HEAT SINK WITH AN INTEGRATED VAPOR CHAMBER
    4.
    发明申请
    HEAT SINK WITH AN INTEGRATED VAPOR CHAMBER 有权
    与一体化蒸气室的散热

    公开(公告)号:US20140240918A1

    公开(公告)日:2014-08-28

    申请号:US13778053

    申请日:2013-02-26

    CPC classification number: G06F1/20 G06F2200/201 H01L23/427 H01L2224/16225

    Abstract: A cooling subsystem is provided for dissipating heat from processor. The cooling subsystem includes a heat sink comprising an upper portion having a plurality of fins formed therein and a base portion fixed to the upper portion to form a vapor chamber in an enclosed volume between the upper portion and the base portion.

    Abstract translation: 提供冷却子系统,用于从处理器散热。 冷却子系统包括散热器,其包括其上形成有多个翅片的上部和固定到上部的基部,以在上部和基部之间形成封闭容积的蒸气室。

Patent Agency Ranking