surface are positioned at an upper surface of the base member; a light emitting element located at the surface of the first lead; a resin frame located at the upper surface of the base member, where the first surface and at least a portion of the second surface are exposed inward of the resin frame; and a reflective member covering at least a portion of the second surface. Projections are located on the upper surface of the resin member that forms a portion of the upper surface of the base member.