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    Oligomer resin compositions
    4.
    发明授权
    Oligomer resin compositions 有权

    公开(公告)号：US11685808B2

    公开(公告)日：2023-06-27

    申请号：US17136569

    申请日：2020-12-29

    Applicant: NOVOSET, LLC

    Inventor： Sajal Das ,  Paul Boothe ,  Patrick Shipman

    IPC: C08G61/02 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00

    CPC classification number: C08G61/02 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00 ,  C08G2115/00 ,  C08G2261/164 ,  C08G2261/226 ,  C08G2261/228 ,  C08G2261/3321 ,  C08G2261/3325 ,  C08G2261/36 ,  C08G2261/40 ,  C08G2261/90

    Abstract: A resin has a structure defined by Formula (I)




    wherein: (a) each R5 is independently a methylene group (CH2), or a methylene group substituted with one or more —H, —CH3, or halogen functionalities; (b) each R6 is independently a bond or a straight-chain or branched, linear or cyclic, saturated or unsaturated, substituted or unsubstituted, aliphatic or aromatic group having between 1 and 2 carbon atoms; (c) each X is independently a functionality possessing at least one non-aromatic alkene or alkyne moiety; (d) each Z is independently either H or X; (e) each Z is independently either H or X, and each p is independently an integer from 1-4; (f) each w is independently 0, or an integer greater than or equal to 1, and (i) when w is 0, the bracket region represents a bond and n is 0, or an integer greater than or equal to 1; and (ii) when n is 0, the bracket region represents a bond. The resin is especially well suited for use in a base station, circuit board, server, router, radome or satellite structure, as well as such processes as digital light printing (DLP), continuous liquid interface printing (CLIP), and Stereolithography (SL).

    OLIGOMER RESIN COMPOSITIONS
    5.
    发明申请
    OLIGOMER RESIN COMPOSITIONS 有权

    公开(公告)号：US20220411573A1

    公开(公告)日：2022-12-29

    申请号：US17136569

    申请日：2020-12-29

    Applicant: NOVOSET, LLC

    Inventor： Sajal Das ,  Paul Boothe ,  Patrick Shipman

    IPC: C08G61/02

    Abstract: A resin has a structure defined by Formula (I) wherein: (a) each R5 is independently a methylene group (CH2), or a methylene group substituted with one or more —H, —CH3, or halogen functionalities; (b) each R6 is independently a bond or a straight-chain or branched, linear or cyclic, saturated or unsaturated, substituted or unsubstituted, aliphatic or aromatic group having between 1 and 2 carbon atoms; (c) each X is independently a functionality possessing at least one non-aromatic alkene or alkyne moiety; (d) each Z is independently either H or X; (e) each Z is independently either H or X, and each p is independently an integer from 1-4; (f) each w is independently 0, or an integer greater than or equal to 1, and (i) when w is 0, the bracket region represents a bond and n is 0, or an integer greater than or equal to 1; and (ii) when n is 0, the bracket region represents a bond. The resin is especially well suited for use in a base station, circuit board, server, router, radome or satellite structure, as well as such processes as digital light printing (DLP), continuous liquid interface printing (CLIP), and Stereolithography (SL).

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