公开(公告)号：US20160155600A1

公开(公告)日：2016-06-02

申请号：US14953959

申请日：2015-11-30

申请人： NuFlare Technology, Inc. ,  NTT Advanced Technology Corporation

发明人： Kazuhiro CHIBA ,  Hiroshi Matsumoto ,  Munehiro Ogasawara ,  Ryoichi Yoshikawa ,  Hirofumi Morita ,  Hirokazu Yamada ,  Teruaki Safu ,  Toshifumi Konishi ,  Takaaki Matsushima ,  Kazuhisa Kudo ,  Masaki Yano ,  Katsuyuki Machida

IPC分类号： H01J37/04

CPC分类号： H01J37/045 ,  H01J2237/043 ,  H01J2237/0432 ,  H01J2237/0437 ,  H01J2237/303 ,  H01J2237/3175 ,  H01J2237/31774

摘要： A method for fabricating a blanking aperture array device for multi-beams includes forming, using a substrate over which a first insulating film, a first metal film, a second insulating film, and a second metal film are laminated in order, electrodes and pads on the second metal film, removing a part of the second metal film, removing the second insulating film using, as a mask, the electrodes, the pads, and a remaining part of the second metal film, and forming openings each being between a pair of electrodes, wherein, a part of the second metal film is etched such that some part of it remains in regions each connecting one of the electrodes and one of the pads, and a region in which entire openings are formed except the openings themselves is configured by the electrodes, pads, and first and second metal films such that the insulating film is not exposed.

摘要翻译： 一种用于制造用于多光束的消隐孔阵列器件的方法包括使用基板依次形成第一绝缘膜，第一金属膜，第二绝缘膜和第二金属膜，基板上依次层叠电极和焊盘 第二金属膜，去除第二金属膜的一部分，使用作为掩模的电极，焊盘和第二金属膜的剩余部分去除第二绝缘膜，并且形成开口，每个开口分别位于一对 电极，其中，第二金属膜的一部分被蚀刻，使得其中的一部分保留在每个连接电极中的一个和一个焊盘的区域中，并且除了开口本身之外还形成有开口本身的整个开口的区域 电极，焊盘以及第一和第二金属膜，使得绝缘膜不被暴露。

公开(公告)号：US09530610B2

公开(公告)日：2016-12-27

申请号：US14953959

申请日：2015-11-30

申请人： NuFlare Technology, Inc. ,  NTT Advanced Technology Corporation

发明人： Kazuhiro Chiba ,  Hiroshi Matsumoto ,  Munehiro Ogasawara ,  Ryoichi Yoshikawa ,  Hirofumi Morita ,  Hirokazu Yamada ,  Teruaki Safu ,  Toshifumi Konishi ,  Takaaki Matsushima ,  Kazuhisa Kudo ,  Masaki Yano ,  Katsuyuki Machida

IPC分类号： H01J37/04 ,  H01J37/09 ,  G03F1/20

CPC分类号： H01J37/045 ,  H01J2237/043 ,  H01J2237/0432 ,  H01J2237/0437 ,  H01J2237/303 ,  H01J2237/3175 ,  H01J2237/31774

摘要： A method for fabricating a blanking aperture array device for multi-beams includes forming, using a substrate over which a first insulating film, a first metal film, a second insulating film, and a second metal film are laminated in order, electrodes and pads on the second metal film, removing a part of the second metal film, removing the second insulating film using, as a mask, the electrodes, the pads, and a remaining part of the second metal film, and forming openings each being between a pair of electrodes, wherein, a part of the second metal film is etched such that some part of it remains in regions each connecting one of the electrodes and one of the pads, and a region in which entire openings are formed except the openings themselves is configured by the electrodes, pads, and first and second metal films such that the insulating film is not exposed.

摘要翻译： 一种用于制造用于多光束的消隐孔阵列器件的方法包括使用基板依次形成第一绝缘膜，第一金属膜，第二绝缘膜和第二金属膜，基板上依次层叠电极和焊盘 第二金属膜，去除第二金属膜的一部分，使用作为掩模的电极，焊盘和第二金属膜的剩余部分去除第二绝缘膜，并且形成开口，每个开口分别位于一对 电极，其中，第二金属膜的一部分被蚀刻，使得其中的一部分保留在每个连接电极中的一个和一个焊盘的区域中，并且除了开口本身之外还形成有开口本身的整个开口的区域 电极，焊盘以及第一和第二金属膜，使得绝缘膜不被暴露。