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公开(公告)号:US20230238665A1
公开(公告)日:2023-07-27
申请号:US18191926
申请日:2023-03-29
发明人: Qiuyan WENG , Yibo ZHANG , Hongmei WEI
IPC分类号: H01M50/538 , H01M50/446
CPC分类号: H01M50/538 , H01M50/446
摘要: An electrochemical apparatus includes an electrode assembly. The electrode assembly includes a first electrode plate, a first separation layer, a second electrode plate, and a second separation layer. Along a first direction, the first separation layer includes a first protruding portion extending beyond the second electrode plate, and the second separation layer includes a second protruding portion extending beyond the second electrode plate. The first protruding portion includes a first bonding area, the second protruding portion includes a second bonding area, and adhesion between the first bonding area and the second bonding area is F1, where F1≥5 N/m. Separation layers on two sides of an electrode plate are bonded to prevent the separation layers from shrinking at high temperatures or prevent the separation layers from turning inward at edges due to impact from an electrolyte when the electrochemical apparatus falls, thereby preventing a short circuit.
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公开(公告)号:US20230352744A1
公开(公告)日:2023-11-02
申请号:US18331405
申请日:2023-06-08
发明人: Hongmei WEI , Yibo ZHANG , Qiuyan WENG
IPC分类号: H01M10/0587 , H01M50/44 , H01M50/446 , H01M4/62 , H01M10/0525
CPC分类号: H01M10/0587 , H01M4/622 , H01M10/0525 , H01M50/44 , H01M50/446
摘要: A jelly-roll type electrode assembly includes an electrode plate and a separation layer disposed on at least one surface of the electrode plate. A bonding force of the separation layer to a surface of the electrode plate in a first region of the jelly-roll type electrode assembly is greater than a bonding force of the separation layer to the surface of the electrode plate in a second region of the jelly-roll type electrode assembly. In this way, the bonding force of the separation layer to the surface of the electrode plate in the first region in the jelly-roll type electrode assembly is relatively high. When the electrode plate in the second region is stressed, a slight slip can occur between layers to release the stress, alleviating deformation of the electrochemical device caused by stress concentration.
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3.
公开(公告)号:US20220224141A1
公开(公告)日:2022-07-14
申请号:US17708766
申请日:2022-03-30
发明人: Maohua CHEN , Hongmei WEI , Yuansen XIE
IPC分类号: H02J7/00 , H01M10/44 , H01M10/052
摘要: An electronic device, a charging method for an electrochemical device, a terminal and a storage medium. The electronic device includes an electrochemical device that satisfies the following features: in a first stage of a charging process, a state of charge (SOC) of the electrochemical device being less than or equal to X, 70%≤X
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