公开(公告)号：US09349645B2

公开(公告)日：2016-05-24

申请号：US14055188

申请日：2013-10-16

Applicant: NXP B.V.

Inventor： Martin Lapke ,  Hartmut Buenning ,  Sascha Moeller ,  Guido Albermann ,  Thomas Rohleder ,  Heiko Backer

IPC: H01L21/00 ,  H01L21/78 ,  B28D5/00 ,  B28D1/22 ,  H01L21/683 ,  H01L21/30 ,  H01L21/46

CPC classification number: H01L21/78 ,  B28D1/221 ,  B28D5/0041 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68386 ,  Y10T225/287 ,  Y10T225/298

Abstract: An apparatus, device and method for wafer dicing is disclosed. In one example, the apparatus discloses: a wafer holding device having a first temperature; a die separation bar moveably coupled to the wafer holding device; and a cooling device coupled to the apparatus and having a second temperature which enables the die separation bar to fracture an attachment material in response to movement with respect to the wafer holding device. In another example, the method discloses: receiving a wafer having an attachment material applied to one side of the wafer; placing the wafer in a holding device having a first temperature; urging a die separation bar toward the wafer; and cooling the attachment material to a second temperature, which is lower than the first temperature, until the attachment material fractures in response to the urging.

Abstract translation: 公开了一种用于晶片切割的装置，装置和方法。 在一个示例中，该装置公开了：具有第一温度的晶片保持装置; 可移动地联接到晶片保持装置的模具分离杆; 以及联接到所述设备并具有第二温度的冷却装置，其使得能够使所述模具分离杆响应于相对于所述晶片保持装置的运动而破坏附着材料。 在另一示例中，该方法公开了：接收具有施加到晶片一侧的附着材料的晶片; 将晶片放置在具有第一温度的保持装置中; 推动模具分离杆朝向晶片; 并将附着材料冷却至低于第一温度的第二温度，直到附着材料响应于推动而断裂。

公开(公告)号：US20150104931A1

公开(公告)日：2015-04-16

申请号：US14055188

申请日：2013-10-16

Applicant: NXP B.V.

Inventor： Martin Lapke ,  Hartmut Buenning ,  Sascha Moeller ,  Guido Albermann ,  Thomas Rohleder ,  Heiko Backer

IPC: H01L21/78 ,  B28D5/00

CPC classification number: H01L21/78 ,  B28D1/221 ,  B28D5/0041 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68386 ,  Y10T225/287 ,  Y10T225/298

Abstract: An apparatus, device and method for wafer dicing is disclosed. In one example, the apparatus discloses: a wafer holding device having a first temperature; a die separation bar moveably coupled to the wafer holding device; and a cooling device coupled to the apparatus and having a second temperature which enables the die separation bar to fracture an attachment material in response to movement with respect to the wafer holding device. In another example, the method discloses: receiving a wafer having an attachment material applied to one side of the wafer; placing the wafer in a holding device having a first temperature; urging a die separation bar toward the wafer; and cooling the attachment material to a second temperature, which is lower than the first temperature, until the attachment material fractures in response to the urging.

Abstract translation: 公开了一种用于晶片切割的装置，装置和方法。 在一个示例中，该装置公开了：具有第一温度的晶片保持装置; 可移动地联接到晶片保持装置的模具分离杆; 以及联接到所述设备并具有第二温度的冷却装置，其使得能够使所述模具分离杆响应于相对于所述晶片保持装置的运动而破坏附着材料。 在另一示例中，该方法公开了：接收具有施加到晶片一侧的附着材料的晶片; 将晶片放置在具有第一温度的保持装置中; 推动模具分离杆朝向晶片; 并将附着材料冷却至低于第一温度的第二温度，直到附着材料响应于推动而断裂。