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公开(公告)号:US20230182453A1
公开(公告)日:2023-06-15
申请号:US17888468
申请日:2022-08-15
Inventor: Jinliang ZHAO , Yijun LIAO , ChiHo KWOK , Chenmin LIU
CPC classification number: B32B27/08 , B32B27/283 , B32B27/20 , B32B37/203 , B32B37/10 , B32B38/0004 , B32B7/03 , B32B2038/0064 , B32B2305/30 , B32B2264/108 , B32B2383/00 , B32B2313/04 , B32B2307/302 , B32B2307/536 , B32B2307/538 , B32B2307/54
Abstract: An anisotropic thermal interface device including plural aligned thermally anisotropic conductive composite layers. Each layer has a first thermal conductivity in a first direction and a second, larger thermal conductivity in a second direction. The aligned thermally anisotropic conductive composite layers extend substantially parallel to each other in the first direction and include 45-95 weight percent graphite flakes aligned in the second direction. The thermally anisotropic conductive composite layers have a binder including a branched siloxane. The thermally anisotropic conductive composite layers are adhered to adjacent thermally anisotropic conductive composite. The thermally anisotropic conductive composite layers have a second thermal conductivity of 25 to 45 W/mK. The anisotropic thermal interface device has an arithmetic average surface roughness of 5 to 20 μm and a tensile strength of 50 to 130 KPa.
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公开(公告)号:US20250006670A1
公开(公告)日:2025-01-02
申请号:US18754206
申请日:2024-06-26
Inventor: Jinliang ZHAO , ChiHo KWOK , Yan LIU
IPC: H01L23/66 , H01L23/00 , H01L23/373
Abstract: A compact antenna module with integrated thermal management. The module includes at least one antenna and amplifier such as power amplifiers or low-noise amplifiers. An anisotropic thermal interface material is positioned such that it is in thermal communication with these components. The anisotropic thermal interface material includes plural aligned thermally anisotropic composite layers having a first thermal conductivity in a first direction and a second, larger thermal conductivity in a second direction and extend substantially parallel to each other in the first direction. The layers include hexagonal boron nitride (hBN) in a binder aligned in the second direction approximately perpendicular to the first direction such that x-y planes of the hBNalign in the second direction. In this manner, the thermal conductivity in the second direction is at least 13.5 W/mK, with a dielectric constant of less than 4, and a loss tangent of less than 0.007.
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