Cutting Element
    1.
    发明申请
    Cutting Element 有权
    切割元素

    公开(公告)号:US20100200305A1

    公开(公告)日:2010-08-12

    申请号:US12704017

    申请日:2010-02-11

    IPC分类号: E21B10/36

    摘要: A cutting element comprises a multilayer polycrystalline diamond element 42 bonded to a substrate 44 of a less hard material, the polycrystalline diamond element 42 defining a matrix of interstitial volumes, the interstitial volumes of a first region of the diamond layer 42 adjacent a working surface 46 thereof being substantially free of a catalysing material, the interstitial volumes of a second region of the diamond layer 42 remote from the working surface 46 containing catalysing material.

    摘要翻译: 切割元件包括结合到较硬硬质材料的基底44的多层多晶金刚石元件42,多晶金刚石元件42限定间隙体积矩阵,金刚石层42的第一区域的邻近工作表面46的间隙体积 其基本上不含催化材料,金刚石层42的第二区域的间隙体积远离包含催化材料的工作表面46。

    Cutting element
    2.
    发明授权
    Cutting element 有权
    切割元件

    公开(公告)号:US08910730B2

    公开(公告)日:2014-12-16

    申请号:US12704017

    申请日:2010-02-11

    摘要: A cutting element includes a multilayer polycrystalline diamond element bonded to a substrate of a less hard material. The polycrystalline diamond element defines a matrix of interstitial volumes. The interstitial volumes of a first region of the diamond layer are adjacent a working surface thereof being substantially free of a catalyzing material. The interstitial volumes of a second region of the diamond layer are remote from the working surface containing the catalyzing material.

    摘要翻译: 切割元件包括结合到较硬硬质材料的基底上的多层多晶金刚石元件。 多晶金刚石元素定义了间隙体积的矩阵。 金刚石层的第一区域的间隙体积基本上不含催化材料的工作表面。 金刚石层的第二区域的间隙体积远离包含催化材料的工作表面。