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1.发明公开公开(公告)号：US20240301263A1
公开(公告)日：2024-09-12
申请号：US18659315
申请日：2024-05-09
IPC分类号： C09J183/04 , B32B7/12 , B32B37/12 , B32B43/00 , C08G77/00 , C08G77/20 , C09J5/00 , H01L21/306 , H01L21/683
CPC分类号： C09J183/04 , B32B7/12 , B32B37/1207 , B32B43/006 , C08G77/20 , C09J5/00 , H01L21/6835 , B32B2457/14 , C08G77/70 , C08G77/80 , C09J2483/00 , H01L21/30625
摘要： An adhesive composition for use in debonding with infrared radiation, which composition can achieve debonding through irradiation with an infrared ray, the composition including a component (A) which is cured through hydrosilylation and a component (B) which is at least one species selected from the group consisting of a component containing an epoxy-modified polyorganosiloxane, a component containing a methyl group-containing polyorganosiloxane, and a component containing a phenyl group-containing polyorganosiloxane.
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公开(公告)号：US20190164802A1
公开(公告)日：2019-05-30
申请号：US16313370
申请日：2017-06-13
IPC分类号： H01L21/683 , C09J183/04 , C09J5/06 , H01L21/304 , H01L21/768
摘要： An adhesive can be easily peeled off after polishing the back face of a wafer, which has heat resistance and can be easily washed off. An adhesive for peelably adhering between a support and a circuit-bearing face of a wafer and thereby processing a back face of the wafer, a peeling face upon peeling becomes selectable according to heating from the support side or wafer side when the adhesive is cured. The adhesive includes a component (A) curing by hydrosilylation reaction and a component (B) containing a polydimethylsiloxane. A peeling method including forming an adhesion layer by applying the adhesive to a surface of a first substrate, bonding a surface of a second substrate to the adhesion layer, curing the adhesion layer by heating from the first substrate side to form a laminate, processing the laminate, and peeling off between the first substrate and the adhesion layer.
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公开(公告)号：US20230151307A1
公开(公告)日：2023-05-18
申请号：US17912979
申请日：2021-03-22
发明人： Hiroshi OGINO , Takahisa OKUNO , Masaki YANAI , Takuya FUKUDA , Hiroto OGATA , Shunsuke MORIYA , Tetsuya SHINJO , Kazuhiro SAWADA
CPC分类号： C11D7/5027 , H01L21/02057 , C11D11/0047
摘要： The present invention provides a semiconductor substrate cleaning method including a step of removing an adhesive layer provided on a semiconductor substrate by use of a remover composition which contains a solvent but no salt, the solvent containing a C8 to C10 linear-chain, saturated, aliphatic hydrocarbon compound. As the C8 to C10 linear-chain, saturated, aliphatic hydrocarbon compound, a linear-chain hydrocarbon compound is used.
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4.发明申请公开(公告)号：US20210130666A1
公开(公告)日：2021-05-06
申请号：US17052223
申请日：2019-04-23
IPC分类号： C09J183/04 , C09J11/06 , C09J5/04 , H01L21/683 , H01L21/304 , B32B7/06
摘要： A temporary adhesive without the formation of voids between a support and a wafer. A temporary adhesive for separatably attaching a support to a circuit side of a wafer to process a rear surface of the wafer, the temporary adhesive including a component (A) that is cured by a hydrosilylation reaction; a polymerization inhibitor (B) having a 5% mass decrease temperature of 80° C. or higher as measured using a Tg-DTA; and a solvent (C). The component (A) may include a polysiloxane (A1) including a polyorganosiloxane (a1) containing a C1-10 alkyl group and a C2-10 alkenyl group, and a polyorganosiloxane (a2) containing a C1-10 alkyl group and a hydrogen atom; and a platinum group metal-based catalyst (A2). The polymerization inhibitor (B) may be a compound of formula (1): (wherein R7 and R8 are each a C6-40 aryl group, or a combination of a C1-10 alkyl group and a C6-40 aryl group).
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公开(公告)号：US20200216731A1
公开(公告)日：2020-07-09
申请号：US16627993
申请日：2018-07-05
IPC分类号： C09J183/04 , H01L21/304 , H01L21/683 , C08G77/00 , C09J5/06
摘要： An adhesive for separatably attaching a support to a circuit side of a wafer to process a rear surface of the wafer, the adhesive including a component (A) that is cured by a hydrosilylation reaction and a component (B) containing a phenyl group-containing polyorganosiloxane, wherein a ratio in % by mass of the component (A) to the component (B) is 95:5 to 30:70. A separation method including applying the adhesive onto a first body to form an adhesion layer, attaching a second body to the adhesion layer, heating the adhesion layer from a side of the first body to cure the adhesive to form a layered body, processing the layered body, and carrying out separation between the adhesion layer, and the first and second bodies. The processing may be polishing the rear surface of the wafer.
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公开(公告)号：US20220025236A1
公开(公告)日：2022-01-27
申请号：US17297174
申请日：2019-11-26
发明人： Shunsuke MORIYA , Kazuhiro SAWADA , Tetsuya SHINJO
IPC分类号： C09J183/04 , H01L21/683
摘要： An adhesive composition for forming an adhesive layer that can bond a first substrate formed of a semiconductor-forming substrate to a second substrate formed of a support substrate in a peelable manner, the composition containing a component (A) which is cured through hydrosilylation and a peeling component (B) which contains a component containing an epoxy-modified polyorganosiloxane, wherein the component (A) contains a polysiloxane (A1) including a siloxane unit represented by SiO2 (unit Q) and the like, and a platinum group metal catalyst (A2); and the polysiloxane (A1) contains a polyorganosiloxane (a1) including a siloxane unit represented by SiO2 (unit Q′) and the like, and a polyorganosiloxane (a2) including a siloxane unit represented by SiO2 (unit Q″) and the like, and having a functional group (Si—H) content of 5.0 mol/kg or greater.
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公开(公告)号：US20220002591A1
公开(公告)日：2022-01-06
申请号：US17294129
申请日：2019-11-14
发明人： Kazuhiro SAWADA , Shunsuke MORIYA , Tetsuya SHINJO
IPC分类号： C09J5/04 , C09J183/04 , C09J169/00 , C09J125/06 , H01L21/683 , B32B7/12 , B32B43/00 , B32B37/12
摘要： A laminate debonding method includes producing a laminate by joining a first substrate formed of a semiconductor-forming substrate to a second substrate formed of a support substrate which allows passage of infrared laser light, by the mediation of a first adhesive layer provided on the first substrate and a second adhesive layer provided on the second substrate, wherein the first adhesive layer is obtained by curing an adhesive (A) containing a component which is cured through hydrosilylation, and the second adhesive layer is obtained by use of an adhesive (B) formed of a polymer adhesive having an aromatic ring in at least one of a main chain and a side chain and which allows passage of infrared laser light; and irradiating the laminate with infrared laser light from a second substrate side for debonding the second substrate at the interface between the first and second adhesive layers.
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公开(公告)号：US20220002602A1
公开(公告)日：2022-01-06
申请号：US17294144
申请日：2019-11-14
IPC分类号： C09J183/04 , C09J5/00 , C08G77/20 , B32B43/00 , B32B7/12 , B32B37/12 , H01L21/683
摘要： An adhesive composition for use in debonding with infrared radiation, which composition can achieve debonding through irradiation with an infrared ray, the composition including a component (A) which is cured through hydrosilylation and a component (B) which is at least one species selected from the group consisting of a component containing an epoxy-modified polyorganosiloxane, a component containing a methyl group-containing polyorganosiloxane, and a component containing a phenyl group-containing polyorganosiloxane.
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公开(公告)号：US20200347226A1
公开(公告)日：2020-11-05
申请号：US16960451
申请日：2019-01-09
发明人： Takuya OHASHI , Yosuke IINUMA , Hayato HATTORI , Yuki USUI , Kazuhiro SAWADA
IPC分类号： C08L79/08 , C08K5/205 , C08K5/31 , C08K5/3445 , C08K5/00
摘要： A resin composition which is for an insulating film and from which a cured product having a further reduced dielectric constant and dielectric loss tangent is obtained; a photosensitive resin composition; a method for producing a cured relief pattern using the photosensitive resin composition; and a semiconductor device with the cured relief pattern. This resin composition for an insulating film includes: a polyimide precursor; and a compound which is a polyimide precursor containing a polyamic acid ester, a thermal imidization accelerator, and a solvent, wherein the thermal imidization accelerator has a carboxyl group and an amino group or imino group which is deprotected by heat and exhibits basicity, and does not accelerate the imidization of the polyimide precursor before the protective group is released. Furthermore, a photosensitive resin composition which is for an insulating film and includes a photopolymerization initiator.
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