公开(公告)号：US20200317965A1

公开(公告)日：2020-10-08

申请号：US16372434

申请日：2019-04-02

Applicant: National Chung-Shan Institute of Science and Technology

Inventor： Hsiao-Min Wu ,  Chien-Liang Chang ,  Kuei-Ting Hsu ,  Wei-Jen Liu ,  Chia-Hsin Zhang

IPC: C09J9/02 ,  H01B1/04 ,  C09J11/04 ,  C09J175/08

Abstract: Conductive carbon adhesive is an active technology researched in the world, and its application is quite wide, such as liquid crystal display (TFTLCD), organic light emitting diode (OLED), radio frequency identification system (RFID), antenna, solar cell, sensing and electronic components for devices. Since the two-dimensional carbon material used for the conductive carbon adhesive is easily stacked and agglomerated in the polymer, the present invention adds nano-fillers to the carbon material to prepare a three-dimensional conductive carbon adhesive to prevent carbon material agglomeration.

公开(公告)号：US10800949B1

公开(公告)日：2020-10-13

申请号：US16372434

申请日：2019-04-02

Applicant: National Chung-Shan Institute of Science and Technology

Inventor： Hsiao-Min Wu ,  Chien-Liang Chang ,  Kuei-Ting Hsu ,  Wei-Jen Liu ,  Chia-Hsin Zhang

IPC: H01B1/04 ,  C09J9/02 ,  C09J11/04 ,  C09J175/08 ,  C08K3/22 ,  C08K3/04 ,  C08K3/38

Abstract: Conductive carbon adhesive is an active technology researched in the world, and its application is quite wide, such as liquid crystal display (TFTLCD), organic light emitting diode (OLED), radio frequency identification system (RFID), antenna, solar cell, sensing and electronic components for devices. Since the two-dimensional carbon material used for the conductive carbon adhesive is easily stacked and agglomerated in the polymer, the present invention adds nano-fillers to the carbon material to prepare a three-dimensional conductive carbon adhesive to prevent carbon material agglomeration.