公开(公告)号：US20170265721A1

公开(公告)日：2017-09-21

申请号：US15613399

申请日：2017-06-05

Applicant: OLYMPUS CORPORATION ,  PANASONIC CORPORATION

Inventor： Hironobu ICHIMURA ,  Tomohisa TAKAHASHI ,  Tomokazu YAMASHITA ,  Noriyuki FUJIMORI ,  Takatoshi IGARASHI ,  Yoshiki TAKAYAMA

IPC: A61B1/00 ,  G02B23/24

CPC classification number: A61B1/00096 ,  A61B1/0011 ,  A61B1/04 ,  A61B1/05 ,  A61B1/051 ,  G02B23/24 ,  G02B23/2423 ,  G02B23/2476 ,  G02B23/2484 ,  H04N5/2253 ,  H04N2005/2255

Abstract: An endoscope includes: an imaging unit disposed at a distal end portion of an insertion section inserted into a body of a subject; and a built-in component provided parallel with the imaging unit at the distal end portion, and extending substantially parallel with an axial direction of the insertion section. The imaging unit includes: a solid state image sensor including a light receiving unit; a flexible circuit board electrically connecting the solid state image sensor; and a rigid circuit board at least partially disposed on a proximal end side of the endoscope relative to the solid state image sensor, and electrically connected to the flexible circuit board.

公开(公告)号：US20170360284A1

公开(公告)日：2017-12-21

申请号：US15695194

申请日：2017-09-05

Applicant: OLYMPUS CORPORATION ,  PANASONIC CORPORATION

Inventor： Tomokazu YAMASHITA ,  Takatoshi IGARASHI ,  Noriyuki FUJIMORI ,  Motonari KATSUNO

IPC: A61B1/05 ,  H04N5/225

CPC classification number: A61B1/05 ,  A61B1/04 ,  G02B23/24 ,  H01L21/3205 ,  H01L21/768 ,  H01L21/822 ,  H01L23/522 ,  H01L27/04 ,  H01L27/14 ,  H01L27/146 ,  H01L27/14618 ,  H01L27/14636 ,  H01L2224/11 ,  H04N5/2253 ,  H04N5/2256 ,  H04N5/369 ,  H04N2005/2255

Abstract: An endoscope device includes: an imaging unit including a semiconductor chip including an image sensor formed thereon, and a protective glass adhered on the image sensor with an adhesive layer; and a holder configured to hold the imaging unit by fitting the protective glass therein. The semiconductor chip includes: a light-receiving section; a peripheral circuit section; a guard ring surrounding the light-receiving section and the peripheral circuit section; and a plurality of metal dots formed on an outer circumference of the guard ring. The protective glass is adhered to the semiconductor chip by the adhesive layer so as to cover the light-receiving section, the peripheral circuit section, the guard ring, and the metal dots, and the metal dots are formed at a same interval from the outer circumference of the guard ring to a connection end portion of a connecting surface between the semiconductor chip and the protective glass.

公开(公告)号：US20170255001A1

公开(公告)日：2017-09-07

申请号：US15602396

申请日：2017-05-23

Applicant: OLYMPUS CORPORATION ,  PANASONIC CORPORATION

Inventor： Tomokazu YAMASHITA ,  Takatoshi IGARASHI ,  Noriyuki FUJIMORI ,  Yoshiki TAKAYAMA ,  Yutaka HARADA

IPC: G02B23/24 ,  H04N5/225 ,  H04N5/335 ,  A61B1/00 ,  A61B1/05

CPC classification number: G02B23/2484 ,  A61B1/0011 ,  A61B1/051 ,  G02B23/2469 ,  H04N5/2253 ,  H04N5/2256 ,  H04N5/2257 ,  H04N5/335 ,  H04N2005/2255

Abstract: An imaging unit includes: a flexible substrate including one end connected to a light receiving surface of a solid state image sensor, the flexible substrate extending to a surface side opposite to the light receiving surface; a multi-layer substrate connected to a surface of the flexible substrate, the surface of the flexible substrate being a surface to which the solid state image sensor is connected, the multi-layer substrate including a plurality of electronic components mounted thereon; and a connection layer configured to electrically and mechanically connect to connection members provided on the surface of the flexible substrate and a surface of the multi-layer substrate facing the surface of the flexible substrate.

公开(公告)号：US20210401267A1

公开(公告)日：2021-12-30

申请号：US17475925

申请日：2021-09-15

Applicant: OLYMPUS CORPORATION

Inventor： Daichi KODAMA ,  Tomokazu YAMASHITA ,  Takuro HORIBE ,  Hiroyuki MOTOHARA

IPC: A61B1/00

Abstract: A distal end frame includes: a first distal end frame member that includes a resin molded product which constitutes a molded interconnect device; a housing chamber that is provided on a distal end side of the first distal end frame member, and is formed of a recessed portion a distal end and one side of which are opened; a second distal end frame member that is composed of the resin molded product constituting the molded interconnect device, and is configured to close the one side of the housing chamber; a signal pattern that is the metal pattern formed in a region including a first joining surface which is a joining surface with the second distal end frame member, on a surface of the first distal end frame member; and a solder material which is configured to join the first distal end frame member and the second distal end frame member.