公开(公告)号：US20180125335A1

公开(公告)日：2018-05-10

申请号：US15860884

申请日：2018-01-03

Applicant: OLYMPUS CORPORATION

Inventor： Hiroyuki MOTOHARA ,  Yasuhiro KUSANO

IPC: A61B1/00 ,  A61B1/06 ,  A61B1/04

CPC classification number: A61B1/00096 ,  A61B1/00006 ,  A61B1/00009 ,  A61B1/00045 ,  A61B1/00105 ,  A61B1/0011 ,  A61B1/005 ,  A61B1/04 ,  A61B1/051 ,  A61B1/06 ,  G02B23/24 ,  G02B23/26 ,  H01L27/14 ,  H01L27/14618 ,  H04N5/2251 ,  H04N5/2253 ,  H04N2005/2255

Abstract: An imaging unit includes: an optical system; a semiconductor package including an image sensor, and a connection electrode formed on a back surface; a cable; an electronic component; and a multi-layer substrate having a rectangular plate shape and including: a first electrode and a second electrode arranged side-by-side with each other on a front surface, the semiconductor package being mounted on the first electrode, and the cable being connected to the second electrode; and a third electrode on a back surface, the electronic component being mounted on the third electrode. The multi-layer substrate includes walls on at least two opposing sides of the back surface, and the semiconductor package is disposed such that a light receiving surface of the image sensor is arranged horizontally with respect to the multi-layer substrate.

公开(公告)号：US20180049628A1

公开(公告)日：2018-02-22

申请号：US15799290

申请日：2017-10-31

Applicant: OLYMPUS CORPORATION

Inventor： Hiroyuki MOTOHARA ,  Yasuhiro KUSANO

IPC: A61B1/05 ,  A61B1/00 ,  H04N5/225

CPC classification number: A61B1/05 ,  A61B1/00114 ,  A61B1/051 ,  G02B23/2484 ,  H01L27/14 ,  H04N5/2253 ,  H04N5/369 ,  H04N2005/2255

Abstract: An imaging unit includes: a semiconductor package including an image sensor and a connection electrode; a circuit board including a main body including a connection land, and an attachment portion protruding on a back surface of the main body and including cable connection electrodes formed on at least two opposing side surfaces; electronic components mounted on an electronic component mounting area on the back surface; and cables electrically and mechanically connected to the cable connection electrodes of the attachment portion. The attachment portion protrudes from the main body such that a center plane of the two side surfaces is shifted from a center plane of side surfaces parallel to the two side surfaces, and at least one side surface is perpendicular to the back surface of the main body. The electronic component mounting area is arranged on the back surface of the main body side-by-side with the attachment portion.

公开(公告)号：US20170127921A1

公开(公告)日：2017-05-11

申请号：US15414731

申请日：2017-01-25

Applicant: OLYMPUS CORPORATION

Inventor： Hiroyuki MOTOHARA ,  Yasuhiro KUSANO

IPC: A61B1/04 ,  A61B1/005 ,  G02B23/24 ,  A61B1/07 ,  A61B1/12 ,  A61B1/00 ,  A61B1/06

CPC classification number: A61B1/04 ,  A61B1/00114 ,  A61B1/00124 ,  A61B1/00165 ,  A61B1/0051 ,  A61B1/05 ,  A61B1/051 ,  A61B1/0669 ,  A61B1/07 ,  A61B1/12 ,  A61B1/127 ,  G02B23/2484 ,  H04N5/2257 ,  H04N2005/2255 ,  H05K1/144

Abstract: An imaging unit includes: a semiconductor package having an image sensor and having a connection electrode on a back side thereof; a circuit board having connection electrodes on front and back sides thereof, the connection electrode on the front side being connected to the connection electrode of the semiconductor package; a deformed circuit board having first, second, and third faces and having connection electrodes on the first, second, and third faces, respectively, a connection electrode on the first face being connected to the connection electrodes of the circuit board; an electronic component mounted on the back side of the circuit board; and cables connected to the connection electrodes on the second and third faces. The electronic component is housed in a recess of the deformed circuit board. The circuit board, the deformed circuit board, and the cables are located within a projection plane in an optical-axis-direction of the semiconductor package.