公开(公告)号：US20160145740A1

公开(公告)日：2016-05-26

申请号：US15009387

申请日：2016-01-28

Applicant: NITTO DENKO CORPORATION

Inventor： Tomotake NASHIKI ,  Yoshimasa SAKATA ,  Hideo SUGAWARA ,  Kenkichi YAGURA ,  Akira HAMADA ,  Yoshihisa ITO ,  Kuniaki ISHIBASHI

IPC: C23C16/44 ,  C23C16/06 ,  C23C16/56

CPC classification number: C23C16/44 ,  C23C14/021 ,  C23C14/562 ,  C23C16/06 ,  C23C16/56 ,  Y10T428/31678

Abstract: The film formation method comprises the steps of: unrolling and feeding an elongated substrate wound in a roll form from a first roll chamber in a direction from the first roll chamber toward a second roll chamber, using a first surface as a surface for film formation; degassing the fed substrate; forming a first material film on the first surface of the degassed substrate in a first film formation chamber; forming a second material film on the first material film in a second film formation chamber; taking up the substrate in a roll form in the second roll chamber, the substrate having the material films formed thereon; unrolling and feeding the taken up substrate from the first roll chamber in the direction, using a second surface opposite the first surface of the substrate as a surface for film formation; and repeating all the above treatments.