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公开(公告)号：US07006344B2
公开(公告)日：2006-02-28
申请号：US10332548
申请日：2001-07-23
申请人： Noriyasu Echigo , Kazuyoshi Honda , Yoshiaki Kai , Masaru Odagiri , Hisaaki Tachihara , Hideki Matsuda , Jun Katsube , Kazuo Iwaoka , Takanori Sugimoto , Nobuki Sunagare
发明人： Noriyasu Echigo , Kazuyoshi Honda , Yoshiaki Kai , Masaru Odagiri , Hisaaki Tachihara , Hideki Matsuda , Jun Katsube , Kazuo Iwaoka , Takanori Sugimoto , Nobuki Sunagare
IPC分类号： H01G4/14
CPC分类号： H01C7/005 , C07C323/12 , C08F22/24 , H01B3/301 , H01B3/442 , H01C17/06586 , H01G4/18
摘要： The present invention provides a bis(4-mercaptophenyl) sulfide derivative represented by general formula 1. This derivative is a monomer that can form a dielectric film suitable for an electronic component. The present invention further provides a method for producing this derivative and an electronic component having high characteristics under excellent humidity and high temperature.
摘要翻译： 本发明提供由通式1表示的双（4-巯基苯基）硫化物衍生物。该衍生物是可以形成适用于电子部件的电介质膜的单体。 本发明还提供了一种制备该衍生物的方法和在优异的湿度和高温下具有高特性的电子元件。
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2.发明授权Layered product, capacitor, electronic component and method and apparatus manufacturing the same 有权分层产品，电容器，电子部件及其制造方法和装置公开(公告)号：US06829135B2
公开(公告)日：2004-12-07
申请号：US09979873
申请日：2001-11-27
IPC分类号： H01G4228
CPC分类号： H01G4/232 , H01G4/30 , Y10T29/435
摘要： Resin thin films (12) and metal thin films (11a, 11b) are layered in alternation. The metal thin films are set back from the peripheral edges of the resin thin films (12). Via holes (13a, 13b) penetrating the layered product in the layering direction are formed and filled with conductive material (14a, 14b). The conductive material (14a, 14b) electrically connects the metal thin films (11a, 11b) among one another. The metal thin films are not exposed at the periphery, so that corrosion of the metal thin films is not likely to occur. Furthermore, cutting of the metal thin films during the manufacturing process is avoided.
摘要翻译： 树脂薄膜（12）和金属薄膜（11a，11b）交替层叠。 金属薄膜从树脂薄膜（12）的周边边缘退回。 形成在层叠方向上穿透层叠体的通孔（13a，13b），并填充有导电材料（14a，14b）。 导电材料（14a，14b）将金属薄膜（11a，11b）彼此电连接。 金属薄膜不会在周边露出，所以不可能发生金属薄膜的腐蚀。 此外，避免了在制造过程中金属薄膜的切割。
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公开(公告)号：US06602559B1
公开(公告)日：2003-08-05
申请号：US09669116
申请日：2000-09-25
IPC分类号： C23C1432
CPC分类号： B05D1/60 , B05B17/04 , C23C14/246 , C23C14/562 , G11B5/85
摘要： A method for forming a thin film includes the steps of: supplying a deposition material in the form of a liquid onto a heated surface; heating and vaporizing the deposition material on the heated surface while the deposition material is undergoing movement; and depositing the deposition material onto a deposition surface. The deposition material is supplied onto a position of the heated surface where the vaporized deposition material does not reach the deposition surface.
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公开(公告)号：US06577493B2
公开(公告)日：2003-06-10
申请号：US10138234
申请日：2002-05-01
IPC分类号： H01G406
CPC分类号： H01G4/30
摘要： A layered product including a plurality of deposition units, each having a thin resin layer and a thin metal layer wherein the surface roughness of the thin resin layer is 0.1 &mgr;m or below, a protrusion forming component is not added to the thin resin layer or the surface roughness of the thin metal layer is 0.1 &mgr;m or below. The surface characteristics are improved regardless of the thickness of the layered product and the requirement of high performance thin film can be satisfied because the layered product contains no foreign matter. The layered product is suitably applicable to electronic parts, e.g., a capacitor, especially a chip capacitor.
摘要翻译： 包括多个沉积单元的分层产品，每个沉积单元具有薄树脂层和薄金属层，其中薄树脂层的表面粗糙度为0.1μm或更小，突起形成组分不添加到薄树脂层或 薄金属层的表面粗糙度为0.1μm以下。 无论层叠体的厚度如何，表面特性均有所提高，因层叠体不含异物，能够满足高性能薄膜的要求。 层叠体适用于电子部件，例如电容器，特别是片状电容器。
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5.发明授权Thin film, method and apparatus for forming the same, and electronic component incorporating the same 失效薄膜，其形成方法和装置以及包含该薄膜的电子部件公开(公告)号：US06714401B2
公开(公告)日：2004-03-30
申请号：US10378693
申请日：2003-03-04
IPC分类号： H01G406
CPC分类号： B05D1/60 , B05B17/04 , C23C14/246 , C23C14/562 , G11B5/85
摘要： A method for forming a thin film includes the steps of: supplying a deposition material in the form of a liquid onto a heated surface; heating and vaporizing the deposition material on the heated surface while the deposition material is undergoing movement; and depositing the deposition material onto a deposition surface. The deposition material is supplied onto a position of the heated surface where the vaporized deposition material does not reach the deposition surface.
摘要翻译： 一种形成薄膜的方法包括以下步骤：将液体形式的沉积材料供应到加热的表面上; 当沉积材料正在运动时，加热和蒸发加热表面上的沉积材料; 以及将沉积材料沉积到沉积表面上。 将沉积材料供应到被蒸发的沉积材料未到达沉积表面的被加热表面的位置。
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公开(公告)号：US06710997B2
公开(公告)日：2004-03-23
申请号：US10138227
申请日：2002-05-01
IPC分类号： H01G406
CPC分类号： H01G4/30
摘要： A layered product including a plurality of deposition units, each having a thin resin layer and a thin metal layer wherein the surface roughness of the thin resin layer is 0.1 &mgr;m or below, a protrusion forming component is not added to the thin resin layer or the surface roughness of the thin metal layer is 0.1 &mgr;m or below. The surface characteristics are improved regardless of the thickness of the layered product and the requirement of high performance thin film can be satisfied because the layered product contains no foreign matter. The layered product is suitably applicable to electronic parts, e.g., a capacitor, especially a chip capacitor.
摘要翻译： 包括多个沉积单元的分层产品，每个沉积单元具有薄树脂层和薄金属层，其中薄树脂层的表面粗糙度为0.1μm或更小，突起形成组分不添加到薄树脂层或 薄金属层的表面粗糙度为0.1μm以下。 无论层叠体的厚度如何，表面特性均有所提高，因层叠体不含异物，能够满足高性能薄膜的要求。 层叠体适用于电子部件，例如电容器，特别是片状电容器。
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公开(公告)号：US06413456B1
公开(公告)日：2002-07-02
申请号：US09216153
申请日：1998-12-18
IPC分类号： B29C4122
摘要： In a method for manufacturing electronic parts by laminating metal thin films and insulating thin films on a support, a mold releasing agent is applied to the support before the start of lamination. Alternatively, the mold releasing agent is applied to the surface of the laminate during the lamination step, and then lamination is resumed. Therefore, the laminate can be prevented from cracking when the laminate is separated from the support or divided into plural pieces in the lamination direction. Thus, the reliability and productivity of electronic parts improve.
摘要翻译： 在通过在支撑体上层压金属薄膜和绝缘薄膜来制造电子部件的方法中，在开始层压之前将脱模剂施加到支撑体上。 或者，在层叠步骤期间将脱模剂施加到层压体的表面，然后恢复层压。 因此，当层压体与支撑体分离或在层叠方向上分成多个部分时，可以防止层压体开裂。 因此，电子零件的可靠性和生产力提高。
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8.发明授权Method and apparatus for manufacturing a thin film, thin-film laminate, and electronic parts 有权用于制造薄膜，薄膜层压板和电子部件的方法和装置公开(公告)号：US06246586B1
公开(公告)日：2001-06-12
申请号：US09380911
申请日：1999-09-10
IPC分类号： H05K116
CPC分类号： H01L21/32051 , C23C14/04 , H01L21/283 , H05K3/0079 , H05K3/048 , H05K3/1241 , H05K3/146
摘要： In a method wherein, before forming a thin film of, for example, metal on a supporting base in a vacuum, a vapor stream of patterning material for forming a pattern in the thin film is applied from nozzle holes, and the thin film is formed after this liquid has been adhered onto the supporting base, the patterning material is applied from the nozzle holes in such manner that it unifies on the supporting base. Thus, even when the pattern width is enlarged, a pattern can be formed in which the blurring at the pattern edges is small.
摘要翻译： 在其中，在真空中在支撑基底上形成例如金属的薄膜之前，从喷嘴孔施加用于在薄膜中形成图案的图案形成材料的蒸气流，形成薄膜 在该液体粘附到支撑基底上之后，图案形成材料以喷嘴孔的形式被支撑在支撑基底上。 因此，即使当图案宽度被扩大时，也可以形成图案边缘处的模糊小的图案。
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公开(公告)号：US06195249B1
公开(公告)日：2001-02-27
申请号：US09341737
申请日：1999-07-15
IPC分类号： H01G4228
CPC分类号： H01G4/30
摘要： An electronic component provided with a dielectric thin film (4), normal electrodes (1a, 1b) formed on the thin film (4), dummy electrodes (2a,2b) formed on the dielectric thin film (4) with an insulating region (20) therebetween, and auxiliary electrodes (3) provided on both side faces of the component, wherein the width of the insulating region (20) is not less than 500 times the thickness of the dielectric thin film (4) so as to improve the characteristics such as the equivalent series resistance. Thus, the deterioration of the frequency characteristics caused by the dummy electrodes can be remedied and the component can be used for a capacitor or the like.
摘要翻译： 设置有电介质薄膜（4）的电子元件，形成在薄膜（4）上的正电极（1a，1b），形成在电介质薄膜（4）上的绝缘区域的虚拟电极（2a，2b） 20），以及设置在所述部件的两个侧面上的辅助电极（3），其中所述绝缘区域（20）的宽度不小于所述电介质薄膜（4）的厚度的500倍，从而改善 特性如等效串联电阻。 因此，可以补救由虚拟电极引起的频率特性的劣化，并且该部件可以用于电容器等。
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公开(公告)号：US6165832A
公开(公告)日：2000-12-26
申请号：US332747
申请日：1999-06-14
IPC分类号： H01G4/30 , H01L21/8242
CPC分类号： H01G4/30
摘要： A method for manufacturing a capacitor includes the step of depositing metal thin film layers and resin layers alternating with each other, thereby forming a layered product. The thickness of the resin layer and the metal thin film or the width of margins are measured during the deposition. At a predetermined point in the process of the deposition, the number of layers to be deposited further is determined, based on the measured values and an intended electrostatic capacitance or deposition thickness. The thus obtained capacitor has the intended electrostatic capacitance or deposition thickness with a small dispersion.
摘要翻译： 制造电容器的方法包括将金属薄膜层和树脂层彼此交替沉积的步骤，从而形成层叠体。 在沉积期间测量树脂层和金属薄膜的厚度或边缘宽度。 在沉积过程中的预定点，基于测量值和预期的静电电容或沉积厚度来确定进一步沉积的层的数量。 由此获得的电容器具有预期的静电电容或沉积厚度小的分散体。
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