公开(公告)号：US20190189587A1

公开(公告)日：2019-06-20

申请号：US16324528

申请日：2017-06-16

Applicant: OSAKA UNIVERSITY

Inventor： Katsuaki SUGANUMA ,  Shijo NAGAO ,  Akio SHIMOYAMA ,  Shinya SEKI

IPC: H01L23/00 ,  B23K1/00

CPC classification number: H01L24/75 ,  B23K1/0008 ,  B23K2101/40 ,  H01L21/52 ,  H01L2224/75304 ,  H01L2224/7555 ,  H01L2224/75822 ,  H01L2224/7598

Abstract: A bonding device (100) bonds at least one component (C) to a substrate (B) using a metal material (M). The bonding device (100) includes a wall section (20), at least one pressing section (40), and a rotational shaft (30). The rotational shaft (30) is fixed to the wall section (20). Each pressing section (40) has an arm (42) and a presser (43) or a substrate supporting member (90). The arm (42) extends from the rotational shaft (30). The arm (42) pivots about the rotational shaft (30). The presser (43) presses the component (C). The substrate supporting member (90) is disposed on a reference surface (142). The substrate supporting member (90) supports the substrate (B). The component (C) is bonded to the substrate (B) through point contact of the presser (43) with the component (C) or point contact of the substrate supporting member (90) with the reference surface (142).