公开(公告)号：US09597777B2

公开(公告)日：2017-03-21

申请号：US14152792

申请日：2014-01-10

申请人： NexPlanar Corporation

发明人： William C. Allison ,  Diane Scott ,  Ping Huang ,  Richard Frentzel ,  Alexander William Simpson

IPC分类号： B24D11/00 ,  B24B37/013 ,  B24B37/20

CPC分类号： B24D11/003 ,  B24B37/013 ,  B24B37/205

摘要： Homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.

公开(公告)号：US20140123563A1

公开(公告)日：2014-05-08

申请号：US14152792

申请日：2014-01-10

申请人： NexPlanar Corporation

发明人： William C. Allison ,  Diane Scott ,  Ping Huang ,  Richard Frentzel ,  Alexander William Simpson

IPC分类号： B24D11/00

CPC分类号： B24D11/003 ,  B24B37/013 ,  B24B37/205

摘要： Homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.

摘要翻译： 描述了使用涡流端点检测来研磨半导体衬底的均匀抛光垫。 还描述了使用涡流端点检测来制造用于抛光半导体衬底的均匀抛光垫的方法。

公开(公告)号：US10946495B2

公开(公告)日：2021-03-16

申请号：US14611064

申请日：2015-01-30

申请人： NexPlanar Corporation

发明人： Ping Huang ,  William C. Allison ,  Richard Frentzel ,  Paul Andre Lefevre ,  Robert Kerprich ,  Diane Scott

IPC分类号： B24B37/24 ,  B24B37/20 ,  B24B37/26 ,  C08J9/00 ,  C08J9/228

摘要： Low density polishing pads and methods of fabricating low density polishing pads are described. In an example, a polishing pad for polishing a substrate includes a polishing body having a density approximately in the range of 0.4-0.55 g/cc. The polishing body includes a thermoset polyurethane material and a plurality of closed cell pores dispersed in the thermoset polyurethane material. Each of the plurality of closed cell pores has a shell composed of an acrylic co-polymer.

公开(公告)号：US20150038066A1

公开(公告)日：2015-02-05

申请号：US13955398

申请日：2013-07-31

申请人： NexPlanar Corporation

发明人： Ping Huang ,  William C. Allison ,  Richard Frentzel ,  Paul Andre Lefevre ,  Robert Kerprich ,  Diane Scott

IPC分类号： B24D11/04 ,  B24D11/00 ,  B24B37/20

摘要： Low density polishing pads and methods of fabricating low density polishing pads are described. In an example, a polishing pad for polishing a substrate includes a polishing body having a density of less than 0.5 g/cc and composed of a thermoset polyurethane material. A plurality of closed cell pores is dispersed in the thermoset polyurethane material.

摘要翻译： 描述低密度抛光垫和制造低密度抛光垫的方法。 在一个实例中，用于抛光衬底的抛光垫包括密度小于0.5g / cc并由热固性聚氨酯材料组成的抛光体。 多个闭孔细孔分散在热固性聚氨酯材料中。