公开(公告)号：US10350489B2

公开(公告)日：2019-07-16

申请号：US15058852

申请日：2016-03-02

Applicant: Nvidia Corporation

Inventor： Ron Chao

IPC: A63F9/24 ,  A63F13/24 ,  A63F13/218

Abstract: Aspects of the present invention are directed to techniques for improving the manufacturing control mechanisms—specifically game controllers—for computerized electronic devices. According to one aspect of the present invention, a button assembly is provided that eliminates the need for dampers or gaskets for shock absorption by implementing the hammer and pad using novel and advantageous geometries. According to one embodiment, the bottom or striking surface of the hammer in a button assembly is implemented at an angle, which, when pressed, strikes a similarly angled surface of the landing pad. The slope of the corresponding angles cause the hammer to slide along the angled surface, and for the kinetic force of the impact to be redirected as shearing force away from the button assembly (and the corresponding user appendage).

公开(公告)号：US20250081349A1

公开(公告)日：2025-03-06

申请号：US18242290

申请日：2023-09-05

Applicant: NVIDIA CORPORATION

Inventor： Elad Mentovich ,  Dongji Xie ,  Ron Chao ,  Ryan Albright

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/12 ,  H05K3/28

Abstract: A secure electronic component assembly is described herein for ensuring the physical integrity of an integrated circuit (IC). The secure electronic component assembly may comprise a printed circuit board (PCB), an integrated circuit (IC) mounted on the PCB, and an underfill material disposed between the IC and the PCB. The underfill material comprises a detection agent that is configured to change a state of the IC in response to exposure to an external environment, wherein the change in the state of the IC is indicative of a tamper condition.

公开(公告)号：US20240264588A1

公开(公告)日：2024-08-08

申请号：US18113217

申请日：2023-02-23

Applicant: NVIDIA CORPORATION

Inventor： Ron Chao ,  Liang-I Lin ,  Tuan Ong ,  Elad Mentovich ,  Siddha Ganju ,  Dinesh Krishnaswamy ,  Fisher Liu ,  Lei Huang ,  Nicholas Girard Page

IPC: G05B19/418

CPC classification number: G05B19/41885 ,  G05B19/41805

Abstract: Methods are described herein for artificial-intelligence-based manufacturing. The present invention may include performing an initial step in a series of steps to achieve a target value of an attribute, where the series of steps is for manufacturing an object, and, after performing the initial step, measuring an actual value of the attribute achieved by the initial step. The method may include, for each subsequent step in the series, providing actual values of attributes achieved by preceding steps in the series to a respective machine learning model to determine a respective target value for a respective attribute to be achieved by the respective step. The method may also include, for each step, performing the respective step to achieve the respective target value of the respective attribute and, after performing the respective step, measuring a respective actual value of the respective attribute achieved by the respective step.

公开(公告)号：US20250079344A1

公开(公告)日：2025-03-06

申请号：US18242316

申请日：2023-09-05

Applicant: NVIDIA CORPORATION

Inventor： Elad Mentovich ,  Dongji Xie ,  Ron Chao

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L25/065 ,  H01L25/16

Abstract: A secure electronic component assembly is described herein for ensuring the physical integrity of an integrated circuit (IC). The secure electronic component assembly may comprise a printed circuit board (PCB), an integrated circuit (IC) mounted on the PCB, and a security chip that is operatively coupled to the IC. The IC may comprise a plurality of solder balls operatively coupled thereto and configured for physical and electrical connection between the IC and the PCB. The security chip is configured to detect a potential tampering of the IC.

公开(公告)号：US20250068132A1

公开(公告)日：2025-02-27

申请号：US18237233

申请日：2023-08-23

Applicant: Nvidia Corporation

Inventor： Elad Mentovich ,  Siddha Ganju ,  Jeff Whitmer ,  Ryan Albright ,  Tahir Cader ,  Ron Chao

IPC: G05B13/02 ,  G06F1/20

Abstract: Methods are described herein for manufacturing multi-component objects using artificial intelligence. The present invention may be directed to a method that includes determining an actual value of a first attribute of a first component of an object and determining, using a machine learning model and based on the actual value of the first attribute, an optimized value for a second attribute of a second component that is functionally interrelated to the first component in the object. The method may include selecting, from a plurality of second components each having a value for the second attribute within a tolerance range, a second component having the optimized value for the second attribute. The method may further include manufacturing the object using the first component and the selected second component.

公开(公告)号：US20170252644A1

公开(公告)日：2017-09-07

申请号：US15058852

申请日：2016-03-02

Applicant: Nvidia Corporation

Inventor： Ron Chao

IPC: A63F13/24 ,  A63F13/218

CPC classification number: A63F13/24 ,  A63F13/218

Abstract: Aspects of the present invention are directed to techniques for improving the manufacturing control mechanisms—specifically game controllers—for computerized electronic devices. According to one aspect of the present invention, a button assembly is provided that eliminates the need for dampers or gaskets for shock absorption by implementing the hammer and pad using novel and advantageous geometries. According to one embodiment, the bottom or striking surface of the hammer in a button assembly is implemented at an angle, which, when pressed, strikes a similarly angled surface of the landing pad. The slope of the corresponding angles cause the hammer to slide along the angled surface, and for the kinetic force of the impact to be redirected as shearing force away from the button assembly (and the corresponding user appendage).