公开(公告)号：US11980974B2

公开(公告)日：2024-05-14

申请号：US17294379

申请日：2019-10-31

Applicant: NIHON SUPERIOR CO., LTD. ,  The University of Queensland

Inventor： Kazuhiro Nogita ,  Stuart David Mcdonald ,  Shiqian Liu ,  Tetsuro Nishimura ,  Takatoshi Nishimura ,  Tetsuya Akaiwa

IPC: B23K35/26 ,  B23K1/19 ,  C22C28/00

CPC classification number: B23K35/26 ,  B23K1/19 ,  C22C28/00

Abstract: In a method for manufacturing a solder joint part, at least one of a first metal base material and a second metal base material is an alloy containing Ni in an amount of more than 0 wt % and less than 44 wt % and Cu in an amount of more than 56 wt %, and solder is a solder alloy containing Ga and inevitable impurities or a solder alloy containing Ga as a main component and having a melting point of 30° C. or lower. The method includes applying the solder to a surface of the first metal base material and placing the second metal base material on the applied solder, and heating the first and second metal base materials to a temperature of 90° C. or lower in a specified atmosphere or in a liquid to generate CuGa2 or (Cu, Ni)Ga2 between the first and second metal base materials, thereby joining the first and second metal material.

公开(公告)号：US10286497B2

公开(公告)日：2019-05-14

申请号：US14901638

申请日：2015-04-28

Applicant: NIHON SUPERIOR CO., LTD.

Inventor： Tetsuro Nishimura ,  Takatoshi Nishimura

IPC: C22C13/00 ,  C22C13/02 ,  B23K35/362 ,  B23K35/26 ,  H01R4/02 ,  B23K1/00 ,  B23K35/36 ,  B23K35/02

Abstract: Provided is a lead-free solder alloy and soldering capable of maintaining strong joining strength even in a high-temperature state after soldering and having high reliability and versatility. The lead-free solder alloy composition of the present invention has Sn—Cu—Ni as a basic composition, which includes 0.1 to 2.0 mass % of Cu, and 0.01 to 0.5 mass % of Ni, 0.1 to 5 mass % of Bi, and 76.0 to 99.5 mass % of Sn, such that it is possible to implement soldering with high reliability without decreasing joining strength of a soldered joint even in a state of being exposed to high temperature for a long time, as well as joining strength at the time of bonding.

公开(公告)号：US12172242B2

公开(公告)日：2024-12-24

申请号：US17297966

申请日：2019-11-29

Applicant: NIHON SUPERIOR CO., LTD.

Inventor： Takatoshi Nishimura ,  Tetsuro Nishimura ,  Tetsuya Akaiwa

IPC: C22C13/00 ,  B23K35/26 ,  B23K103/08

Abstract: A lead-free solder alloy includes Ag in an amount of 0.3 to 4.0% by mass, Cu in an amount of 0.1 to 2.0% by mass, Fe in an amount of 0.005 to 0.05% by mass, Ni in an amount of 0.01 to 0.5% by mass, Ga in an amount of 0.001 to 0.1% by mass, and Sn as the balance.