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公开(公告)号：US20200347226A1
公开(公告)日：2020-11-05
申请号：US16960451
申请日：2019-01-09
发明人： Takuya OHASHI , Yosuke IINUMA , Hayato HATTORI , Yuki USUI , Kazuhiro SAWADA
IPC分类号： C08L79/08 , C08K5/205 , C08K5/31 , C08K5/3445 , C08K5/00
摘要： A resin composition which is for an insulating film and from which a cured product having a further reduced dielectric constant and dielectric loss tangent is obtained; a photosensitive resin composition; a method for producing a cured relief pattern using the photosensitive resin composition; and a semiconductor device with the cured relief pattern. This resin composition for an insulating film includes: a polyimide precursor; and a compound which is a polyimide precursor containing a polyamic acid ester, a thermal imidization accelerator, and a solvent, wherein the thermal imidization accelerator has a carboxyl group and an amino group or imino group which is deprotected by heat and exhibits basicity, and does not accelerate the imidization of the polyimide precursor before the protective group is released. Furthermore, a photosensitive resin composition which is for an insulating film and includes a photopolymerization initiator.
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公开(公告)号：US20230343629A1
公开(公告)日：2023-10-26
申请号：US18023184
申请日：2021-08-20
发明人： Takahisa OKUNO , Yuki USUI , Hiroto OGATA , Shunsuke MORIYA , Masaki YANAI , Tetsuya SHINJO
IPC分类号： H01L21/683 , C09J7/40 , C09J183/04
CPC分类号： H01L21/6835 , C09J7/405 , C09J183/04 , C09J2203/326 , C09J2301/312 , H01L2221/68327 , H01L2221/6839
摘要： The laminate of the invention has a semiconductor substrate, a support substrate, a release layer disposed so as to come into contact with the semiconductor substrate, and an adhesive layer disposed between the support substrate and the release layer, characterized in that the release layer is a film formed from a releasing agent composition containing a polyorganosiloxane component essentially containing polydimethylsiloxane; the polyorganosiloxane component has a viscosity of 5.50 × 103 Pa·s to 0.75 × 103 Pa·s, as measured at 25° C.; and the film has a thickness of 0.01 µm to 4.90 µm.
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公开(公告)号：US20240352281A1
公开(公告)日：2024-10-24
申请号：US18292056
申请日：2022-07-14
发明人： Takahisa OKUNO , Yuki USUI , Tetsuya SHINJO
IPC分类号： C09J5/06 , C09J5/04 , C09J7/10 , C09J183/06 , H01L21/683
CPC分类号： C09J5/06 , C09J5/04 , C09J7/10 , C09J183/06 , H01L21/6835 , C09J2203/326 , C09J2301/208 , C09J2301/304 , C09J2301/408 , C09J2301/502 , H01L2221/68318 , H01L2221/6834 , H01L2221/68381
摘要： A method of manufacturing a laminate includes forming a first adhesive coating layer on a surface of a support substrate; forming a second adhesive coating layer on a surface of a semiconductor substrate; and bonding the first and second adhesive coating layer, followed by heating, to form an adhesive layer from the first adhesive coating layer and the second adhesive coating layer, wherein the first adhesive coating layer is formed from a first adhesive composition, the second adhesive coating layer is formed from a second adhesive composition, and one of the first adhesive composition and the second adhesive composition contains a first thermosetting component and a second thermosetting component that reacts with the first thermosetting component in the presence of a catalyst, and the other contains the catalyst, and at least one of the first adhesive composition and the second adhesive composition contains a release agent component.
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4.发明申请公开(公告)号：US20200041905A1
公开(公告)日：2020-02-06
申请号：US16340212
申请日：2017-10-03
发明人： Mamoru TAMURA , Hiroto OGATA , Yuki USUI , Takahiro KISHIOKA
IPC分类号： G03F7/11 , C07C235/16 , C08G59/52 , G03F7/20
摘要： A resist underlayer film-forming composition capable of providing a resist underlayer film exerting a sufficient anti-reflection function particularly in a KrF process, a high solvent resistance and a high dry etching speed, and enables the formation of a photoresist pattern having a good cross-sectional shape. The composition includes a copolymer containing: structural unit (A) derived from a diepoxy compound; and structural unit (B) derived from a compound represented by formula (1) [wherein: A represents a benzene or cyclohexane ring; X represents a hydrogen atom, alkyl or alkoxy group having 1 to 10 carbon atoms and optionally substituted by a halogen atom, or an alkoxycarbonyl group having 2 to 11 carbon atoms; and Y represents —COOH or -L-NHCO—Z—COOH (wherein: Z represents an alkylene group having 3 to 10 carbon atoms and optionally substituted by an oxygen atom, sulfur atom or nitrogen atom; and L represents a single bond or a spacer)].
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5.发明公开公开(公告)号：US20240199918A1
公开(公告)日：2024-06-20
申请号：US18285093
申请日：2022-03-22
发明人： Yuki USUI , Takahisa OKUNO , Masaki YANAI , Tetsuya SHINJO
IPC分类号： C09J5/06 , B32B7/06 , B32B7/12 , B32B17/06 , B32B37/06 , B32B37/12 , B32B43/00 , C09J161/34 , C09J183/04 , H01L21/304 , H01L21/683 , H01L21/768
CPC分类号： C09J5/06 , B32B7/06 , B32B7/12 , B32B17/06 , B32B37/06 , B32B37/1284 , B32B43/006 , C09J161/34 , C09J183/04 , H01L21/6835 , B32B2255/26 , B32B2307/748 , B32B2313/00 , B32B2315/08 , B32B2457/14 , C09J2461/00 , C09J2483/00 , H01L21/304 , H01L21/76898
摘要： An adhesive composition, wherein the adhesive composition is applied to obtain an adhesive coating layer having a complex viscosity of 10 Pa·s or more and 10,000 Pa·s or less at 25° C. or more and 100° C. or less, and the adhesive coating layer has a viscosity reduction rate of 80% or less determined by the following formula (1):
Viscosity reduction rate (%)=((V25−V100)/V25)×100 Formula (1)
wherein
V25: Complex viscosity at 25° C., and
V100: Complex viscosity at 100° C.-
公开(公告)号：US20230250314A1
公开(公告)日：2023-08-10
申请号：US18015659
申请日：2021-07-20
发明人： Takahiro KISHIOKA , Yuki USUI , Shunsuke MORIYA
IPC分类号： C09D201/06 , H01L21/56
CPC分类号： C09D201/06 , H01L21/568 , H01L2221/68386
摘要： A simple method for removing foreign substances that are formed on a substrate during a semiconductor device production process and a composition for forming a coating film for foreign substance removal, said coating film being used in the above-described method. A composition for forming a coating film for foreign substance removal, said composition containing a polymer and a solvent and being capable of forming a coating film that dissolves in a developer liquid, wherein: the polymer is selected from among phenolic novolacs, polyhydroxystyrene derivatives and carboxylic acid-containing polymers; and the polymer is contained in an amount of 50% by mass or more relative to the total solid content in the composition.
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公开(公告)号：US20210130788A1
公开(公告)日：2021-05-06
申请号：US16629494
申请日：2018-07-09
发明人： Hiromi KITANO , Tadashi NAKAJI , Yuki USUI , Taito NISHINO , Takahiro KISHIOKA
IPC分类号： C12N5/0775 , B01J20/32 , C12M1/00 , C08F220/40 , C09D133/10 , C08F220/36 , C09D133/14
摘要： Provided are a ligand-bearing substrate which has a surface at least partially coated with a polymer (P3) containing structural units represented by the formulae (1a) and (1b) (in the formulae, R1, R2, X, Y, L, Q1, Q2, Q3, m1, m2 and n are as described in the claims and description); a raw material for such a substrate; and a method for producing such substrates.
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公开(公告)号：US20240363387A1
公开(公告)日：2024-10-31
申请号：US18291845
申请日：2022-07-14
发明人： Takahisa OKUNO , Yuki USUI , Tetsuya SHINJO
IPC分类号： H01L21/683 , C09J5/04 , C09J5/06 , C09J183/04 , H01L21/67
CPC分类号： H01L21/6836 , C09J5/04 , C09J5/06 , C09J183/04 , H01L21/67092 , C09J2203/326 , C09J2301/304 , C09J2301/408 , C09J2301/416 , C09J2301/502 , C09J2425/005 , H01L2221/68318 , H01L2221/68386
摘要： A method of manufacturing a laminate that includes forming a first adhesive coating layer on a surface of a release agent coating layer formed on a surface of a support substrate; forming a second adhesive coating layer on a surface of a semiconductor substrate; and bonding the first adhesive coating layer and the second adhesive coating layer, followed by heating, to form a release layer and an adhesive layer, wherein the first adhesive coating layer is formed from a first adhesive composition, the second adhesive coating layer is formed from a second adhesive composition, and one of the first adhesive composition and the second adhesive composition contains a first thermosetting component and a second thermosetting component that reacts with the first thermosetting component in the presence of a catalyst, and the other contains the catalyst.
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公开(公告)号：US20190163064A1
公开(公告)日：2019-05-30
申请号：US16098379
申请日：2017-04-21
发明人： Tomoya OHASHI , Hiroto OGATA , Yuto HASHIMOTO , Yuki USUI , Yasushi SAKAIDA , Takahiro KISHIOKA
IPC分类号： G03F7/11 , C09D175/04 , G03F7/16 , G03F7/20 , G03F7/32 , C08G18/62 , C08G18/48 , C08G18/40 , H01L21/306 , H01L21/308 , H01L21/3213 , H01L21/027
摘要： A composition for forming a protective film against basic aqueous hydrogen peroxide solution, including a crosslinker having, in one molecule, two or more groups at least one selected from the group consisting of a glycidyl group, a terminal epoxy group, an epoxycyclopentyl group, an epoxycyclohexyl group, an oxetanyl group, a vinyl ether group, an isocyanate group, and a blocked isocyanate, a compound having a group of Formula (1): (wherein X1 is a substituent reacting with the crosslinker, R0 is a direct bond or a C1-2 alkylene group, X2 is a C1-2 alkyl group, C1-2 alkoxy group, or fluoro group, a is an integer of 0-2, b is an integer of 1-3, c is an integer of 0-4, and b and c satisfy a relational expression of 1≤(b+c)≤5) on a side chain or a terminal and having a weight average molecular weight of 800 or more, and an organic solvent.
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10.发明申请公开(公告)号：US20190086806A1
公开(公告)日：2019-03-21
申请号：US16088440
申请日：2017-03-29
发明人： Yuki USUI , Takahiro KISHIOKA , Yasushi SAKAIDA , Hiroto OGATA
IPC分类号： G03F7/11 , C08L63/00 , C08K5/3445 , C08K5/00
摘要： The invention provides a resist underlayer film forming composition which contains a compound having a glycoluril skeleton and which prevents collapse of a resist pattern formed on a substrate in a lithography process during semiconductor production; a resist underlayer film which uses this composition; and a method for producing a semiconductor device. The compound is of formula (1-1), wherein each of R1-R4 represents a C2-C10 alkyl group wherein a hydrogen atom is substituted by at least one substituent selected from the group consisting of a hydroxy group, a thiol group, a carboxyl group, C1-C5 alkoxyethyl groups, C1-C5 alkylsulfanyl groups and organic groups containing an ester bond, or a C2-C10 alkenyl group; the R1-R4 moieties may be the same as or different from each other; and each of R5 and R6 represents a hydrogen atom or a group selected from among C1-C10 alkyl groups and a phenyl group.
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