公开(公告)号：US12256521B2

公开(公告)日：2025-03-18

申请号：US17863506

申请日：2022-07-13

Applicant: Nokia Technologies Oy

Inventor： Raffaele Luca Amalfi ,  Stefano Grillanda ,  Ryan Enright

IPC: H05K7/20 ,  H01S5/024

Abstract: An apparatus for cooling electronic circuitry components and photonic components. In examples of the disclosure at least one photonic component is positioned overlaying at least one electronic circuitry component. In examples of the disclosure there is also provided a spacer for spacing the at least one electronic circuitry component and the at least one photonic component, wherein the spacer for spacing are thermally insulating. In examples of the disclosure there is also provided a first heat transfer configured to remove heat from the at least one electronic circuitry component, and a second heat transfer configured to remove heat from the at least one photonic component.

公开(公告)号：US20230269909A1

公开(公告)日：2023-08-24

申请号：US18110958

申请日：2023-02-17

Applicant: Nokia Technologies Oy

Inventor： Stefano Grillanda ,  Raffaele Luca AMALFI ,  Ryan ENRIGHT

IPC: H05K7/20 ,  H01S5/024

CPC classification number: H05K7/20336 ,  H01S5/02438 ,  H01S5/02423 ,  G01S7/4814

Abstract: Examples of the disclosure relate to an oscillating heat pipe. The oscillating heat pipe includes a channel, a wick structure and a vent. The channel is configured to enable flow of working fluid between at least one condenser region and at least one evaporator region. The wick structure is in fluidic connection with the channel so as to enable working fluid to flow from the channel into the wick structure. The vent is configured to enable working fluid in an, at least partial, vapour phase to be returned from the wick structure to the channel.