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公开(公告)号：US20170276553A1
公开(公告)日：2017-09-28
申请号：US15509397
申请日：2015-10-19
申请人： OMRON Corporation
CPC分类号： G01K13/002 , A61B5/01 , B81B3/0081 , B81B7/0019 , G01K7/028 , G01K7/427
摘要： Provided is an internal temperature measurement device capable of measuring an internal temperature of a measuring object for which the thermal resistance value of a non-heating body present on the surface side of the object is unknown, more accurately with better responsiveness than hitherto. The internal temperature measurement device 10 includes a MEMS chip 12 including: two cells 20a, 20b for measuring two heat fluxes for calculating an internal temperature of a measuring object for which the thermal resistance value of a non-heating body is unknown; and a cell 20c for increasing a difference between the heat fluxes.
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公开(公告)号：US10060803B2
公开(公告)日：2018-08-28
申请号：US15103366
申请日：2014-12-12
申请人： OMRON Corporation
摘要： An internal temperature sensor includes substrates with one surface to be placed in contact with a measurement surface of an object to measure an internal temperature of the object, a heat flux sensor on another surface of the substrates, and a temperature sensor. The heat flux sensor is fabricated through a MEMS process and includes first and second temperature measurement parts, and a thin film including a thermopile to detect a temperature difference between the first and second temperature measurement parts. The thin film is supported by a thermally conductive member to form a space between the first temperature measurement part and the substrates and to extend parallel to the substrates. The thermally conductive member conducts heat traveling from the object through the substrates to the second temperature measurement part. The temperature sensor measures the temperature of a part of the substrates that is in contact with the thermally conductive member.
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公开(公告)号：US10551252B2
公开(公告)日：2020-02-04
申请号：US15552619
申请日：2016-02-25
申请人： OMRON Corporation
发明人： Shinya Nakagawa , Masao Shimizu
摘要： An internal temperature measuring apparatus includes: a sensor package in which a MEMS chip and a temperature sensor are disposed in a bottomed tubular package, the MEMS chip including one or a plurality of thermopiles each of which measures a heat flux passing through a region of a bottom of the bottomed tubular package, the temperature sensor measuring a reference temperature used as temperature of a predetermined portion of the MEMS chip; and a printed circuit board configured to calculate the internal temperature of the measurement object based on output of the sensor package. An outer bottom face of the sensor package projects from a plate face of the printed circuit board through a through-hole made in the printed circuit board.
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公开(公告)号：US10190921B2
公开(公告)日：2019-01-29
申请号：US15509397
申请日：2015-10-19
申请人： OMRON Corporation
摘要： Provided is an internal temperature measurement device capable of measuring an internal temperature of a measuring object for which the thermal resistance value of a non-heating body present on the surface side of the object is unknown, more accurately with better responsiveness than hitherto. The internal temperature measurement device 10 includes a MEMS chip 12 including: two cells 20a, 20b for measuring two heat fluxes for calculating an internal temperature of a measuring object for which the thermal resistance value of a non-heating body is unknown; and a cell 20c for increasing a difference between the heat fluxes.
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公开(公告)号：US10175120B2
公开(公告)日：2019-01-08
申请号：US15124374
申请日：2015-02-19
申请人： OMRON Corporation
摘要： A method includes measuring a first temperature difference between first heat entry and discharge parts on a first heat transfer path extending from a portion of a surface of the object to the first heat discharge part using a first thermopile, and measuring a second temperature difference between a second heat entry and discharge parts on a second heat transfer path extending from another portion of the surface of the object to the second heat discharge part using a second thermopile, and measuring a reference temperature at a predetermined position on the first or second heat transfer path using a temperature sensor, and calculating the internal temperature of the object using the measured first and second temperature differences, and the reference temperature, and at least one predetermined value excluding a physical property value of a non-heating part of the object located at a surface side of the object.
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公开(公告)号：US11635395B2
公开(公告)日：2023-04-25
申请号：US16999553
申请日：2020-08-21
申请人： OMRON Corporation
发明人： Shinya Nakagawa , Susumu Kamiyama , Hajime Kano , Hideyuki Nakao , Kenichi Handa
IPC分类号： G01N25/18 , G01N29/024
摘要： A first heat generator heats a mixture of fluids to a first temperature. A predetermined thermal property value of the mixture set to the first temperature is obtained, the first heat generator heats the mixture to a second temperature, the thermal property value of the mixture set to the second temperature is obtained. First relationship information between the thermal property value of the mixture set to the first temperature and a mixture ratio of a first fluid is obtained. Second relationship information between the thermal property value of the mixture set to the second temperature and the mixture ratio of the first fluid is obtained. Mixture ratios are calculated based on the thermal property value of the mixture set to the first temperature, the thermal property value of the mixture of fluids set to the second temperature, the first relationship information, and the second relationship information.
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公开(公告)号：US10564046B2
公开(公告)日：2020-02-18
申请号：US15679609
申请日：2017-08-17
申请人： OMRON Corporation
发明人： Shinya Nakagawa
摘要： An internal temperature measuring apparatus includes a base and a MEMS device disposed on the base. The MEMS device includes a top face and a support. The top face includes a first thermopile configured to measure a first temperature difference used to calculate an internal temperature and a second thermopile configured to measure a second temperature difference used to calculate the internal temperature together with the first temperature difference. An orientation in which a cold junction of each thermocouple constituting the first thermopile is viewed from a hot junction coincides with an orientation in which a cold junction of each thermocouple constituting the second thermopile is viewed from a hot junction.
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公开(公告)号：US10451490B2
公开(公告)日：2019-10-22
申请号：US15553195
申请日：2016-02-24
申请人： OMRON Corporation
发明人： Shinya Nakagawa , Masao Shimizu
摘要： Provided is a sensor package that measures an internal temperature of a measurement object. A sensor package includes: a package including a bottomed tubular casing and plural leads substantially parallel to each other, each of the leads piercing the bottomed tubular casing; and a MEMS chip including at least one thermopile that measures a temperature difference in an identical direction. The MEMS chip is disposed in an inner bottom surface of the bottomed tubular casing of the package in a posture in which a measurement direction of the temperature difference measured with the thermopile is substantially orthogonal to a longitudinal direction of each lead.
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