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公开(公告)号：US20240230414A9
公开(公告)日：2024-07-11
申请号：US17970539
申请日：2022-10-20
Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.
Inventor： Chein-Hsun WANG , Ming LE , Tung-Yang LEE , Yu-Chih LIANG , Wen-Chie HUANG , Chen-Tang HUANG , Jenping KU
Abstract: A temperature sensing device includes a substrate, a first reflective module, a first window cover, and a dual thermopile sensor. The first reflective module is disposed on the substrate, including a first mirror chamber with a narrow field of view (FOV), and the first reflective module focuses a thermal radiation from measured object to a first image plane in the first mirror chamber. The first window cover is disposed on the first reflective module, and the first window cover allows a selected band of the thermal radiation to pass through. The dual thermopile sensor is disposed on the substrate and located in the first mirror chamber, and the dual thermopile sensor senses a temperature data from the first image plane. Additional second reflective module, LED source plus pin hole with same FOV of dual thermopile sensor can illuminate the measured object for ease of placement of object to be heated.
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公开(公告)号：US20240133745A1
公开(公告)日：2024-04-25
申请号：US17970539
申请日：2022-10-19
Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.
Inventor： Chein-Hsun WANG , Ming LE , Tung-Yang LEE , Yu-Chih LIANG , Wen-Chie HUANG , Chen-Tang HUANG , Jenping KU
Abstract: A temperature sensing device includes a substrate, a first reflective module, a first window cover, and a dual thermopile sensor. The first reflective module is disposed on the substrate, including a first mirror chamber with a narrow field of view (FOV), and the first reflective module focuses a thermal radiation from measured object to a first image plane in the first mirror chamber. The first window cover is disposed on the first reflective module, and the first window cover allows a selected band of the thermal radiation to pass through. The dual thermopile sensor is disposed on the substrate and located in the first mirror chamber, and the dual thermopile sensor senses a temperature data from the first image plane. Additional second reflective module, LED source plus pin hole with same FOV of dual thermopile sensor can illuminate the measured object for ease of placement of object to be heated.
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Patent Agency Ranking
公开(公告)号：US20230047601A1
公开(公告)日：2023-02-16
申请号：US17403117
申请日：2021-08-16
Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.
Inventor： Chein-Hsun WANG , Da-Jun LIN , Chun-Chiang CHEN , Chih-Yung TSAI , Yu-Chih LIANG , Ming LE , Chen-Tang HUANG , Tung-Yang LEE , Jenping KU
Abstract: An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. The conversion from wrist temperature to body core temperature uses detected ambient temperature and fixed humidity or imported humidity level to calculate the body core temperature based on experimental data and curve fitting. The skin temperature compensation can be set differently for different sex gender, different standard deviation of wrist temperature and external relative humidity reading.
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公开(公告)号：US20220341789A1
公开(公告)日：2022-10-27
申请号：US17326289
申请日：2021-05-20
Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.
Inventor： Wen-Chie HUANG , Yu-Chih LIANG , Chein-Hsun WANG , Ming LE , Chen-Tang HUANG , Chein-Hsing YU , Tung-Yang LEE , Jenping KU
Abstract: An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. To measure object temperature accurately under acute change in environmental temperature, this disclosure uses the duo-thermopile sensing elements, that one is the active unit for measuring the object temperature and another one is the dummy unit for compensating the effect from the package structure.
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公开(公告)号：US20220316951A1
公开(公告)日：2022-10-06
申请号：US17338308
申请日：2021-06-03
Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.
Inventor： Ming LE , Jenping KU , Chein-Hsun WANG , Yu-Chih LIANG
Abstract: An infrared temperature sensor comprises a thermopile sensor and an infrared reflector, wherein the infrared reflector reflects the infrared ray radiated by a target to a first thermopile sensing element of the thermopile sensor to sense the temperature of the target. By appropriately designing the reflecting surface of the infrared reflector, a horizontal viewing angle of a sensing range of the infrared temperature sensor can be larger, while a vertical viewing angle is smaller. The thermopile sensor further comprises a second thermopile sensing element, which can sense the thermal radiation of a package structure, whereby to compensate for the measurement error induced by the temperature variation of the package structure, which results from the variation of the environmental temperature. Thus, the measurement accuracy is increased.
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公开(公告)号：US20220125391A1
公开(公告)日：2022-04-28
申请号：US17112651
申请日：2020-12-04
Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.
Inventor： Chein-Hsun WANG , Chun-Chiang CHEN , Wen-Chie HUANG , Ming LE
IPC: A61B5/00 , A61B5/0205 , A61B5/11 , G08B21/02
Abstract: An infant care apparatus includes a piezoelectric sensor and an infrared array sensor. The piezoelectric sensor senses a respiration rate and a heart rate of an infant. The infrared array sensor senses a body temperature and an occupancy state of the infant in a non-contact manner. The abovementioned infant care apparatus can assist in determining an abnormality of the respiration rate and the heart rate of the infant based on the occupancy state of the infant output by the infrared array sensor, so as to reduce a false alarm rate.
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公开(公告)号：US20200249101A1
公开(公告)日：2020-08-06
申请号：US16441916
申请日：2019-06-14
Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.
Inventor： Chein-Hsun WANG , Ming LE , Yu-Chih LIANG , Tung Yang LEE , Chih-Yung TSAI
Abstract: A thermal sensor package for earbuds includes two thermopile sensor elements on a single thermopile sensor chip, and the two thermopile sensor elements are separated by a block wall of a cap. One of the thermopile sensor elements senses external infrared thermal radiation through a window of the cap, and the other thermopile sensor element senses internal infrared thermal radiation from a package structure as a basis for correcting compensation. Therefore, the foregoing thermal sensor package for earbuds can quickly correct a measurement error caused by the package structure to improve the measurement accuracy. In addition, the forgoing thermal sensor package for earbuds has a simple packaging step and is easy to arrange a silicon based infrared lens to expand its application.
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