公开(公告)号：US20090061549A1

公开(公告)日：2009-03-05

申请号：US12202456

申请日：2008-09-02

申请人： Noriaki HARADA ,  Ryuuichi KIMURA ,  Kouji AKAZAWA

发明人： Noriaki HARADA ,  Ryuuichi KIMURA ,  Kouji AKAZAWA

IPC分类号： H01L21/56 ,  B32B9/04

CPC分类号： C08G59/24 ,  C08G59/4215 ,  C09D163/00 ,  H01L33/52 ,  Y10T428/31663

摘要： The present invention relates to a process for producing an optical semiconductor device, the process including: disposing a sheet for optical-semiconductor-element encapsulation including a resin sheet A and a plurality of resin layers B discontinuously embedded in the resin sheet A and a plurality of optical semiconductor elements mounted on a substrate in such a way that each of the plurality of optical semiconductor elements faces either one of the plurality of resin layers B; and followed by embedding each of the plurality of optical semiconductor elements in either one of the plurality of resin layers B. According to the process of the invention, optical semiconductor elements can be embedded at once. As a result, an optical semiconductor device which is excellent in LED element protection and durability can be easily obtained. Consequently, the optical semiconductor device obtained can have a prolonged life.

摘要翻译： 本发明涉及一种光半导体器件的制造方法，该方法包括：将不连续地嵌入树脂片A中的树脂片A和多个树脂层B的光半导体元件封装用片材配置成多个， 以使得所述多个光学半导体元件中的每一个面对所述多个树脂层B中的任一个的方式安装在基板上的光半导体元件; 然后将多个光学半导体元件中的每一个嵌入到多个树脂层B中的任一个中。根据本发明的方法，可以一次嵌入光学半导体元件。 结果，可以容易地获得LED元件保护和耐久性优异的光半导体装置。 因此，获得的光半导体器件可以具有延长的寿命。

公开(公告)号：US20090018307A1

公开(公告)日：2009-01-15

申请号：US12170910

申请日：2008-07-10

申请人： Hiroyuki KATAYAMA ,  Noriaki HARADA

发明人： Hiroyuki KATAYAMA ,  Noriaki HARADA

IPC分类号： C08G73/10

CPC分类号： C08G73/00 ,  C08G73/10 ,  C08G73/1003 ,  C08G73/1007 ,  H01L33/56

摘要： The present invention relates to a resin for optical semiconductor element encapsulation containing a polyimide which is obtained by an imidation of a polyimide precursor obtained by a polycondensation of an aliphatic acid dianhydride with an aliphatic or aromatic diamine compound; and an optical semiconductor device containing the resin and an optical semiconductor element encapsulated with the resin. The resin for optical semiconductor element encapsulation according to the present invention exhibits excellent advantages that it has a high light-transmitting property, is excellent in heat resistance, and shows an excellent light resistance even against short-wavelength light.

摘要翻译： 本发明涉及一种含有聚酰亚胺的光学半导体元件封装用树脂，该聚酰亚胺是通过脂肪酸二酐与脂肪族或芳香族二胺化合物的缩聚而得到的聚酰亚胺前体的酰亚胺化而获得的; 以及包含树脂的光学半导体器件和用树脂封装的光学半导体元件。 根据本发明的用于光学半导体元件封装的树脂具有优异的优点，它具有高的透光性，耐热性优异，并且即使对于短波长的光也显示出优异的耐光性。