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公开(公告)号：US20230167336A1
公开(公告)日：2023-06-01
申请号：US17920228
申请日：2021-03-22
Applicant: NITTO DENKO CORPORATION
Inventor： Mizuho NAGATA , Yu TACHIKAWA , Tomokazu TAKAHASHI , Satoshi HONDA
IPC: C09J7/38
CPC classification number: C09J7/38 , C09J2301/312 , C09J2301/408
Abstract: Provided is a pressure-sensitive adhesive sheet that can temporarily fix an adherend in a peelable manner, the pressure-sensitive adhesive sheet being free from requiring high-output laser light irradiation at the time of the peeling of the adherend. The pressure-sensitive adhesive sheet of the present invention includes a pressure-sensitive adhesive layer containing a UV absorber, wherein the pressure-sensitive adhesive layer has a first surface and a second surface opposed to the first surface, and wherein a maximum value S1 of a detection intensity of the UV absorber by time-of-flight secondary ion mass spectrometry (TOF-SIMS) in a range of from the first surface to a depth of 1 μm in a thickness direction and a detection intensity C of the UV absorber by the TOF-SIMS at a center point in the thickness direction of the pressure-sensitive adhesive layer satisfy a relationship: S1/C≥1.1.
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公开(公告)号：US20140004635A1
公开(公告)日：2014-01-02
申请号：US13915988
申请日：2013-06-12
Applicant: NITTO DENKO CORPORATION
Inventor： Tomokazu TAKAHASHI , Shinya AKIZUKI , Toshimasa SUGIMURA , Takeshi MATSUMURA , Daisuke UENDA
IPC: H01L33/46
CPC classification number: H01L33/46 , H01L21/6836 , H01L33/0079 , H01L2221/68336 , H01L2221/6834 , H01L2221/68381 , H01L2933/0025
Abstract: A method of manufacturing an LED according to an embodiment of the present invention includes:forming a reflective layer on an outer side of a substrate of an LED wafer including the substrate and a light emitting element on one surface of the substrate; andattaching, prior to the forming a reflective layer, a heat-resistant pressure-sensitive adhesive sheet onto an outer side of the light emitting element.
Abstract translation: 根据本发明的实施例的制造LED的方法包括：在基板的一个表面上的包括基板和发光元件的LED晶片的基板的外侧上形成反射层; 并且在形成反射层之前将耐热压敏粘合片附着在发光元件的外侧上。
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公开(公告)号：US20230167337A1
公开(公告)日：2023-06-01
申请号：US17920205
申请日：2021-03-22
Applicant: NITTO DENKO CORPORATION
Inventor： Mizuho NAGATA , Yu TACHIKAWA , Tomokazu TAKAHASHI , Satoshi HONDA
Abstract: Provided is a pressure-sensitive adhesive sheet that can temporarily fix an adherend in a peelable manner, the pressure-sensitive adhesive sheet being free from requiring high-output laser light irradiation at the time of the peeling of the adherend and being capable of eliminating the need for a step of washing the adherend after the peeling. The pressure-sensitive adhesive sheet of the present invention includes a pressure-sensitive adhesive layer containing a UV absorber and/or a photopolymerization initiator, wherein the pressure-sensitive adhesive sheet has a transmittance of 60% or less for light having a wavelength of 355 nm, and wherein the pressure-sensitive adhesive layer is a layer having an indentation elastic modulus at 23° C. of 25 MPa after irradiation with UV light having an integrated light quantity of 300 mJ/cm2.
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公开(公告)号：US20140004636A1
公开(公告)日：2014-01-02
申请号：US13917135
申请日：2013-06-13
Applicant: NITTO DENKO CORPORATION
Inventor： Tomokazu TAKAHASHI , Shinya AKIZUKI , Toshimasa SUGIMURA , Takeshi MATSUMURA , Daisuke UENDA
IPC: H01L33/60
CPC classification number: H01L33/60 , H01L33/0079 , H01L33/0095 , H01L2221/68327 , H01L2221/68336
Abstract: A method of manufacturing an LED including: back-grinding a substrate of an LED wafer including a light emitting element and the substrate; and attaching a protective sheet to the LED wafer one of prior to the back-grinding and after grinding the substrate in the back-grinding.
Abstract translation: 一种制造LED的方法，包括：背面研磨包括发光元件和所述基板的LED晶片的基板; 并且在后磨削之前和在后研磨中研磨基底之后，将保护片附接到LED晶片。
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公开(公告)号：US20240409789A1
公开(公告)日：2024-12-12
申请号：US18697381
申请日：2022-09-12
Applicant: NITTO DENKO CORPORATION
Inventor： Akiko SUGINO , Tomokazu TAKAHASHI , Daisuke HATTORI , Chie HAMADA , Toshiya YOSHIMI
IPC: C09J7/38
Abstract: A laminate includes: a void-containing layer and a pressure-sensitive adhesive/adhesive layer. The pressure-sensitive adhesive/adhesive layer is directly laminated on one surface or both surfaces of the void-containing layer. The pressure-sensitive adhesive/adhesive layer contains a (meth)acrylic polymer, and nanoindentation hardness of the pressure-sensitive adhesive/adhesive layer is 0.1 MPa or more and 1.0 MPa or less.
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Patent Agency Ranking
公开(公告)号：US20240228847A1
公开(公告)日：2024-07-11
申请号：US18284572
申请日：2022-03-25
Applicant: NITTO DENKO CORPORATION
Inventor： Eriko NAKAO , Shigeki ISHIGURO , Tomokazu TAKAHASHI , Ryohei OBAN , Asuka ENDO , Kayo SHIMOKAWA
IPC: C09J175/14 , B32B27/30 , B32B27/36 , B32B37/06 , B32B37/12 , C08F220/18 , C08G18/62 , C08G18/81 , C08J7/04 , C08J7/043 , C09J7/40
CPC classification number: C09J175/14 , B32B27/308 , B32B27/36 , B32B37/065 , C08F220/1808 , C08G18/6225 , C08G18/8116 , C08J7/0427 , C08J7/043 , C09J7/401 , C09J7/405 , B32B2037/1223 , C08J2375/14 , C09J2427/005 , C09J2467/006 , C09J2475/00
Abstract: The present invention relates to a surface-modifying layer including a polymeric component having a hydroxyl group and an unsaturated hydrocarbon group, in which a molar ratio of the unsaturated hydrocarbon group to the hydroxyl group is 0.01 or more and less than 1, a surface-modifying sheet including the surface-modifying layer and a release sheet, a laminate, a surface-modified member and a coated article, in which the surface-modifying sheet is used, a method for producing a surface-modified member, and a method for producing a coated article.
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公开(公告)号：US20240409788A1
公开(公告)日：2024-12-12
申请号：US18697099
申请日：2022-09-21
Applicant: NITTO DENKO CORPORATION
Inventor： Satoshi HONDA , Yusuke TAKEDA , Kenta KUMAKURA , Naofumi KOSAKA , Tomokazu TAKAHASHI
IPC: C09J7/38 , C09J11/06 , C09J133/10
Abstract: The present invention provides a pressure-sensitive adhesive composition having an excellent adhesive force when bonding to an adherend, having excellent peelability when subjected to batch heat treatments at a high temperature, and having both a high initial adhesive force and a low post-heating adhesive force. The pressure-sensitive adhesive composition according to the present invention contains: a material having a radically polymerizable functional group; and a thermal polymerization initiator that generates a radical, in which a content of the thermal polymerization initiator is 1.2 to 10 parts by mass with respect to 100 parts by mass of all components excluding the thermal polymerization initiator.
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公开(公告)号：US20230019125A1
公开(公告)日：2023-01-19
申请号：US17785141
申请日：2020-12-10
Applicant: NITTO DENKO CORPORATION
Inventor： Mizuho NAGATA , Yu TACHIKAWA , Tomokazu TAKAHASHI , Satoshi HONDA
Abstract: Provided is a pressure-sensitive adhesive sheet that can temporarily fix an adherend in a peelable manner, the pressure-sensitive adhesive sheet being free from requiring the application of high-output laser light at the time of the peeling of the adherend and being capable of eliminating the need for a step of washing the adherend after the peeling. The pressure-sensitive adhesive sheet of the present invention includes a pressure-sensitive adhesive layer containing a UV absorber and an active energy ray-curable pressure-sensitive adhesive, wherein the pressure-sensitive adhesive sheet has a transmittance of 50% or less for light having a wavelength of 355 nm. In one embodiment, the pressure-sensitive adhesive layer has a thickness of 20 μm or less. In one embodiment, the pressure-sensitive adhesive sheet has a visible light transmittance of 50% or more.
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9.发明申请公开(公告)号：US20160160089A1
公开(公告)日：2016-06-09
申请号：US14951591
申请日：2015-11-25
Applicant: NITTO DENKO CORPORATION
Inventor： Shunpei TANAKA , Tomokazu TAKAHASHI , Jun AKIYAMA
IPC: C09J7/02 , H01L21/683
CPC classification number: H01L21/6836 , C09J7/22 , C09J7/38 , C09J2201/622 , C09J2203/326 , C09J2433/00 , H01L21/6835 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2221/68386
Abstract: Provided is a pressure-sensitive adhesive sheet capable of maintaining a desired pressure-sensitive adhesive characteristic even in a production method for a semiconductor including, for example, a step of peeling off a support material. The pressure-sensitive adhesive sheet includes a backing layer and a pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer has a water contact angle of from 80° to 105°. The pressure-sensitive adhesive sheet is used in a production method for a semiconductor including a step in which the pressure-sensitive adhesive layer is brought into contact with a solvent having a solubility in water at 20° C. of 1 g/100 mL or less.
Abstract translation: 提供即使在包括例如剥离载体材料的步骤的半导体制造方法中也能够保持期望的压敏粘合剂特性的压敏粘合片。 压敏粘合片包括背层和粘合剂层，其中粘合剂层的水接触角为80°至105°。 该粘合片用于半导体制造方法，其包括使粘合剂层与20℃下在水中溶解度为1g / 100mL的溶剂接触的步骤，或 减。
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公开(公告)号：US20140000793A1
公开(公告)日：2014-01-02
申请号：US13913807
申请日：2013-06-10
Applicant: NITTO DENKO CORPORATION
Inventor： Tomokazu TAKAHASHI , Shinya AKIZUKI , Toshimasa SUGIMURA , Takeshi MATSUMURA , Daisuke UENDA
IPC: H01L33/00
CPC classification number: H01L33/005 , H01L21/6836 , H01L24/27 , H01L33/0079 , H01L33/0095 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2224/83191 , H01L2224/94 , H01L2924/12041 , H01L2924/12042 , H01L2924/00 , H01L2224/27
Abstract: A method of manufacturing an LED according to an embodiment of the present invention includes back-grinding a substrate of an LED wafer including a light emitting element and the substrate, where the back-grinding includes fixing the LED wafer to a table via a double-sided pressure-sensitive adhesive sheet, and then grinding the substrate.
Abstract translation: 根据本发明的实施例的制造LED的方法包括对包括发光元件和基板的LED晶片的基板进行背面磨削，其中所述后研磨包括经由双层结构将LED晶片固定到工作台上， 双面压敏粘合片，然后研磨基材。
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