TWO-PHASE IMMERSION COOLING
    1.
    发明公开

    公开(公告)号:US20230303901A1

    公开(公告)日:2023-09-28

    申请号:US18187712

    申请日:2023-03-22

    CPC classification number: C09K5/048 H05K7/203 H05K7/20327

    Abstract: An immersion cooling system includes a fluid-retaining container having space for accommodating an electronic device. A heat transfer fluid is in contact with the electronic device. A heat exchanger contacts and condenses vapor from vaporization of the heat transfer fluid. The heat transfer fluid has a thermal conductivity higher than 0.08 W m−1K−1, a dielectric constant (Dk) 20-40 GHz less than 3.0, and a heat of vaporization higher than 150 kJ kg−1, with fire retarding features, compatibility with plastics, metals, rubbers and includes a partially fluorinated compound. The improved immersion cooling system includes fluids with increased thermal conductivity and heat of vaporization while reducing fluid density and maintaining the advantages of the fluid being non-flammable, having high electrical stability and a low dielectric constant.

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