公开(公告)号：US20210225651A1

公开(公告)日：2021-07-22

申请号：US17225727

申请日：2021-04-08

申请人： NIKON CORPORATION

发明人： Hajime MITSUISHI ,  Isao SUGAYA ,  Minoru FUKUDA ,  Masaki TSUNODA ,  Hidehiro MAEDA ,  Ikuhiro KUWANO

IPC分类号： H01L21/18 ,  B23K20/00 ,  H01L21/50 ,  H01L21/67 ,  H01L21/68 ,  H01L21/683 ,  H01L21/02 ,  H01L21/687

摘要： A method for bonding a first substrate and a second substrate includes: forming a protrusion at a partial region of the first substrate; measuring a position of the first substrate after the protrusion is formed in the first substrate; and bonding the first substrate and the second substrate by contacting the protrusion of the first substrate with a surface of the second substrate to form a contact region and enlarging the contact region.