公开(公告)号：US10028370B2

公开(公告)日：2018-07-17

申请号：US14686143

申请日：2015-04-14

Applicant: NITTO DENKO CORPORATION

Inventor： Yasunari Ooyabu ,  Tetsuya Ohsawa ,  Emiko Tani

IPC: G11B5/48 ,  H05K1/02 ,  H05K3/40 ,  H05K3/06 ,  H05K1/05 ,  H05K3/00

Abstract: A suspension board with circuit includes a metal supporting board, a conductive layer laminated on the metal supporting board, and a via layer interposed between the metal supporting board and the conductive layer. The conductive layer includes a conductive pattern, and a reference portion serving as a positioning reference for placing the suspension board with circuit on a load beam.

公开(公告)号：US09843216B2

公开(公告)日：2017-12-12

申请号：US14891106

申请日：2014-04-03

Applicant: Nitto Denko Corporation

Inventor： Tadao Ookawa ,  Emiko Tani ,  Akihito Matsutomi ,  Shotaro Masuda

IPC: H02J17/00 ,  H02J7/02 ,  H01F38/14 ,  H01F27/28 ,  H01F27/29 ,  H02J50/10

CPC classification number: H02J50/12 ,  H01F27/2804 ,  H01F27/29 ,  H01F38/14 ,  H01F2027/2809 ,  H01M10/425 ,  H01M10/46 ,  H02J7/025 ,  H02J17/00 ,  H02J50/10 ,  H02J50/70

Abstract: A first coil portion is formed in a first coil region of an upper surface of an insulating layer, and a second coil portion is formed on a lower surface of the insulating layer. A second terminal is formed at a position outside the first coil region. One or more intersection regions, in which a path, extending from an inner end of the first coil portion to the second terminal, intersects the first coil portion, are provided on the upper surface. The first coil portion is parted in each intersection region. A second lead portion passes between one portion and another portion of the first coil portion parted in said each intersection region and extends from the inner end of the first coil portion to the second terminal. The first coil portion and the second coil portion are connected together in parallel via through holes formed in the insulating layer.