公开(公告)号：US11837845B2

公开(公告)日：2023-12-05

申请号：US18146070

申请日：2022-12-23

Applicant: NICHIA CORPORATION

Inventor： Shota Murakami ,  Soichiro Miura

IPC: H01S5/022 ,  H01S5/024 ,  H01S5/026

CPC classification number: H01S5/022 ,  H01S5/0262 ,  H01S5/02461

Abstract: A light emitting device includes: a base having a bottom face and a lateral part surrounding the bottom face and extending upwards from the bottom face, wherein the lateral part comprises a first stepped portion and a second stepped portion facing the first stepped portion; a first semiconductor laser element disposed on the bottom face and located between the first stepped portion and the second stepped portion in a top view, wherein the first semiconductor laser element is configured to emit light towards the second stepped portion; a first wiring region located on the first stepped portion; and one or more first wires, each having a first end that is connected to the first wiring region. At least one of the one or more first wires is electrically connected to the first semiconductor laser element.

公开(公告)号：US11569634B2

公开(公告)日：2023-01-31

申请号：US17111194

申请日：2020-12-03

Applicant: NICHIA CORPORATION

Inventor： Shota Murakami ,  Soichiro Miura

IPC: H01S5/022 ,  H01S5/024 ,  H01S5/026

Abstract: A light emitting device includes: a base having a first stepped portion and a second stepped portion; a light emitting element; an electronic member configured to be irradiated by light emitted from the light emitting element; a first wiring region located on the first stepped portion; a second wiring region located on the second stepped portion; wires connected to the light emitting element and the electronic member. The wires includes a first and second wires. The first wire has a first end that is connected to the first wiring region, and a second end. The second wire has a first end that is connected to the second wiring region, and a second end. A position of the second end of the first wire relative to the bottom face is lower than a position of the second end of the second wire relative to the bottom face.

公开(公告)号：US12107384B2

公开(公告)日：2024-10-01

申请号：US18494190

申请日：2023-10-25

Applicant: NICHIA CORPORATION

Inventor： Shota Murakami ,  Soichiro Miura

IPC: H01S5/022 ,  H01S5/024 ,  H01S5/026

CPC classification number: H01S5/022 ,  H01S5/02461 ,  H01S5/0262

Abstract: A light emitting device includes: a base having a bottom face and a lateral part surrounding the bottom face and extending upwards from the bottom face, wherein the lateral part has an uppermost face and includes a first stepped portion including a first upper face and a second stepped portion including a second upper face, wherein the first upper face and the second upper face are disposed below the uppermost face, wherein the first upper face and the second upper face are disposed inward of the uppermost face in a top view, and wherein a height of the first stepped portion from the bottom face is lower than a height of the second stepped portion from the bottom face; a semiconductor laser element disposed on the bottom face; and a light reflective member and/or an optical member disposed on the bottom face.