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公开(公告)号：US11652132B2
公开(公告)日：2023-05-16
申请号：US17345929
申请日：2021-06-11
发明人： Mingzhu Wang , Nan Guo , Jingfei He , Zhenyu Chen , Bojie Zhao , Takehiko Tanaka , Feifan Chen , Ye Wu , Zhen Huang , Zhongyu Luan
CPC分类号： H01L27/14683 , H01L27/14618 , H04N23/55 , H05K1/0274 , H05K1/181 , H05K3/0052 , H05K3/284 , H04N23/57 , H05K2201/10121 , H05K2201/10151 , H05K2203/1316
摘要： A method for manufacturing semiconductor modules for image-sensing devices is disclosed. The method may comprise applying a removable layer on a first surface of a printed circuit board (PCB) which comprises a plurality of PCB units; mounting a photosensitive member to a second surface of each of the PCB units; and encapsulating the photosensitive member with an encapsulation layer on each PCB unit. Each PCB unit may comprise at least a semiconductor component on a second surface of the PCB and one or more opening across the first surface and the second surface. The photosensitive member and the removable layer separate the one or more opening from outside, and the photosensitive member is positioned to receive light through the opening. At least one semiconductor component is also encapsulated by the encapsulation layer on each PCB unit.
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公开(公告)号：US20210305308A1
公开(公告)日：2021-09-30
申请号：US17345929
申请日：2021-06-11
发明人： Mingzhu Wang , Nan Guo , Jingfei He , Zhenyu Chen , Bojie Zhao , Takehiko Tanaka , Feifan Chen , Ye Wu , Zhen Huang , Zhongyu Luan
摘要： A method for manufacturing semiconductor modules for image-sensing devices is disclosed. The method may comprise applying a removable layer on a first surface of a printed circuit board (PCB) which comprises a plurality of PCB units; mounting a photosensitive member to a second surface of each of the PCB units; and encapsulating the photosensitive member with an encapsulation layer on each PCB unit. Each PCB unit may comprise at least a semiconductor component on a second surface of the PCB and one or more opening across the first surface and the second surface. The photosensitive member and the removable layer separate the one or more opening from outside, and the photosensitive member is positioned to receive light through the opening. At least one semiconductor component is also encapsulated by the encapsulation layer on each PCB unit.
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公开(公告)号：US12119361B2
公开(公告)日：2024-10-15
申请号：US18207357
申请日：2023-06-08
发明人： Mingzhu Wang , Nan Guo , Zhenyu Chen , Takehiko Tanaka , Jingfei He , Zhen Huang , Zhongyu Luan , Feifan Chen
CPC分类号： H01L27/14618 , H01L27/14627 , H01L27/14683 , H04M1/0264 , H04N23/51 , H04N23/54 , H04N23/57 , H05K1/181 , H05K2201/10121
摘要： A camera module is provided, including a circuit board, a photosensitive element, an optical lens, and a filter element. The circuit board includes a substrate having a substrate front surface, a substrate back surface, and a substrate channel. The substrate front surface and the substrate back surface correspond to each other, and the substrate channel extends from the substrate front surface to the substrate back surface. The photosensitive element has a photosensitive area and a non-photosensitive area surrounding the photosensitive area. A first part of the non-photosensitive area is mounted on the back surface substrate. The photosensitive element and the substrate are conductively connected. The photosensitive area and a second part of the non-photosensitive area correspond to the substrate channel. The optical lens is held in a photosensitive path of the photosensitive element. The filter element is directly mounted on the substrate front surface of the substrate.
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公开(公告)号：US11721709B2
公开(公告)日：2023-08-08
申请号：US17550733
申请日：2021-12-14
发明人： Mingzhu Wang , Nan Guo , Zhenyu Chen , Takehiko Tanaka , Jingfei He , Zhen Huang , Zhongyu Luan , Feifan Chen
CPC分类号： H01L27/14618 , H01L27/14627 , H01L27/14683 , H04M1/0264 , H04N23/51 , H04N23/54 , H04N23/57 , H05K1/181 , H05K2201/10121
摘要： A camera module and a molded circuit board assembly thereof, a semi-finished product of the molded circuit board assembly, and an array camera module and a molded circuit board assembly thereof, as well as a manufacturing method and an electronic device, wherein the camera module comprises at least one optical lens, at least one back surface molded portion, at least one photosensitive element and a circuit board. The circuit board comprises at least one substrate and at least one electronic component that is conductively connected to the substrate; a part of the non-photosensitive area of the photosensitive element is attached to the substrate back surface of the substrate, and the photosensitive area and another part of the non-photosensitive area of the photosensitive element correspond to a substrate channel of the substrate; the back surface molded portion is integrally bonded to at least one part of the area of the substrate back surface of the substrate; and the optical lens is held in the photosensitive path of the photosensitive element.
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5.发明授权公开(公告)号：US11233079B2
公开(公告)日：2022-01-25
申请号：US16613571
申请日：2018-05-18
发明人： Mingzhu Wang , Nan Guo , Zhenyu Chen , Takehiko Tanaka , Jingfei He , Zhen Huang , Zhongyu Luan , Feifan Chen
IPC分类号： H01L27/146 , H04M1/02 , H04N5/225 , H05K1/18
摘要： A camera module and a molded circuit board assembly thereof, a semi-finished product of the molded circuit board assembly, and an array camera module and a molded circuit board assembly thereof, as well as a manufacturing method and an electronic device, wherein the camera module comprises at least one optical lens, at least one back surface molded portion, at least one photosensitive element and a circuit board. The circuit board comprises at least one substrate and at least one electronic component that is conductively connected to the substrate; a part of the non-photosensitive area of the photosensitive element is attached to the substrate back surface of the substrate, and the photosensitive area and another part of the non-photosensitive area of the photosensitive element correspond to a substrate channel of the substrate; the back surface molded portion is integrally bonded to at least one part of the area of the substrate back surface of the substrate; and the optical lens is held in the photosensitive path of the photosensitive element.
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公开(公告)号：US11049898B2
公开(公告)日：2021-06-29
申请号：US15617843
申请日：2017-06-08
发明人： Mingzhu Wang , Nan Guo , Jingfei He , Zhenyu Chen , Bojie Zhao , Takehiko Tanaka , Feifan Chen , Ye Wu , Zhen Huang , Zhongyu Luan
摘要： A method for manufacturing semiconductor modules for image-sensing devices is disclosed. The method may comprise applying a removable layer on a first surface of a printed circuit board (PCB) which comprises a plurality of PCB units; mounting a photosensitive member to a second surface of each of the PCB units; and encapsulating the photosensitive member with an encapsulation layer on each PCB unit. Each PCB unit may comprise at least a semiconductor component on a second surface of the PCB and one or more opening across the first surface and the second surface. The photosensitive member and the removable layer separate the one or more opening from outside, and the photosensitive member is positioned to receive light through the opening. At least one semiconductor component is also encapsulated by the encapsulation layer on each PCB unit.
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公开(公告)号：US20180286913A1
公开(公告)日：2018-10-04
申请号：US15617843
申请日：2017-06-08
发明人： Mingzhu Wang , Nan Guo , Jingfei He , Zhenyu Chen , Bojie Zhao , Takehiko Tanaka , Feifan Chen , Ye Wu , Zhen Huang , Zhongyu Luan
摘要： A method for manufacturing semiconductor modules for image-sensing devices is disclosed. The method may comprise applying a removable layer on a first surface of a printed circuit board (PCB) which comprises a plurality of PCB units; mounting a photosensitive member to a second surface of each of the PCB units; and encapsulating the photosensitive member with an encapsulation layer on each PCB unit. Each PCB unit may comprise at least a semiconductor component on a second surface of the PCB and one or more opening across the first surface and the second surface. The photosensitive member and the removable layer separate the one or more opening from outside, and the photosensitive member is positioned to receive light through the opening. At least one semiconductor component is also encapsulated by the encapsulation layer on each PCB unit.
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