Flip chip underfill system and method
    1.
    发明申请
    Flip chip underfill system and method 失效
    倒装芯片底层填充系统和方法

    公开(公告)号:US20030137080A1

    公开(公告)日:2003-07-24

    申请号:US10401362

    申请日:2003-03-28

    Abstract: A system for dispensing a viscous material onto a substrate which includes a dispensing element, a viscous material reservoir and a metering device coupled between the reservoir and the dispensing element for metering a variable amount of a viscous material through the dispensing element. The dispensing element and metering device can be moved by a positioner along a predetermined pattern adjacent a surface of a substrate. A weigh scale located adjacent the substrate receives a metered amount of the viscous material and produces signals representative of a variable weight of the material dispensed during a predetermined time interval. A controller adjusts a speed of movement of the positioner along the predetermined pattern to cause the dispensing element to dispense a desired amount of material based on a calculated flow rate. Alternatively, the controller adjusts a rate of delivery of the metering device based on the calculated flow rate to cause the dispensing element to dispense the desired amount of material along the predetermined pattern. Closed loop temperature control may be provided for the dispensing element and/or the substrate to ensure a substantially constant viscosity and a substantially constant flow rate. A prime and purge station may be provided adjacent the substrate for sucking air bubbles from the dispensing element and metering device.

    Abstract translation: 一种用于将粘性材料分配到基材上的系统,其包括分配元件,粘性材料储存器和联接在储存器和分配元件之间的计量装置,用于通过分配元件计量可变量的粘性材料。 分配元件和计量装置可以通过定位器沿着与基板的表面相邻的预定图案移动。 位于基板附近的称重秤接收计量量的粘性材料,并产生表示在预定时间间隔内分配的材料的可变重量的信号。 控制器根据预定图案来调节定位器的移动速度,以使得分配元件基于所计算的流量来分配所需量的材料。 或者,控制器基于所计算的流量来调节计量装置的输送速率,以使得分配元件沿着预定模式分配期望量的材料。 可以为分配元件和/或基板提供闭环温度控制,以确保基本上恒定的粘度和基本恒定的流速。 可以在基板附近设置起始和吹扫站,用于从分配元件和计量装置吸入气泡。

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