公开(公告)号：US20160237550A1

公开(公告)日：2016-08-18

申请号：US15026202

申请日：2014-10-10

Applicant: NITTO DENKO CORPORATION

Inventor： Tomotake NASHIKI ,  Akira HAMADA

IPC: C23C14/34

CPC classification number: C23C14/3407 ,  C23C14/3464 ,  C23C14/562

Abstract: A maintenance method for a sputtering device includes the steps of: moving a cathode carriage to take a plurality of targets and a plurality of cathodes out of a vacuum chamber; operating a plurality of cathode rotating apparatuses to rotate the targets and the cathodes so as to cause the targets to face upwards; operating a plurality of cathode sliding apparatuses to move the targets and the cathodes located in places at high height to places at low height; removing the targets from the cathodes to attach a plurality of new targets to the cathodes; returning the targets and the cathodes to an original height thereof; returning the targets and the cathodes to original rotation angles; and putting the targets and the cathodes back into the vacuum chamber.

Abstract translation: 溅射装置的维护方法包括以下步骤：移动阴极托架以将多个靶和多个阴极从真空室中取出; 操作多个阴极旋转装置以使目标和阴极旋转，以使目标朝上; 操作多个阴极滑动装置将位于高高度的位置的靶和阴极移动到低高度的位置; 从阴极去除目标以将多个新目标附着到阴极; 将目标和阴极返回到其原始高度; 将目标和阴极返回到原始旋转角度; 并将目标和阴极放回真空室。

公开(公告)号：US20160145740A1

公开(公告)日：2016-05-26

申请号：US15009387

申请日：2016-01-28

Applicant: NITTO DENKO CORPORATION

Inventor： Tomotake NASHIKI ,  Yoshimasa SAKATA ,  Hideo SUGAWARA ,  Kenkichi YAGURA ,  Akira HAMADA ,  Yoshihisa ITO ,  Kuniaki ISHIBASHI

IPC: C23C16/44 ,  C23C16/06 ,  C23C16/56

CPC classification number: C23C16/44 ,  C23C14/021 ,  C23C14/562 ,  C23C16/06 ,  C23C16/56 ,  Y10T428/31678

Abstract: The film formation method comprises the steps of: unrolling and feeding an elongated substrate wound in a roll form from a first roll chamber in a direction from the first roll chamber toward a second roll chamber, using a first surface as a surface for film formation; degassing the fed substrate; forming a first material film on the first surface of the degassed substrate in a first film formation chamber; forming a second material film on the first material film in a second film formation chamber; taking up the substrate in a roll form in the second roll chamber, the substrate having the material films formed thereon; unrolling and feeding the taken up substrate from the first roll chamber in the direction, using a second surface opposite the first surface of the substrate as a surface for film formation; and repeating all the above treatments.