公开(公告)号：US12245360B2

公开(公告)日：2025-03-04

申请号：US17879620

申请日：2022-08-02

Applicant: NVIDIA Corporation

Inventor： David Mohr ,  Tahir Cader ,  Elad Mentovich ,  Boaz Atias ,  Chong Tan

IPC: H05K1/02 ,  H05K7/20

Abstract: A power arrangement and cooling system for electronic devices includes a processing unit electrically interconnected and disposed to a first side of a printed circuit board and a power converter electrically interconnected and disposed on a second side of the printed circuit board. The power converter includes a thermally conductive material layer that transfers heat generated by the power converter during operation away from the power converter toward a heatsink that is disposed adjacent the second side of the printed circuit board. Heat generated by the processing unit is absorbed by a heatsink disposed adjacent the first side of the printed circuit board. Power for the processing unit is provided, by the power converter, through a thickness of the printed circuit board.

公开(公告)号：US20240049380A1

公开(公告)日：2024-02-08

申请号：US17879620

申请日：2022-08-02

Applicant: NVIDIA Corporation

Inventor： David Mohr ,  Tahir Cader ,  Elad Mentovich ,  Boaz Atias ,  Chong Tan

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0209 ,  H05K7/20154 ,  H05K7/209 ,  H05K7/20909

Abstract: A power arrangement and cooling system for electronic devices includes a processing unit electrically interconnected and disposed to a first side of a printed circuit board and a power converter electrically interconnected and disposed on a second side of the printed circuit board. The power converter includes a thermally conductive material layer that transfers heat generated by the power converter during operation away from the power converter toward a heatsink that is disposed adjacent the second side of the printed circuit board. Heat generated by the processing unit is absorbed by a heatsink disposed adjacent the first side of the printed circuit board. Power for the processing unit is provided, by the power converter, through a thickness of the printed circuit board.