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    ULTRA LOW LOSS DIELECTRIC THERMOSETTING RESIN COMPOSITIONS AND HIGH PERFORMANCE LAMINATES MANUFACTURED THEREFROM
    1.
    发明申请
    ULTRA LOW LOSS DIELECTRIC THERMOSETTING RESIN COMPOSITIONS AND HIGH PERFORMANCE LAMINATES MANUFACTURED THEREFROM 审中-公开
    超低损耗电介质热固性树脂组合物及其制造的高性能层压板

    公开(公告)号：US20160249451A1

    公开(公告)日：2016-08-25

    申请号：US15144503

    申请日：2016-05-02

    申请人： NOVOSET, LLC

    发明人： Sajal Das ,  Patrick Shipman

    IPC分类号： H05K1/03 ,  C08G73/06

    CPC分类号： H05K1/0326 ,  B32B15/06 ,  B32B15/20 ,  B32B25/02 ,  B32B2307/204 ,  B32B2457/08 ,  C08F279/02 ,  C08F283/12 ,  C08J5/24 ,  C08J2351/00 ,  C08J2351/08 ,  H05K1/0346 ,  H05K1/0366 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0162

    摘要： A ultra low loss dielectric thermosetting resin composition has at least one cyanate ester component (A) and at least one reactive intermediate component (B) that is capable of copolymerization with said component (A). The invention is a cyanate ester resin of the form: Tn-[W—(Z)f/(H)1-f—W]n−1—[W—(Z)f/(H)1-f—(OCN)f/(R)1-f]n+2, wherein T is a 1,3,5-substituted-triazine moiety (C3N3); W is a linking atom between triazine and either component A or component B; Z is component (A): H is component (B); OCN is a cyanate ester end group; R is a reactive end group of component B; n is an integer greater than or equal to 1; and f is a weight or mole fraction of component A. The composition exhibits excellent dielectric properties and yields a high performance laminate for use in high layer count, multilayer printed circuit board (PCB), prepregs, resin coated copper (RCC), film adhesives, high frequency radomes, radio frequency (RF) laminates and various composites.

    摘要翻译： 超低损耗介电热固性树脂组合物具有至少一种能与所述组分（A）共聚的氰酸酯组分（A）和至少一种反应性中间组分（B）。 本发明是以下形式的氰酸酯树脂：Tn- [W-（Z）f /（H）1-f-W] n-1- [W-（Z）f /（H）1-f-（ OCN）f /（R）1-f] n + 2，其中T是1,3,5-取代三嗪部分（C 3 N 3）; W是三嗪与组分A或组分B之间的连接原子; Z是组分（A）：H是组分（B）; OCN是氰酸酯端基; R是组分B的反应性端基; n是大于或等于1的整数; 并且f是组分A的重量或摩尔分数。组合物显示出优异的介电性能并产生用于高层计数，多层印刷电路板（PCB），预浸料，树脂涂层铜（RCC），膜粘合剂 ，高频雷达，射频（RF）层压板和各种复合材料。

    Ultra low loss dielectric thermosetting resin composition and high performance laminates manufactured therefrom
    2.
    发明授权
    Ultra low loss dielectric thermosetting resin composition and high performance laminates manufactured therefrom 有权
    超低损耗介电热固性树脂组合物和由其制造的高性能层压材料

    公开(公告)号：US09596753B2

    公开(公告)日：2017-03-14

    申请号：US15240958

    申请日：2016-08-18

    申请人： NOVOSET, LLC

    发明人： Sajal Das ,  Patrick Shipman

    IPC分类号： H05K1/03 ,  C08F279/02 ,  C08J5/24 ,  C08F283/12 ,  B32B15/06 ,  B32B25/02 ,  B32B15/20

    CPC分类号： H05K1/0326 ,  B32B15/06 ,  B32B15/20 ,  B32B25/02 ,  B32B2307/204 ,  B32B2457/08 ,  C08F279/02 ,  C08F283/12 ,  C08J5/24 ,  C08J2351/00 ,  C08J2351/08 ,  H05K1/0346 ,  H05K1/0366 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0162

    摘要： An ultra low loss dielectric thermosetting resin composition has at least one cyanate ester component (A) and at least one reactive intermediate component (B) that is capable of copolymerization with said component (A). The invention is a cyanate ester resin of the form: Tn-[W-(Z)f/(H)1−f-W]n−1-[W-(Z)f/(H)1−f-(OCN)f/(R)1−f]n+2, wherein T is a 1,3,5-substituted-triazine moiety (C3N3); W is a linking atom between triazine and either component A or component B; Z is component (A); H is component (B); OCN is a cyanate ester end group; R is a reactive end group of component B; n is an integer greater than or equal to 1; and f is a weight or mole fraction of component A. The composition exhibits excellent dielectric properties and yields a high performance laminate for use in high layer count, multilayer printed circuit board (PCB), prepregs, resin coated copper (RCC), film adhesives, high frequency radomes, radio frequency (RF) laminates and various composites.

    摘要翻译： 超低损耗介电热固性树脂组合物具有至少一种能够与所述组分（A）共聚的氰酸酯组分（A）和至少一种反应性中间组分（B）。 本发明是以下形式的氰酸酯树脂：Tn- [W-（Z）f /（H）1-fW] n-1- [W-（Z）f /（H）1-f-（OCN） f /（R）1-f] n + 2，其中T是1,3,5-取代三嗪部分（C 3 N 3）; W是三嗪与组分A或组分B之间的连接原子; Z是组分（A）; H是组分（B）; OCN是氰酸酯端基; R是组分B的反应性端基; n是大于或等于1的整数; 并且f是组分A的重量或摩尔分数。组合物显示出优异的介电性能并产生用于高层计数，多层印刷电路板（PCB），预浸料，树脂涂层铜（RCC），膜粘合剂 ，高频雷达，射频（RF）层压板和各种复合材料。

    Oligomer resin compositions
    9.
    发明授权
    Oligomer resin compositions 有权

    公开(公告)号：US11685808B2

    公开(公告)日：2023-06-27

    申请号：US17136569

    申请日：2020-12-29

    申请人： NOVOSET, LLC

    发明人： Sajal Das ,  Paul Boothe ,  Patrick Shipman

    IPC分类号： C08G61/02 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00

    CPC分类号： C08G61/02 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00 ,  C08G2115/00 ,  C08G2261/164 ,  C08G2261/226 ,  C08G2261/228 ,  C08G2261/3321 ,  C08G2261/3325 ,  C08G2261/36 ,  C08G2261/40 ,  C08G2261/90

    摘要： A resin has a structure defined by Formula (I)




    wherein: (a) each R5 is independently a methylene group (CH2), or a methylene group substituted with one or more —H, —CH3, or halogen functionalities; (b) each R6 is independently a bond or a straight-chain or branched, linear or cyclic, saturated or unsaturated, substituted or unsubstituted, aliphatic or aromatic group having between 1 and 2 carbon atoms; (c) each X is independently a functionality possessing at least one non-aromatic alkene or alkyne moiety; (d) each Z is independently either H or X; (e) each Z is independently either H or X, and each p is independently an integer from 1-4; (f) each w is independently 0, or an integer greater than or equal to 1, and (i) when w is 0, the bracket region represents a bond and n is 0, or an integer greater than or equal to 1; and (ii) when n is 0, the bracket region represents a bond. The resin is especially well suited for use in a base station, circuit board, server, router, radome or satellite structure, as well as such processes as digital light printing (DLP), continuous liquid interface printing (CLIP), and Stereolithography (SL).

    OLIGOMER RESIN COMPOSITIONS
    10.
    发明申请
    OLIGOMER RESIN COMPOSITIONS 有权

    公开(公告)号：US20220411573A1

    公开(公告)日：2022-12-29

    申请号：US17136569

    申请日：2020-12-29

    申请人： NOVOSET, LLC

    发明人： Sajal Das ,  Paul Boothe ,  Patrick Shipman

    IPC分类号： C08G61/02

    摘要： A resin has a structure defined by Formula (I) wherein: (a) each R5 is independently a methylene group (CH2), or a methylene group substituted with one or more —H, —CH3, or halogen functionalities; (b) each R6 is independently a bond or a straight-chain or branched, linear or cyclic, saturated or unsaturated, substituted or unsubstituted, aliphatic or aromatic group having between 1 and 2 carbon atoms; (c) each X is independently a functionality possessing at least one non-aromatic alkene or alkyne moiety; (d) each Z is independently either H or X; (e) each Z is independently either H or X, and each p is independently an integer from 1-4; (f) each w is independently 0, or an integer greater than or equal to 1, and (i) when w is 0, the bracket region represents a bond and n is 0, or an integer greater than or equal to 1; and (ii) when n is 0, the bracket region represents a bond. The resin is especially well suited for use in a base station, circuit board, server, router, radome or satellite structure, as well as such processes as digital light printing (DLP), continuous liquid interface printing (CLIP), and Stereolithography (SL).