公开(公告)号：US20240392172A1

公开(公告)日：2024-11-28

申请号：US18696005

申请日：2022-09-21

Applicant: NITTO DENKO CORPORATION

Inventor： Yusuke TAKEDA ,  Satoshi HONDA ,  Kenta KUMAKURA ,  Naofumi KOSAKA

IPC: C09J133/04 ,  C09J7/38 ,  C09J11/08

Abstract: The present invention provides a pressure-sensitive adhesive composition having an excellent pressure-sensitive adhesive force to an adherend even in a high temperature, enabling peeling with a small peel force without any adhesive residue when brought into contact with warm water during peeling, and having a pressure-sensitive adhesive force and easy peelability. The pressure-sensitive adhesive composition according to the present invention contains: an acrylic polymer containing a structural unit of an alkoxy group-containing (meth)acrylate monomer as a main component and containing, with respect to 100 parts by mass of all components of monomer structural units, 1 to 40 parts by mass of a structural unit of a polymerizable monomer having a homopolymer Tg of 0° C. or higher; and a surfactant.

公开(公告)号：US20240409788A1

公开(公告)日：2024-12-12

申请号：US18697099

申请日：2022-09-21

Applicant: NITTO DENKO CORPORATION

Inventor： Satoshi HONDA ,  Yusuke TAKEDA ,  Kenta KUMAKURA ,  Naofumi KOSAKA ,  Tomokazu TAKAHASHI

IPC: C09J7/38 ,  C09J11/06 ,  C09J133/10

Abstract: The present invention provides a pressure-sensitive adhesive composition having an excellent adhesive force when bonding to an adherend, having excellent peelability when subjected to batch heat treatments at a high temperature, and having both a high initial adhesive force and a low post-heating adhesive force. The pressure-sensitive adhesive composition according to the present invention contains: a material having a radically polymerizable functional group; and a thermal polymerization initiator that generates a radical, in which a content of the thermal polymerization initiator is 1.2 to 10 parts by mass with respect to 100 parts by mass of all components excluding the thermal polymerization initiator.