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1.发明公开公开(公告)号：US20230317747A1
公开(公告)日：2023-10-05
申请号：US18207357
申请日：2023-06-08
发明人： Mingzhu WANG , Nan GUO , Zhenyu CHEN , Takehiko TANAKA , Jingfei HE , Zhen HUANG , Zhongyu LUAN , Feifan CHEN
CPC分类号： H01L27/14618 , H01L27/14627 , H01L27/14683 , H04M1/0264 , H05K1/181 , H04N23/51 , H04N23/54 , H04N23/57 , H05K2201/10121
摘要： A camera module is provided, including a circuit board, a photosensitive element, an optical lens, and a filter element. The circuit board includes a substrate having a substrate front surface, a substrate back surface, and a substrate channel. The substrate front surface and the substrate back surface correspond to each other, and the substrate channel extends from the substrate front surface to the substrate back surface. The photosensitive element has a photosensitive area and a non-photosensitive area surrounding the photosensitive area. A first part of the non-photosensitive area is mounted on the back surface substrate. The photosensitive element and the substrate are conductively connected. The photosensitive area and a second part of the non-photosensitive area correspond to the substrate channel. The optical lens is held in a photosensitive path of the photosensitive element. The filter element is directly mounted on the substrate front surface of the substrate.
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2.发明申请公开(公告)号：US20210203818A1
公开(公告)日：2021-07-01
申请号：US17204197
申请日：2021-03-17
发明人： Mingzhu WANG , Zhongyu LUAN , Liefeng CHEN , Duanliang CHENG , Bojie ZHAO , Takehiko TANAKA , Zhen HUANG
IPC分类号： H04N5/225
摘要： the present invention provides a camera module, a molding photosensitive assembly thereof, a manufacturing method, and an electronic device, the molding photosensitive assembly comprises a lens, a photosensitive element, a circuit board, a molding base, and a supporting element, the photosensitive element being arranged on the circuit board, the molding base being formed into an integral structure with the lens, the supporting element, the photosensitive element, and the circuit board by means of a molding process, and the camera module and the molding photosensitive assembly thereof being capable of reducing stain sensitivity and shortening the distance of the lens plane above a light through hole of the lens to the photosensitive plane of the photosensitive element.
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3.发明申请公开(公告)号：US20190165019A1
公开(公告)日：2019-05-30
申请号：US16088435
申请日：2016-10-25
发明人： Mingzhu WANG , Zhenyu CHEN , Nan GUO , Bojie ZHAO , Takehiko TANAKA , Zhen HUANG , Zhongyu LUAN , Heng JIANG
IPC分类号： H01L27/146 , H04N5/225 , H01L23/00
摘要： A molded photosensitive assembly of a camera module includes at least one supporting member formed by a first substance, at least one photosensitive element, at least one circuit board, at least one set of wires electrically connecting the photosensitive element to the circuit board, and at least one molded base. Two ends of each of the wires are respectively connected to a chip connector of the photosensitive element and a circuit connector of the circuit board. The molded base is formed by a second substance and comprises a molded body and has at least one light window, wherein the photosensitive element and the wires are protected by a supporting member which is provided for avoiding an upper mold of a molding-die pressing on the wires during the molding process.
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公开(公告)号：US20220367556A1
公开(公告)日：2022-11-17
申请号：US17770744
申请日：2020-10-21
发明人： Zhen HUANG , Zhongyu LUAN , Yinbo ZHANG , Fengsheng XI , Hongfeng GAN
IPC分类号： H01L27/146
摘要： The present application relates to a circuit board assembly, a photosensitive assembly, a camera module, and preparation methods for the circuit board assembly and the photosensitive assembly. The photosensitive assembly includes a circuit board and a photosensitive chip. The circuit board includes a circuit board main body, a through hole formed through the circuit board main body, a set of circuit board electrical connecting terminals disposed on the lower surface of the circuit board main body, a conducting medium disposed on the circuit board electrical connecting terminals, and a non-conducting adhesive covering the conducting medium. The photosensitive chip includes chip electrical connecting terminals disposed in a non-photosensitive area. The chip electrical connecting terminals of the photosensitive chip is in contact with the conducting medium to be electrically connected to the circuit board electrical connecting terminals, and the photosensitive chip is bonded to the lower surface of the circuit board via the non-conducting adhesive, so that the photosensitive chip is electrically connected to the circuit board. In this way, the photosensitive chip is stably electrically connected to the circuit board with relatively low costs and relatively low process difficulty.
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5.发明申请公开(公告)号：US20220109018A1
公开(公告)日：2022-04-07
申请号：US17550733
申请日：2021-12-14
发明人： Mingzhu WANG , Nan GUO , Zhenyu CHEN , Takehiko TANAKA , Jingfei HE , Zhen HUANG , Zhongyu LUAN , Feifan CHEN
IPC分类号： H01L27/146 , H04N5/225 , H04M1/02 , H05K1/18
摘要： A camera module and a molded circuit board assembly thereof, a semi-finished product of the molded circuit board assembly, and an array camera module and a molded circuit board assembly thereof, as well as a manufacturing method and an electronic device, wherein the camera module comprises at least one optical lens, at least one back surface molded portion, at least one photosensitive element and a circuit board. The circuit board comprises at least one substrate and at least one electronic component that is conductively connected to the substrate; a part of the non-photosensitive area of the photosensitive element is attached to the substrate back surface of the substrate, and the photosensitive area and another part of the non-photosensitive area of the photosensitive element correspond to a substrate channel of the substrate; the back surface molded portion is integrally bonded to at least one part of the area of the substrate back surface of the substrate; and the optical lens is held in the photosensitive path of the photosensitive element.
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6.发明申请公开(公告)号：US20200007726A1
公开(公告)日：2020-01-02
申请号：US16484292
申请日：2018-02-08
发明人： Mingzhu WANG , Zhongyu LUAN , Liefeng CHEN , Duanliang CHENG , Bojie ZHAO , Takehiko TANAKA , Zhen HUANG
IPC分类号： H04N5/225
摘要： The present invention provides a camera module, a molding photosensitive assembly thereof, a manufacturing method, and an electronic device, the molding photosensitive assembly comprises a lens, a photosensitive element, a circuit board, a molding base, and a supporting element, the photosensitive element being arranged on the circuit board, the molding base being formed into an integral structure with the lens, the supporting element, the photosensitive element, and the circuit board by means of a molding process, and the camera module and the molding photosensitive assembly thereof being capable of reducing stain sensitivity and shortening the distance of the lens plane above a light through hole of the lens to the photosensitive plane of the photosensitive element.
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7.发明申请公开(公告)号：US20170264802A1
公开(公告)日：2017-09-14
申请号：US15473605
申请日：2017-03-30
发明人： Mingzhu WANG , Bojie ZHAO , Takehiko TANAKA , Nan GUO , Zhenyu CHEN , Heng JIANG , Zhongyu LUAN , Fengsheng XI , Feifan CHEN , Liang DING
CPC分类号： H04N5/2257 , G02B3/0075 , G02B5/201 , G02B7/006 , G02B7/021 , H01L27/14625 , H04M1/0264 , H04N5/2252 , H04N5/2253 , H04N5/2254 , H04N5/2258 , H05K1/0203 , H05K1/0274 , H05K1/183 , H05K1/185 , H05K1/189 , H05K2201/0141 , H05K2201/0158 , H05K2201/0175 , H05K2201/09036 , H05K2201/10121
摘要： An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.
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公开(公告)号：US20170264801A1
公开(公告)日：2017-09-14
申请号：US15473573
申请日：2017-03-29
发明人： Mingzhu WANG , Bojie ZHAO , Takehiko TANAKA , Nan GUO , Zhenyu CHEN , Heng JIANG , Zhongyu LUAN , Fengsheng XI , Feifan CHEN , Liang DING
CPC分类号： H04N5/2257 , G02B3/0075 , G02B5/201 , G02B7/006 , G02B7/021 , H01L27/14625 , H04M1/0264 , H04N5/2252 , H04N5/2253 , H04N5/2254 , H04N5/2258 , H05K1/0203 , H05K1/0274 , H05K1/183 , H05K1/185 , H05K1/189 , H05K2201/0141 , H05K2201/0158 , H05K2201/0175 , H05K2201/09036 , H05K2201/10121
摘要： An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.
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公开(公告)号：US20230019091A1
公开(公告)日：2023-01-19
申请号：US17847569
申请日：2022-06-23
发明人： Mingzhu WANG , Bojie ZHAO , Takehiko TANAKA , Zhongyu LUAN , Zhenyu CHEN , Zhen HUANG
IPC分类号： H01L27/146 , H01L23/10 , H04N5/225 , H05K1/02 , H05K1/11
摘要： A camera module and photosensitive component or unit thereof and manufacturing method therefor are provided. The photosensitive unit includes an encapsulation portion and a photosensitive portion that includes a main circuit board and a photosensitive sensor, wherein the encapsulation portion is integrally encapsulated to form on the main circuit board and the photosensitive sensor.
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公开(公告)号：US20220303437A1
公开(公告)日：2022-09-22
申请号：US17829721
申请日：2022-06-01
发明人： Mingzhu WANG , Zhenyu CHEN , Zhongyu LUAN , Zhen HUANG , Nan GUO , Fengsheng XI , Takehiko TANAKA , Bojie ZHAO , Heng JIANG , Ye WU , Zilong DENG
摘要： A photosensitive component, and a camera module and a manufacturing method therefor. The photosensitive component comprises at least a photosensitive element, at least a window-form circuit board and at least a packaging body, wherein the photosensitive element and the window-form circuit board are integrally packaged through the packaging body. The window-form circuit board comprises a circuit board main body which comprises at least one window arranged thereon, wherein the photosensitive element is arranged within the window.
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