公开(公告)号：US20250003694A1

公开(公告)日：2025-01-02

申请号：US18223154

申请日：2023-07-18

Applicant: NVIDIA CORPORATION

Inventor： Ron CHAO ,  Elad Mentovich ,  Harrison Sangwha Kim ,  Mark North ,  Xinwei Lu ,  Tahir Cader ,  Fei Zhang ,  Yunseok Kim ,  David Haley ,  Yuezhan Steven Zhu ,  Lei Huang

IPC: F28D15/04 ,  F28D15/02

Abstract: A heat transfer apparatus including a housing and a wick structure is provided that is configured to dissipate heat from a heat source. The housing defines a chamber that holds working fluid. The wick structure includes a body and pores defined by the body. The heat transfer apparatus defines an evaporator section configured to evaporate the working fluid using heat from a heat source and a condenser section configured to dissipate heat carried by the evaporated working fluid through condensation of the evaporated working fluid. The wick structure has a repeatable, configurable, and controlled geometry optimized to move the working fluid from the condenser section to the evaporator section via capillary action. The body of the wick structure may have a gyroidal geometry. Associated methods are also provided.