公开(公告)号：US20150358518A1

公开(公告)日：2015-12-10

申请号：US14827949

申请日：2015-08-17

Applicant: OLYMPUS CORPORATION

Inventor： Hiroshi ISHII ,  Yuya ISHIDA ,  Kazuhiro KUMEI ,  Kazuyoshi AKIBA

IPC: H04N5/225 ,  A61B1/005 ,  A61B1/05 ,  G02B23/24 ,  H05K1/18

CPC classification number: G02B23/2484 ,  A61B1/0008 ,  A61B1/00124 ,  A61B1/005 ,  A61B1/051 ,  G03B17/02 ,  H04N5/2253 ,  H04N2005/2255 ,  H05K1/189 ,  H05K2201/042 ,  H05K2201/10121

Abstract: An image pickup apparatus includes a solid-state image pickup device chip, an FPC whose terminals are connected to the solid-state image pickup device chip, and a plurality of electronic components mounted on a front surface of the FPC, wherein behind a back face of the solid-state image pickup device chip, the FPC is disposed by being folded in such a way that the FPC will provide mounting surfaces for the plurality of electronic components in a plurality of layers and that the plurality of electronic components will be superimposed via the FPC.

Abstract translation: 图像拾取装置包括固态图像拾取器件芯片，其端子连接到固态图像拾取器件芯片的FPC和安装在FPC的前表面上的多个电子元件，其中在后面 固体摄像器件芯片的FPC通过折叠来设置，使得FPC将为多个电子部件提供多个层的安装表面，并且多个电子部件将经由 FPC。