摘要:
A foaming composition for filling contains a polymer, an organic peroxide, and azodicarbonamide, and a viscosity thereof measured at a temperature of 120° C. and under a pressure of 500 MPa with a flow tester is in a range of 1050 to 4950 Pa·s.
摘要:
The present invention provides a method of stripping multiple plies of a pressure-sensitive adhesive layer, capable of easily separating and dismantling the joint portion in a short time, without affecting the adherend involved. The stripping method of the present invention strips the multiple plies of a pressure-sensitive adhesive layer, including a pressure-sensitive adhesive body having at least a pressure-sensitive adhesive layer containing heat-expandable fine particles and an adherend, the pressure-sensitive adhesive body and the adherend being laminated on each other, and the multiple plies of a pressure-sensitive adhesive layer contain a coloring matter component, and the pressure-sensitive adhesive body and the adherend are stripped from each other, by irradiating the coloring matter with a laser light beam having a wavelength coinciding with the absorption wavelength of the coloring matter and by expanding the heat-expandable fine particles with the aid of the heat thus generated.
摘要:
A pressure-sensitive adhesive composition contains a butyl rubber. The pressure-sensitive adhesive composition has a shear storage elastic modulus G′ at −10° C. of 1.0×106 Pa or less and a shear storage elastic modulus G′ at 60° C. of 2.0×104 Pa or more obtained by dynamic viscoelasticity measurement of the pressure-sensitive adhesive composition under the conditions of a frequency of 1 Hz, a temperature rising rate of 5° C./min, and a temperature range of −60 to 70° C.
摘要:
A solar cell panel end-sealing composition contains a butyl rubber, a polyolefin resin having a silyl group, and a catalyst. The catalyst is at least one of a metal oxide, a metal hydroxide, and a metal complex of a transition element and the solar cell panel end-sealing composition has a flow viscosity at 140° C. of 500 Pa·s or more and 8000 Pa·s or less.