公开(公告)号：US20190211242A1

公开(公告)日：2019-07-11

申请号：US16329068

申请日：2017-08-25

申请人： NISSAN CHEMICAL CORPORATION

发明人： Takuya OHASHI ,  Tomoyuki ENOMOTO ,  Takahiro KISHIOKA

IPC分类号： C09J179/04 ,  C09J9/00 ,  G03F7/09

CPC分类号： C09J179/04 ,  C08F290/06 ,  C08F290/061 ,  C08F290/064 ,  C08F299/02 ,  C08G59/26 ,  C08G59/3236 ,  C08G73/0622 ,  C08G73/0638 ,  C08G73/0644 ,  C08G73/0655 ,  C08G75/045 ,  C08G85/004 ,  C08K5/101 ,  C08K5/14 ,  C09J9/00 ,  C09J11/06 ,  C09J163/00 ,  C09J163/06 ,  C09J163/10 ,  C09J167/00 ,  C09J167/07 ,  C09J171/08 ,  C09J2205/31 ,  G03F7/004 ,  G03F7/027 ,  G03F7/09

摘要： A novel photosensitive adhesive composition including the following components (A), (B), (C), and (D): Component (A): a polymer having a structural unit of the following formula (1) and a structure of the following formula (2) at a terminal, Component (B): a polymer having the structural unit of formula (1), and a carboxy group or hydroxy group at a terminal, Component (C): a radical photopolymerization initiator, and Component (D): a solvent, wherein the content by mass of the component (B) is larger than that of the component (A), (wherein X is a C1-6 alkyl group, a vinyl group, an allyl group, or a glycidyl group, m and n are each independently 0 or 1, Q is a divalent C1-16 hydrocarbon group, Z is a divalent C1-4 linking group, the divalent linking group being bonded to an —O— group in formula (1), and R1 is a hydrogen atom or a methyl group.)

公开(公告)号：US20200347226A1

公开(公告)日：2020-11-05

申请号：US16960451

申请日：2019-01-09

申请人： NISSAN CHEMICAL CORPORATION

发明人： Takuya OHASHI ,  Yosuke IINUMA ,  Hayato HATTORI ,  Yuki USUI ,  Kazuhiro SAWADA

IPC分类号： C08L79/08 ,  C08K5/205 ,  C08K5/31 ,  C08K5/3445 ,  C08K5/00

摘要： A resin composition which is for an insulating film and from which a cured product having a further reduced dielectric constant and dielectric loss tangent is obtained; a photosensitive resin composition; a method for producing a cured relief pattern using the photosensitive resin composition; and a semiconductor device with the cured relief pattern. This resin composition for an insulating film includes: a polyimide precursor; and a compound which is a polyimide precursor containing a polyamic acid ester, a thermal imidization accelerator, and a solvent, wherein the thermal imidization accelerator has a carboxyl group and an amino group or imino group which is deprotected by heat and exhibits basicity, and does not accelerate the imidization of the polyimide precursor before the protective group is released. Furthermore, a photosensitive resin composition which is for an insulating film and includes a photopolymerization initiator.

公开(公告)号：US20200209745A1

公开(公告)日：2020-07-02

申请号：US16643707

申请日：2018-08-29

申请人： NISSAN CHEMICAL CORPORATION

发明人： Takuya OHASHI ,  Naoya NISHIMURA ,  Masahisa ENDO ,  Takahiro KISHIOKA

IPC分类号： G03F7/038 ,  G03F7/028 ,  C08G73/12 ,  G03F7/16 ,  G03F7/20 ,  G03F7/38 ,  G03F7/32 ,  G03F7/40 ,  H01L21/027

摘要： A photosensitive resin composition which enables the achievement of a cured body that is further decreased in dielectric constant and dielectric loss tangent; a method for producing a cured relief pattern with use of this photosensitive resin composition; and a semiconductor device which is provided with this cured relief pattern. A negative photosensitive resin composition which contains 100 parts by mass of (A) a polyimide precursor that has a specific unit structure; and 0.1 to 20 parts by mass of (B) a radical photopolymerization initiator.