公开(公告)号：US20090101282A1

公开(公告)日：2009-04-23

申请号：US12231706

申请日：2008-09-05

申请人： Noboru Fujino ,  Okito Umehara ,  Akio Katsuro ,  Shinichi Sasaki

发明人： Noboru Fujino ,  Okito Umehara ,  Akio Katsuro ,  Shinichi Sasaki

IPC分类号： B07C99/00

CPC分类号： H01L21/67132 ,  Y10T156/1983

摘要： A die pick-up apparatus and method using a wiper that has a tip end moving in and out of an adherence surface of a die stage and a shutter that is moved with the wiper while blocking a suction window formed in the adherence surface. When picking up a semiconductor die, the tip end of the wiper is aligned with a first end of the die, the wiper is moved along the adherence surface while the tip end of the wiper is protruded from the adherence surface with the die being suction-held by a collet. A suction opening is sequentially opened between a first end surface of the suction window and a seat surface of the wiper as the wiper is moved, and a dicing sheet attached to the die is suctioned into the suction opening that has been opened and sequentially peeled off from the die.

摘要翻译： 一种模具拾取装置和方法，其使用具有尖端移动进入和离开模具台的粘附表面的刮水器以及与擦拭器一起移动的挡板，同时阻挡形成在粘附表面中的吸入窗口。 当拾取半导体管芯时，擦拭器的尖端与模具的第一端对准，擦拭器沿粘附表面移动，同时擦拭器的末端从附着表面突出， 由夹头夹持。 随着擦拭器的移动，抽吸窗口的第一端面和擦拭器的座面之间依次打开抽吸口，将附着在模具上的切割片吸入已打开并依次剥离的抽吸口 从死亡。

公开(公告)号：US20090075459A1

公开(公告)日：2009-03-19

申请号：US12231752

申请日：2008-09-05

申请人： Yasushi Sato ,  Okito Umehara ,  Akio Katsuro ,  Shinichi Sasaki

发明人： Yasushi Sato ,  Okito Umehara ,  Akio Katsuro ,  Shinichi Sasaki

IPC分类号： H01L21/304 ,  H01L21/67

CPC分类号： H01L21/67132 ,  H01L21/6838

摘要： A die pick-up apparatus and method using a die stage having an adherence surface, a suction window formed in the adherence surface and larger than a semiconductor die to be picked up, and a cover plate that slides along the adherence surface and opens and closes the suction window. When picking up the semiconductor die, the surface of the cover plate is caused to be closely contacted to a dicing sheet that is attached to the die so that the die is within the boundary of the upper surface of the cover plate that closes the suction window, and then the dicing sheet is sequentially peeled off as, while the die is being suctioned by a collet, the cover plate gradually slides to sequentially open the suction window and allow the dicing sheet to be suctioned into the opened suction window.

摘要翻译： 一种模具拾取装置和方法，使用具有粘附表面的模具台，形成在粘附表面上的大于被拾取的半导体模具的吸入窗口，以及沿着粘附表面滑动并打开和关闭的盖板 抽窗。 当拾取半导体管芯时，使盖板的表面与附接到模具的切割片紧密接触，使得模具在关闭吸入窗口的盖板的上表面的边界内 然后在模具被夹头吸引的同时依次剥离切割片，盖板逐渐滑动以依次打开抽吸窗口并允许切割片被吸入打开的抽吸窗口中。

公开(公告)号：US07820006B2

公开(公告)日：2010-10-26

申请号：US12714615

申请日：2010-03-01

申请人： Okito Umehara ,  Kuniyuki Takahashi

发明人： Okito Umehara ,  Kuniyuki Takahashi

IPC分类号： B32B38/10

CPC分类号： H01L21/67132 ,  H01L21/67126 ,  Y10S438/976 ,  Y10T156/1132 ,  Y10T156/1944

摘要： A die pickup apparatus facilitates picking up a semiconductor die in a manner such that, in a state in which a semiconductor die to be picked up is suctioned by a collet, a frontal end of a cover plate is caused to extend from a contact surface, and the cover plate is caused to slide while pushing up a dicing sheet and the semiconductor die, and subsequently a rear end of the cover plate is caused to extend from the contact surface such that an upper surface of the cover plate is substantially in parallel with the contact surface, the cover plate is caused to slide while pushing the dicing sheet and the semiconductor die with the upper surface of the cover plate such that the suction opening is opened, and the dicing sheet is suctioned into the opened suction opening, thereby separating the dicing sheet.

摘要翻译： 芯片拾取装置便于以这样的方式拾取半导体管芯，使得在被夹紧的半导体管芯被夹头抽吸的状态下，使盖板的前端从接触表面延伸， 并且使盖板在推动切割片和半导体管芯的同时滑动，并且随后使盖板的后端从接触表面延伸，使得盖板的上表面基本上平行于 接触表面，盖板被滑动，同时用盖板的上表面推动切割片和半导体管芯，使得开口打开，并且切割片被吸入打开的吸入口中，从而分离 切割片。

公开(公告)号：US20100226745A1

公开(公告)日：2010-09-09

申请号：US12714615

申请日：2010-03-01

申请人： Okito Umehara ,  Kuniyuki Takahashi

发明人： Okito Umehara ,  Kuniyuki Takahashi

IPC分类号： H01L21/683 ,  H01L21/673 ,  H01L21/677

CPC分类号： H01L21/67132 ,  H01L21/67126 ,  Y10S438/976 ,  Y10T156/1132 ,  Y10T156/1944

摘要： A die pickup apparatus facilitates picking up a semiconductor die in a manner such that, in a state in which a semiconductor die to be picked up is suctioned by a collet, a frontal end of a cover plate is caused to extend from a contact surface, and the cover plate is caused to slide while pushing up a dicing sheet and the semiconductor die, and subsequently a rear end of the cover plate is caused to extend from the contact surface such that an upper surface of the cover plate is substantially in parallel with the contact surface, the cover plate is caused to slide while pushing the dicing sheet and the semiconductor die with the upper surface of the cover plate such that the suction opening is opened, and the dicing sheet is suctioned into the opened suction opening, thereby separating the dicing sheet.

摘要翻译： 芯片拾取装置便于以这样的方式拾取半导体管芯，使得在被夹紧的半导体管芯被夹头抽吸的状态下，使盖板的前端从接触表面延伸， 并且使盖板在推动切割片和半导体管芯的同时滑动，并且随后使盖板的后端从接触表面延伸，使得盖板的上表面基本上平行于 接触表面，盖板被滑动，同时用盖板的上表面推动切割片和半导体管芯，使得开口打开，并且切割片被吸入打开的吸入口中，从而分离 切割片。