公开(公告)号：US09922862B2

公开(公告)日：2018-03-20

申请号：US15108027

申请日：2014-01-28

申请人： EV GROUP E. THALLNER GMBH

发明人： Andreas Fehkuhrer

IPC分类号： H01L21/687 ,  B32B43/00 ,  H01L21/67

CPC分类号： H01L21/68728 ,  H01L21/67092 ,  H01L2221/68386 ,  Y10S156/93 ,  Y10S156/941 ,  Y10T156/1132 ,  Y10T156/1168 ,  Y10T156/1944 ,  Y10T156/1978

摘要： A device for detaching a first substrate from a second substrate in a detaching direction (L) with: at least two elements guided crosswise to the detaching direction (L) and in a radial direction (R) to the first substrate for clamping the first substrate crosswise to the detaching direction (L), a substrate holding device for holding the second substrate, and detaching means for detaching the first substrate from the second substrate by moving the first substrate, attached by the clamping elements, in the detaching direction (L) and/or by moving the substrate holding device opposite to the detaching direction (L). In addition, this invention relates to a corresponding method.

公开(公告)号：US20170210115A1

公开(公告)日：2017-07-27

申请号：US15413696

申请日：2017-01-24

申请人： Semiconductor Energy Laboratory Co., Ltd.

发明人： Masakatsu OHNO ,  Koichi TAKESHIMA

IPC分类号： B32B43/00 ,  H01L27/12 ,  H01L51/00 ,  H01L21/683

CPC分类号： B32B43/006 ,  B32B37/02 ,  B32B37/025 ,  B32B37/1284 ,  B32B37/18 ,  B32B38/10 ,  B32B2310/0843 ,  H01L21/6835 ,  H01L27/1266 ,  H01L27/3244 ,  H01L51/0024 ,  H01L51/003 ,  H01L51/0097 ,  H01L51/56 ,  H01L2221/68318 ,  H01L2221/6835 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2227/326 ,  Y10T156/1126 ,  Y10T156/1132 ,  Y10T156/1168 ,  Y10T156/1184 ,  Y10T156/1933 ,  Y10T156/1944 ,  Y10T156/1967

摘要： A starting point for separating a separation layer and a layer to be separated is formed in a process member. A first step of irradiating a first portion of the process member with first laser light in a frame-like shape and a second step of irradiating at least part of a region which is irradiated with the first laser light with second laser light are performed. The process member includes a first substrate, the separation layer, the layer to be separated, and an adhesive layer which are stacked in this order. In the first portion, the adhesive layer overlaps with the first substrate with the separation layer and the layer to be separated provided therebetween. In the first step, the first laser light is absorbed by at least the layer to be separated and the adhesive layer. In the second step, the second laser light is absorbed by at least the separation layer.

公开(公告)号：US09682544B2

公开(公告)日：2017-06-20

申请号：US15147020

申请日：2016-05-05

申请人： Semiconductor Energy Laboratory Co., Ltd.

发明人： Kayo Kumakura ,  Tomoya Aoyama ,  Akihiro Chida ,  Kohei Yokoyama ,  Masakatsu Ohno ,  Satoru Idojiri ,  Hisao Ikeda ,  Hiroki Adachi ,  Yoshiharu Hirakata ,  Shingo Eguchi ,  Yasuhiro Jinbo

IPC分类号： B32B38/10 ,  B32B43/00 ,  G02B6/00 ,  H01L21/67 ,  B26D1/04 ,  H01L51/56 ,  B26D1/00 ,  H01L27/12 ,  H01L27/32

CPC分类号： B32B43/006 ,  B26D1/04 ,  B26D2001/006 ,  B32B38/10 ,  B32B2457/00 ,  G02B6/00 ,  H01L21/67092 ,  H01L27/1248 ,  H01L27/3258 ,  H01L27/3262 ,  H01L51/56 ,  H01L2221/68327 ,  H01L2227/323 ,  H01L2251/5338 ,  Y10T156/1126 ,  Y10T156/1132 ,  Y10T156/1168 ,  Y10T156/1184 ,  Y10T156/1933 ,  Y10T156/1944 ,  Y10T156/1961 ,  Y10T156/1967

摘要： A processing apparatus of a stack is provided. The stack includes two substrates attached to each other with a gap provided between their end portions. The processing apparatus includes a fixing mechanism that fixes part of the stack, a plurality of adsorption jigs that fix an outer peripheral edge of one of the substrates of the stack, and a wedge-shaped jig that is inserted into a corner of the stack. The plurality of adsorption jigs include a mechanism that allows the adsorption jigs to move separately in a vertical direction and a horizontal direction. The processing apparatus further includes a sensor sensing a position of the gap between the end portion in the stack. A tip of the wedge-shaped jig moves along a chamfer formed on an end surface of the stack. The wedge-shaped jig is inserted into the gap between the end portions in the stack.

公开(公告)号：US20170133259A1

公开(公告)日：2017-05-11

申请号：US15319259

申请日：2015-05-13

申请人： Manufacturing Integration Technology Ltd

发明人： Kim Mone KWONG ,  Kok Yeow LIM ,  Zhiqiang MAO

IPC分类号： H01L21/683

CPC分类号： H01L21/6836 ,  H01L21/67132 ,  H01L21/6838 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/68354 ,  H01L2221/68386 ,  Y10S156/932 ,  Y10S156/943 ,  Y10T156/1132 ,  Y10T156/1179 ,  Y10T156/1944 ,  Y10T156/1983

摘要： A system and method for peeling a semiconductor chip from a tape using a multistage ejector is disclosed. A housing in the multistage ejector houses a plural sets of tape removing contacts. A pick and place unit is moved slowly to have contact with the chip. A vacuum source is utilized for generating vacuum to suck the tape. Plural sets of contacts such as inner, middle and outer contacts are independently or together moved below the tape at various stages by utilizing their respective actuation mechanism. A controller can independently control the movements of each contact to effectively remove or loosen the tape from the chip. A pick and place unit can then pick up the chip easily without any damage to chip.

公开(公告)号：US20170120570A1

公开(公告)日：2017-05-04

申请号：US15037112

申请日：2015-11-03

申请人： BOE Technology Group Co., Ltd. ,  BOE (Hebei) Mobile Display Technology Co., Ltd.

发明人： Nan MA ,  Hongqian CAI ,  Jianjun PANG

IPC分类号： B32B43/00 ,  B32B38/10

CPC分类号： B32B43/006 ,  B32B38/10 ,  B32B2457/20 ,  Y10T156/1132 ,  Y10T156/1174 ,  Y10T156/1944 ,  Y10T156/195 ,  Y10T156/1978

摘要： The present disclosure discloses a film stripping device including: a fixing mechanism for fixing a substrate on which a film to be stripped is disposed; and a stripping mechanism comprising a striping member for stripping at least a part of an edge of the film and a gripping member for gripping the stripped part of the film and movable in a direction towards the film to be stripped relative to the fixing mechanism. Correspondingly, a film stripping method using the film stripping device is also disclosed. The present disclosure increases the efficiency of film stripping and reduces an amount of used adhesive tapes.

公开(公告)号：US20170113448A1

公开(公告)日：2017-04-27

申请号：US15285655

申请日：2016-10-05

申请人： BOE TECHNOLOGY GROUP CO., LTD. ,  BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.

发明人： Chunyu YANG ,  Man YUAN ,  Ji ZHANG ,  Wei ZHANG ,  Yongzhi YIN ,  Yanhong LIU

IPC分类号： B32B43/00

CPC分类号： B32B43/006 ,  B32B38/10 ,  B32B38/1833 ,  B32B38/1858 ,  B32B2457/20 ,  Y10T156/1132 ,  Y10T156/1158 ,  Y10T156/1911 ,  Y10T156/1944

摘要： A separation device for a backlight source is provided. The separation device includes a machine table, at least one separation platform, where each separation platform is located above the machine table and secured at a fixed position relative to the machine table and is configured to support a display module and secure a backlight source of the display module thereon; a plurality of guide columns arranged perpendicular to the machine table, at least one adsorption mechanism arranged in a one-to-one correspondence with the at least one separation platform, where each adsorption mechanism is arranged at a side of the corresponding separation platform away from the machine table and configured to adsorb a display screen of the display module on the corresponding separation platform, and a driving unit configured to drive each adsorption mechanism to move in the lengthwise direction of the plurality of guide columns.

公开(公告)号：US09553009B2

公开(公告)日：2017-01-24

申请号：US14522937

申请日：2014-10-24

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Jae In Sim ,  Gyeong Seon Park ,  Kyung Ja Lim ,  Seung Woo Choi ,  O Hak Kwon

IPC分类号： B32B38/10 ,  H01L21/683 ,  B32B43/00 ,  H01L21/67 ,  H01L21/687

CPC分类号： H01L21/6838 ,  B32B43/006 ,  H01L21/67092 ,  H01L21/68735 ,  H01L2221/68381 ,  H01L2221/68386 ,  Y10T156/1132 ,  Y10T156/1153 ,  Y10T156/1168 ,  Y10T156/1911 ,  Y10T156/1944 ,  Y10T156/1978

摘要： There is provided a substrate separation device and method for separating a growth substrate from a laminate structure which includes a support substrate, a semiconductor layer, and the growth substrate. The device includes: a first base which is configured to hold the laminate structure thereon, and includes a first holding unit configured to hold the support substrate defining a bottom surface of the laminate structure and a heating unit configured to heat the laminate structure; and a second base including a second holding unit disposed above the first holding unit and configured to hold the growth substrate defining an upper surface of the laminate structure.

摘要翻译： 提供了一种用于从包括支撑衬底，半导体层和生长衬底的层压结构分离生长衬底的衬底分离装置和方法。 该装置包括：第一基座，其构造成在其上保持层压结构，并且包括第一保持单元，其构造成保持限定层压结构的底表面的支撑基板;以及加热单元，其构造成加热层叠结构; 以及第二基座，其包括设置在所述第一保持单元上方的第二保持单元，并且构造成保持限定所述层叠结构的上表面的所述生长基板。

公开(公告)号：US09437468B2

公开(公告)日：2016-09-06

申请号：US14229902

申请日：2014-03-29

申请人： Intel Corporation

发明人： Xavier F. Brun ,  Huan Ma

IPC分类号： H01L21/67 ,  H01L21/683 ,  H01L21/02

CPC分类号： H01L21/6838 ,  H01L21/0209 ,  H01L21/31133 ,  H01L21/67028 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T156/1132

摘要： A heated non-contact wafer handling gripper may heat a thin device wafer bottom surface having a temporary bonding adhesive residue after debonding of the device wafer from a carrier along a layer of temporary bonding adhesive that bonds the wafers. The gripper may heat residue of the adhesive that remains on the bottom surface while gripping, transferring and placing the wafer onto an adhesive cleaning chuck. The heated adhesive cleaning chuck may heat the thin device wafer bottom surface having the adhesive residue after being placed on the chucks. The chuck may heat the residue of the adhesive while the residue is cleaned from the wafer. Due to the heating by the chuck and/or gripper, wafer warpage and associated problems due to cooling of the residue may be eliminated or acceptable for wafer handling and adhesive cleaning.

摘要翻译： 加热的非接触式晶片处理夹持器可以沿着沿粘合晶片的临时粘合粘合剂层从载体剥离装置晶片之后，加热具有临时粘合粘合剂残留物的薄装置晶片底表面。 夹持器可以在夹持，转移和将晶片放置在粘合剂清洁卡盘上的同时加热残留在底部表面上的粘合剂残留物。 加热的粘合剂清洁卡盘可以在放置在卡盘上之后加热具有粘合剂残留物的薄装置晶片底面。 当残留物从晶片清洗时，卡盘可以加热粘合剂的残留物。 由于卡盘和/或夹持器的加热，晶片翘曲以及由于残留物的冷却引起的相关问题可能消除或可接受用于晶片处理和粘合剂清洁。

公开(公告)号：US09409667B2

公开(公告)日：2016-08-09

申请号：US14540101

申请日：2014-11-13

申请人： HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD. ,  HON HAI PRECISION INDUSTRY CO., LTD.

发明人： Bing Li ,  Bo Yang

IPC分类号： B32B38/10 ,  B65B69/00 ,  B32B43/00

CPC分类号： B65B69/00 ,  B32B38/10 ,  B32B43/006 ,  B65B69/0058 ,  Y10T156/1132 ,  Y10T156/1179 ,  Y10T156/1983 ,  Y10T156/1994

摘要： A unloading mechanism for removing workpieces from a transporting film can include a loading assembly and a unloading assembly coupled to the loading assembly. The loading assembly can include a base, a first driving member and an absorbent member. The base can include a base body, a first guiding member slidably extending through the base body, and a plurality of pushing members coupled to the base body. The first driving member can be coupled to the base body. The absorbent member can be coupled to the first guiding member. The absorbent member can define a plurality of receiving holes, and the pushing members can be received in the receiving holes. The unloading assembly can include a second driving member coupled to the first driving member, and a stopping member coupled to the second driving member adjacent to the absorbent member.

摘要翻译： 用于从输送膜移除工件的卸载机构可以包括联接到装载组件的装载组件和卸载组件。 装载组件可以包括底座，第一驱动构件和吸收构件。 基座可以包括基体，可滑动地延伸穿过基体的第一引导构件和联接到基体的多个推动构件。 第一驱动构件可以联接到基体。 吸收体可以联接到第一引导构件。 吸收体可以限定多个接收孔，并且推动构件可被容纳在接收孔中。 卸载组件可以包括联接到第一驱动构件的第二驱动构件和联接到与吸收构件相邻的第二驱动构件的止动构件。

公开(公告)号：US20160195968A1

公开(公告)日：2016-07-07

申请号：US14797494

申请日：2015-07-13

申请人： BOE TECHNOLOGY GROUP CO., LTD. ,  HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.

发明人： Yifei ZHAN

IPC分类号： G06F3/041

CPC分类号： B26D1/547 ,  B26D7/018 ,  B26F3/12 ,  B32B38/10 ,  B32B43/006 ,  Y10T156/1132 ,  Y10T156/1153 ,  Y10T156/1184 ,  Y10T156/1911 ,  Y10T156/1944 ,  Y10T156/1967

摘要： The present disclosure provides a method and a system for separating a touch panel from a display module of a touch display device. The system includes a carrying unit configured to secure a to-be-processed touch display device, and a disassembling unit configured to soften an adhesive between the touch panel and the display module so as to separate the touch panel from the display module, thereby to disassemble the touch display device secured on the carrying unit.

摘要翻译： 本公开提供了一种用于将触摸面板与触摸显示装置的显示模块分离的方法和系统。 该系统包括被配置为固定待处理的触摸显示装置的承载单元和被配置为软化触摸面板和显示模块之间的粘合剂以便将触摸面板与显示模块分离的拆卸单元，从而 拆卸固定在承载单元上的触摸显示装置。