公开(公告)号：US20230343629A1

公开(公告)日：2023-10-26

申请号：US18023184

申请日：2021-08-20

Applicant: NISSAN CHEMICAL CORPORATION

Inventor： Takahisa OKUNO ,  Yuki USUI ,  Hiroto OGATA ,  Shunsuke MORIYA ,  Masaki YANAI ,  Tetsuya SHINJO

IPC: H01L21/683 ,  C09J7/40 ,  C09J183/04

CPC classification number: H01L21/6835 ,  C09J7/405 ,  C09J183/04 ,  C09J2203/326 ,  C09J2301/312 ,  H01L2221/68327 ,  H01L2221/6839

Abstract: The laminate of the invention has a semiconductor substrate, a support substrate, a release layer disposed so as to come into contact with the semiconductor substrate, and an adhesive layer disposed between the support substrate and the release layer, characterized in that the release layer is a film formed from a releasing agent composition containing a polyorganosiloxane component essentially containing polydimethylsiloxane; the polyorganosiloxane component has a viscosity of 5.50 × 103 Pa·s to 0.75 × 103 Pa·s, as measured at 25° C.; and the film has a thickness of 0.01 µm to 4.90 µm.

公开(公告)号：US20250092292A1

公开(公告)日：2025-03-20

申请号：US18726583

申请日：2022-12-20

Applicant: NISSAN CHEMICAL CORPORATION

Inventor： Yuki USUI ,  Takahisa OKUNO ,  Masaki YANAI ,  Tetsuya SHINJO

IPC: C09J183/14 ,  C09J7/35

Abstract: Provided is an adhesive composition including: a reaction product (X) of a solid polymer (x1) having a first functional group and a liquid chain compound (x2) having, at a chain terminal, a second functional group capable of reacting with the first functional group, the reaction product (X) having the first functional group or the second functional group; and a liquid crosslinking agent (Y) having the first functional group or the second functional group, provided that when the reaction product (X) has the first functional group, the liquid crosslinking agent (Y) has the second functional group, and when the reaction product (X) has the second functional group, the liquid crosslinking agent (Y) has the first functional group.

公开(公告)号：US20200347226A1

公开(公告)日：2020-11-05

申请号：US16960451

申请日：2019-01-09

Applicant: NISSAN CHEMICAL CORPORATION

Inventor： Takuya OHASHI ,  Yosuke IINUMA ,  Hayato HATTORI ,  Yuki USUI ,  Kazuhiro SAWADA

IPC: C08L79/08 ,  C08K5/205 ,  C08K5/31 ,  C08K5/3445 ,  C08K5/00

Abstract: A resin composition which is for an insulating film and from which a cured product having a further reduced dielectric constant and dielectric loss tangent is obtained; a photosensitive resin composition; a method for producing a cured relief pattern using the photosensitive resin composition; and a semiconductor device with the cured relief pattern. This resin composition for an insulating film includes: a polyimide precursor; and a compound which is a polyimide precursor containing a polyamic acid ester, a thermal imidization accelerator, and a solvent, wherein the thermal imidization accelerator has a carboxyl group and an amino group or imino group which is deprotected by heat and exhibits basicity, and does not accelerate the imidization of the polyimide precursor before the protective group is released. Furthermore, a photosensitive resin composition which is for an insulating film and includes a photopolymerization initiator.

公开(公告)号：US20240199918A1

公开(公告)日：2024-06-20

申请号：US18285093

申请日：2022-03-22

Applicant: NISSAN CHEMICAL CORPORATION

Inventor： Yuki USUI ,  Takahisa OKUNO ,  Masaki YANAI ,  Tetsuya SHINJO

IPC: C09J5/06 ,  B32B7/06 ,  B32B7/12 ,  B32B17/06 ,  B32B37/06 ,  B32B37/12 ,  B32B43/00 ,  C09J161/34 ,  C09J183/04 ,  H01L21/304 ,  H01L21/683 ,  H01L21/768

CPC classification number: C09J5/06 ,  B32B7/06 ,  B32B7/12 ,  B32B17/06 ,  B32B37/06 ,  B32B37/1284 ,  B32B43/006 ,  C09J161/34 ,  C09J183/04 ,  H01L21/6835 ,  B32B2255/26 ,  B32B2307/748 ,  B32B2313/00 ,  B32B2315/08 ,  B32B2457/14 ,  C09J2461/00 ,  C09J2483/00 ,  H01L21/304 ,  H01L21/76898

Abstract: An adhesive composition, wherein the adhesive composition is applied to obtain an adhesive coating layer having a complex viscosity of 10 Pa·s or more and 10,000 Pa·s or less at 25° C. or more and 100° C. or less, and the adhesive coating layer has a viscosity reduction rate of 80% or less determined by the following formula (1):


Viscosity reduction rate (%)=((V25−V100)/V25)×100  Formula (1)



wherein
V25: Complex viscosity at 25° C., and
V100: Complex viscosity at 100° C.

公开(公告)号：US20230250314A1

公开(公告)日：2023-08-10

申请号：US18015659

申请日：2021-07-20

Applicant: NISSAN CHEMICAL CORPORATION

Inventor： Takahiro KISHIOKA ,  Yuki USUI ,  Shunsuke MORIYA

IPC: C09D201/06 ,  H01L21/56

CPC classification number: C09D201/06 ,  H01L21/568 ,  H01L2221/68386

Abstract: A simple method for removing foreign substances that are formed on a substrate during a semiconductor device production process and a composition for forming a coating film for foreign substance removal, said coating film being used in the above-described method. A composition for forming a coating film for foreign substance removal, said composition containing a polymer and a solvent and being capable of forming a coating film that dissolves in a developer liquid, wherein: the polymer is selected from among phenolic novolacs, polyhydroxystyrene derivatives and carboxylic acid-containing polymers; and the polymer is contained in an amount of 50% by mass or more relative to the total solid content in the composition.

公开(公告)号：US20210130788A1

公开(公告)日：2021-05-06

申请号：US16629494

申请日：2018-07-09

Applicant: NATIONAL UNIVERSITY CORPORATION UNIVERSITY OF TOYAMA ,  NISSAN CHEMICAL CORPORATION

Inventor： Hiromi KITANO ,  Tadashi NAKAJI ,  Yuki USUI ,  Taito NISHINO ,  Takahiro KISHIOKA

IPC: C12N5/0775 ,  B01J20/32 ,  C12M1/00 ,  C08F220/40 ,  C09D133/10 ,  C08F220/36 ,  C09D133/14

Abstract: Provided are a ligand-bearing substrate which has a surface at least partially coated with a polymer (P3) containing structural units represented by the formulae (1a) and (1b) (in the formulae, R1, R2, X, Y, L, Q1, Q2, Q3, m1, m2 and n are as described in the claims and description); a raw material for such a substrate; and a method for producing such substrates.

公开(公告)号：US20250084291A1

公开(公告)日：2025-03-13

申请号：US18686993

申请日：2022-08-24

Applicant: NISSAN CHEMICAL CORPORATION

Inventor： Takahisa OKUNO ,  Yuki USUI ,  Masaki YANAI ,  Tetsuya SHINJO

IPC: C09J183/06 ,  B32B7/12 ,  B32B43/00 ,  H01L21/683

Abstract: A laminate including: a semiconductor substrate; a support substrate; and an adhesive layer provided between the semiconductor substrate and the support substrate, wherein the adhesive layer is formed from a cured product of an adhesive composition, the adhesive composition contains a polyorganosiloxane that has an alkenyl group having 2 to 40 carbon atoms and bonded to a silicon atom, a polyorganosiloxane having a Si—H group, a platinum group metal-based catalyst, and a crosslinking inhibitor, and the crosslinking inhibitor contains at least one of a pyridine ring-containing compound and a phosphorus-containing organic compound.

公开(公告)号：US20240352281A1

公开(公告)日：2024-10-24

申请号：US18292056

申请日：2022-07-14

Applicant: NISSAN CHEMICAL CORPORATION

Inventor： Takahisa OKUNO ,  Yuki USUI ,  Tetsuya SHINJO

IPC: C09J5/06 ,  C09J5/04 ,  C09J7/10 ,  C09J183/06 ,  H01L21/683

CPC classification number: C09J5/06 ,  C09J5/04 ,  C09J7/10 ,  C09J183/06 ,  H01L21/6835 ,  C09J2203/326 ,  C09J2301/208 ,  C09J2301/304 ,  C09J2301/408 ,  C09J2301/502 ,  H01L2221/68318 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: A method of manufacturing a laminate includes forming a first adhesive coating layer on a surface of a support substrate; forming a second adhesive coating layer on a surface of a semiconductor substrate; and bonding the first and second adhesive coating layer, followed by heating, to form an adhesive layer from the first adhesive coating layer and the second adhesive coating layer, wherein the first adhesive coating layer is formed from a first adhesive composition, the second adhesive coating layer is formed from a second adhesive composition, and one of the first adhesive composition and the second adhesive composition contains a first thermosetting component and a second thermosetting component that reacts with the first thermosetting component in the presence of a catalyst, and the other contains the catalyst, and at least one of the first adhesive composition and the second adhesive composition contains a release agent component.

公开(公告)号：US20200041905A1

公开(公告)日：2020-02-06

申请号：US16340212

申请日：2017-10-03

Applicant: NISSAN CHEMICAL CORPORATION

Inventor： Mamoru TAMURA ,  Hiroto OGATA ,  Yuki USUI ,  Takahiro KISHIOKA

IPC: G03F7/11 ,  C07C235/16 ,  C08G59/52 ,  G03F7/20

Abstract: A resist underlayer film-forming composition capable of providing a resist underlayer film exerting a sufficient anti-reflection function particularly in a KrF process, a high solvent resistance and a high dry etching speed, and enables the formation of a photoresist pattern having a good cross-sectional shape. The composition includes a copolymer containing: structural unit (A) derived from a diepoxy compound; and structural unit (B) derived from a compound represented by formula (1) [wherein: A represents a benzene or cyclohexane ring; X represents a hydrogen atom, alkyl or alkoxy group having 1 to 10 carbon atoms and optionally substituted by a halogen atom, or an alkoxycarbonyl group having 2 to 11 carbon atoms; and Y represents —COOH or -L-NHCO—Z—COOH (wherein: Z represents an alkylene group having 3 to 10 carbon atoms and optionally substituted by an oxygen atom, sulfur atom or nitrogen atom; and L represents a single bond or a spacer)].

公开(公告)号：US20250002685A1

公开(公告)日：2025-01-02

申请号：US18687017

申请日：2022-08-24

Applicant: NISSAN CHEMICAL CORPORATION

Inventor： Takahisa OKUNO ,  Yuki USUI ,  Masaki YANAI ,  Tetsuya SHINJO

IPC: C08K5/3437 ,  C08K5/50 ,  C08L83/04

Abstract: A thermosetting composition that includes a polyorganosiloxane that has an alkenyl group having 2 to 40 carbon atoms and bonded to a silicon atom, a polyorganosiloxane having a Si—H group, a platinum group metal-based catalyst, and a crosslinking inhibitor. The crosslinking inhibitor contains at least one of a compound represented by formula (1), where R1 to R8 each represents a hydrogen atom, specific groups, or the like, and a compound represented by formula (2), where R11 to R13 each independently represents a hydrocarbon group optionally having a substituent.