公开(公告)号：US20200347226A1

公开(公告)日：2020-11-05

申请号：US16960451

申请日：2019-01-09

申请人： NISSAN CHEMICAL CORPORATION

发明人： Takuya OHASHI ,  Yosuke IINUMA ,  Hayato HATTORI ,  Yuki USUI ,  Kazuhiro SAWADA

IPC分类号： C08L79/08 ,  C08K5/205 ,  C08K5/31 ,  C08K5/3445 ,  C08K5/00

摘要： A resin composition which is for an insulating film and from which a cured product having a further reduced dielectric constant and dielectric loss tangent is obtained; a photosensitive resin composition; a method for producing a cured relief pattern using the photosensitive resin composition; and a semiconductor device with the cured relief pattern. This resin composition for an insulating film includes: a polyimide precursor; and a compound which is a polyimide precursor containing a polyamic acid ester, a thermal imidization accelerator, and a solvent, wherein the thermal imidization accelerator has a carboxyl group and an amino group or imino group which is deprotected by heat and exhibits basicity, and does not accelerate the imidization of the polyimide precursor before the protective group is released. Furthermore, a photosensitive resin composition which is for an insulating film and includes a photopolymerization initiator.