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Patent Agency Ranking
公开(公告)号：US20240133745A1
公开(公告)日：2024-04-25
申请号：US17970539
申请日：2022-10-19
Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.
Inventor： Chein-Hsun WANG , Ming LE , Tung-Yang LEE , Yu-Chih LIANG , Wen-Chie HUANG , Chen-Tang HUANG , Jenping KU
Abstract: A temperature sensing device includes a substrate, a first reflective module, a first window cover, and a dual thermopile sensor. The first reflective module is disposed on the substrate, including a first mirror chamber with a narrow field of view (FOV), and the first reflective module focuses a thermal radiation from measured object to a first image plane in the first mirror chamber. The first window cover is disposed on the first reflective module, and the first window cover allows a selected band of the thermal radiation to pass through. The dual thermopile sensor is disposed on the substrate and located in the first mirror chamber, and the dual thermopile sensor senses a temperature data from the first image plane. Additional second reflective module, LED source plus pin hole with same FOV of dual thermopile sensor can illuminate the measured object for ease of placement of object to be heated.
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公开(公告)号：US20230047601A1
公开(公告)日：2023-02-16
申请号：US17403117
申请日：2021-08-16
Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.
Inventor： Chein-Hsun WANG , Da-Jun LIN , Chun-Chiang CHEN , Chih-Yung TSAI , Yu-Chih LIANG , Ming LE , Chen-Tang HUANG , Tung-Yang LEE , Jenping KU
Abstract: An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. The conversion from wrist temperature to body core temperature uses detected ambient temperature and fixed humidity or imported humidity level to calculate the body core temperature based on experimental data and curve fitting. The skin temperature compensation can be set differently for different sex gender, different standard deviation of wrist temperature and external relative humidity reading.
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公开(公告)号：US20220341789A1
公开(公告)日：2022-10-27
申请号：US17326289
申请日：2021-05-20
Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.
Inventor： Wen-Chie HUANG , Yu-Chih LIANG , Chein-Hsun WANG , Ming LE , Chen-Tang HUANG , Chein-Hsing YU , Tung-Yang LEE , Jenping KU
Abstract: An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. To measure object temperature accurately under acute change in environmental temperature, this disclosure uses the duo-thermopile sensing elements, that one is the active unit for measuring the object temperature and another one is the dummy unit for compensating the effect from the package structure.
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公开(公告)号：US20240230414A9
公开(公告)日：2024-07-11
申请号：US17970539
申请日：2022-10-20
Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.
Inventor： Chein-Hsun WANG , Ming LE , Tung-Yang LEE , Yu-Chih LIANG , Wen-Chie HUANG , Chen-Tang HUANG , Jenping KU
Abstract: A temperature sensing device includes a substrate, a first reflective module, a first window cover, and a dual thermopile sensor. The first reflective module is disposed on the substrate, including a first mirror chamber with a narrow field of view (FOV), and the first reflective module focuses a thermal radiation from measured object to a first image plane in the first mirror chamber. The first window cover is disposed on the first reflective module, and the first window cover allows a selected band of the thermal radiation to pass through. The dual thermopile sensor is disposed on the substrate and located in the first mirror chamber, and the dual thermopile sensor senses a temperature data from the first image plane. Additional second reflective module, LED source plus pin hole with same FOV of dual thermopile sensor can illuminate the measured object for ease of placement of object to be heated.
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公开(公告)号：US20210364359A1
公开(公告)日：2021-11-25
申请号：US16924698
申请日：2020-07-09
Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.
Inventor： Chein-Hsun WANG , Chen-Tang HUANG , Yu-Chih LIANG , Jenping KU
Abstract: An infrared temperature sensor comprises a thermopile sensing chip. The thermopile sensing chip includes a chip substrate, a thermopile sensing unit, a heater and a temperature sensing element. The thermopile sensing unit is disposed on the chip substrate, receives infrared thermal radiation from a target and outputs a corresponding infrared sensation signal. The heater is disposed on the chip substrate and used to heat the chip substrate to a working temperature. The temperature sensing element is disposed on the chip substrate, senses the working temperature of the chip substrate and outputs a corresponding working temperature signal. In operation, the infrared temperature sensor can maintain the thermopile sensing unit at the preset working temperature. Thereby, a single-point temperature calibration is sufficient to obtain more accurate measurement results in a broad environmental temperature range.
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