Abstract:
A bismuth ferrite thin-film solar cell and a method of manufacturing the same control the quantity of Fe2+ defected in the bismuth ferrite thin-film by doping with zinc. Reduction of the quantity of Fe2+ defects in the bismuth ferrite thin-film is conducive to the increase of closed-circuit current density and enhancement of photoelectric conversion efficiency.
Abstract:
In a method for evaporation depositing uniform thin films, a film is deposited on a substrate of a vacuum environment while maintaining a constant deposition rate. A cover is installed on a wall of the evaporation vessel. When the evaporation material is heated to an evaporation state and the interior of the evaporation vessel reaches a first vapor saturation pressure, the vapor of the evaporation material flows towards a pressure stabilizing chamber. When the pressure stabilizing chamber reaches a second vapor saturation pressure which is smaller than the first vapor saturation pressure, the vacuum environment has a vacuum background pressure which is smaller than the second vapor saturation pressure, so that the evaporation material vapor flows from the pressure stabilizing chamber towards the vacuum environment at constant rate due to the pressure difference, so as to evaporate the substrate.
Abstract:
A preparation method of high purity and densified tungsten-titanium metal which mixes titanium metal powder and tungsten metal powder together; adds metallic nitrates (such as nickel nitrate) as combustion improvers; then taking into the account of the characteristics of metal nitrate, which is soluble in alcohols to form a liquidous precursor, adds metal powder to mix together thoroughly, so that the sintering agent is expected to be colloid and uniformly spread among the tungsten-titanium metal powder. The preparation method significantly reduces the ratio of the combustion improver during the preparation of the high purity and densified tungsten-titanium target material.
Abstract:
The present invention provides a nickel-based superalloy material, which comprises 0.06 wt % or less carbon, 11.61˜11.93 wt % chromium, 1.52˜2.85 wt % titanium, 5.89˜6.08 wt % aluminum, 0.009 wt % or less boron, 0.07 wt % or less zirconium, 2.16˜2.18 wt % niobium, 4.22˜4.29 wt % molybdenum, and the balance being composed of nickel and incidental impurities, whereby the effect of obtaining the nickel-based superalloy with better mechanical properties can be achieved.
Abstract:
The present invention provides a solder for nickel based superalloy soldering. The solder includes 11 wt % to 13 wt % chromium, 5.0 wt % to 7.0 wt % aluminum, 3.5 wt % to 5.0 wt % molybdenum, 1.5 wt % to 2.5 wt % niobium, 0.4 wt % to 1.0 wt % titanium, 0.03 wt % to 0.07 wt % carbon, 0.05 wt %-0.15 wt % zirconium, 0.001 wt % to 0.1 wt % boron and remainder nickel or other inevitable impurities, thereby reducing occurrence of soldering hot cracking and insufficient weld bead strength in nickel based superalloy raw materials during soldering.
Abstract:
A high creep-resistant equiaxed grain nickel-based superalloy. The high creep-resistant equiaxed grain nickel-based superalloy is characterized that the chemical compositions in weight ratios include Cr in 8.0 to 9.5 wt %, W in 9.5 to 10.5 wt %, Co in 9.5 to 10.5 wt %, Al in 5.0 to 6.0 wt %, Ti in 0.5 to 1.5 wt %, Mo in 0.5 to 1.0 wt %, Ta in 2.5 to 4.0 wt %, Hf in 1.0 to 2.0 wt %, Ir in 2.0 to 4.0 wt %, C in 0.1 to 0.2 wt %, B in 0.01 to 0.1 wt %, Zr in 0.01 to 0.10 wt %, and the remaining part formed by Ni and inevitable impurities.
Abstract:
A linear evaporation apparatus includes a thermal insulation chamber, and crucibles, evaporation material heaters and a mixing chamber installed in the thermal insulation chamber. The mixing chamber includes a flow limiting and adjusting layer, a flow channel adjusting member, a mixed layer and a linear evaporation layer. The flow limiting and adjusting layer is a rectangular sheet with flow limit holes corresponsive to the crucibles respectively; the flow channel adjusting member is an interconnected structure having at least one flow inlet corresponsive to some of the flow limit holes and at least one flow outlet, and the mixed layer is a substantially I-shaped sheet structure, and the linear evaporation layer is a rectangular sheet having a linear source evaporation opening tapered from both ends to the middle, so as to improve the uniformity of the thin film and the utilization of the evaporation materials.