CARBON NANOTUBE AGGREGATE
    1.
    发明申请

    公开(公告)号:US20200039826A1

    公开(公告)日:2020-02-06

    申请号:US16338905

    申请日:2017-08-14

    Abstract: Provided is a carbon nanotube aggregate excellent in gripping force. The carbon nanotube aggregate of the present invention is a carbon nanotube aggregate of a sheet shape, including a plurality of carbon nanotubes, wherein the carbon nanotube aggregate has a cohesive strength N of 3 nJ or more on a front surface and/or a back surface thereof, which is measured by a nanoindentation method with an indentation load of 500 μN.

    STRUCTURE
    2.
    发明申请

    公开(公告)号:US20210228475A1

    公开(公告)日:2021-07-29

    申请号:US17257247

    申请日:2019-04-10

    Inventor: Yohei MAENO

    Abstract: The present invention provides a structure suitable for controlling the release quantity of an active ingredient in a state where the structure is in contact with skin. A structure 10 according to the present invention includes a retention part 1 that retains an active ingredient, and a release control layer 3 that controls release of the active ingredient to an outside. In the structure 10, at least one of the following conditions holds: i) the release control layer 3 includes a microporous membrane having an average pore diameter of 0.01 μm or less; and ii) the release control layer 3 is a nanofiltration membrane or a reverse osmotic membrane.

    TRANSPORT FIXING JIG
    3.
    发明申请

    公开(公告)号:US20190071265A1

    公开(公告)日:2019-03-07

    申请号:US16084628

    申请日:2017-03-14

    Abstract: Provided is a transport fixing jig that has a high gripping force, hardly contaminates an object to be processed (object to be transported), and is excellent in heat resistance. The transport fixing jig of the present invention includes: a first base material; a carbon nanotube aggregate; and an adhesive layer arranged between the first base material and the carbon nanotube aggregate, wherein the first base material and the carbon nanotube aggregate are bonded to each other via the adhesive layer, and wherein a ratio (adhesive layer/base material) between a linear expansion coefficient of the first base material and a linear expansion coefficient of the adhesive layer is from 0.7 to 1.8.

    CARBON NANOTUBE AGGREGATE
    4.
    发明申请

    公开(公告)号:US20200048093A1

    公开(公告)日:2020-02-13

    申请号:US16338810

    申请日:2017-08-08

    Abstract: Provided is a carbon nanotube aggregate excellent in gripping force in a wide temperature range including high-temperature conditions. The carbon nanotube aggregate of the present invention is a carbon nanotube aggregate of a sheet shape, including a plurality of carbon nanotubes, wherein the carbon nanotube aggregate satisfies the following condition for FFM differential voltages when a frictional curve is obtained by scanning a front surface and/or a back surface of the carbon nanotube aggregate with a probe of a scanning probe microscope under a state in which the probe is brought into contact therewith: a ratio of an FFM differential voltage at 210° C. to an FFM differential voltage at 25° C. is from 0.3 to 5.

    CARBON NANOTUBE AGGREGATE
    5.
    发明申请

    公开(公告)号:US20190177165A1

    公开(公告)日:2019-06-13

    申请号:US16324759

    申请日:2017-07-28

    Abstract: Provided is a carbon nanotube aggregate that can maintain a sheet shape. The carbon nanotube aggregate of the present invention includes a plurality of carbon nanotubes, the carbon nanotube aggregate being formed into a sheet shape, wherein the carbon nanotube aggregate includes a non-aligned portion of the carbon nanotubes. In one embodiment, the carbon nanotube aggregate further includes an aligned portion of the carbon nanotubes. In one embodiment, the non-aligned portion is present at an end portion in a lengthwise direction of the carbon nanotube aggregate.

    MOUNTING MEMBER
    6.
    发明申请
    MOUNTING MEMBER 审中-公开

    公开(公告)号:US20190051550A1

    公开(公告)日:2019-02-14

    申请号:US16069934

    申请日:2017-01-10

    Abstract: Provided is a mounting member that is excellent in low dusting property and hardly contaminates an object to be mounted while being excellent in gripping force and heat resistance. The mounting member of the present invention includes an aggregate of carbon nanotubes for forming a mounting surface, wherein a ratio of a plan view area of recessed portions occurring in a carbon nanotube aggregate-side surface of the mounting member to a total area of the carbon nanotube aggregate-side surface is 5% or less.

    MOUNTING MEMBER
    8.
    发明申请
    MOUNTING MEMBER 审中-公开

    公开(公告)号:US20190035672A1

    公开(公告)日:2019-01-31

    申请号:US16069923

    申请日:2017-01-10

    Abstract: Provided is a mounting member that is excellent in low dusting property and hardly contaminates an object to be mounted while being excellent in gripping force and heat resistance. In one embodiment of the present invention, the mounting member includes an aggregate of carbon nanotubes for forming amounting surface, wherein a standard deviation of diameters of the carbon nanotubes is 3 nm or less. In one embodiment of the present invention, the mounting member includes an aggregate of carbon nanotubes for forming a mounting surface, wherein the aggregate of the carbon nanotubes includes carbon nanotubes each having a multi-walled structure, and wherein a standard deviation of wall numbers of the carbon nanotubes is 3 or less.

    MOUNTING MEMBER
    9.
    发明申请
    MOUNTING MEMBER 审中-公开

    公开(公告)号:US20190027395A1

    公开(公告)日:2019-01-24

    申请号:US16069942

    申请日:2017-01-10

    Abstract: Provided is a mounting member that is excellent in low dusting property and hardly contaminates an object to be mounted while being excellent in gripping force and heat resistance. The mounting member of the present invention includes an aggregate of carbon nanotubes for forming a mounting surface, wherein when the mounting member is placed on a silicon wafer so that a carbon nanotube aggregate-side surface thereof is brought into contact with the silicon wafer, and the resultant is left to stand for 30 seconds while a load of 100 g is applied from above the mounting member, a number of particles each having a diameter of 0.2 μm or more transferred onto the silicon wafer is 100 particles/cm2 or less.

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