公开(公告)号：US11133446B2

公开(公告)日：2021-09-28

申请号：US16626355

申请日：2018-06-26

Applicant: OSRAM OLED GmbH

Inventor： Peter Brick ,  Stefan Groetsch ,  Simon Schwalenberg ,  Michael Wittmann

IPC: H01L33/58 ,  H01L27/15 ,  H01L33/14 ,  H01L33/38 ,  H01L33/44 ,  H01L33/50 ,  H01L33/60

Abstract: An optoelectronic component may include an optoelectronic semiconductor chip having an upper side and a lower side. An emitting region may be formed on the upper side. The emitting region may be configured to emit electromagnetic radiation. A subsurface, forming the emitting region, of the upper side may be smaller than a total surface of the upper side. A collimating optical element may be arranged over the emitting region.

公开(公告)号：US10756245B2

公开(公告)日：2020-08-25

申请号：US16079749

申请日：2017-02-24

Applicant: OSRAM OLED GmbH

Inventor： Michael Wittmann ,  Martin Brandl

IPC: H01L33/62 ,  H01L33/44 ,  H01L33/48 ,  H01L33/60

Abstract: An optoelectronic component has at least one lead frame section, wherein an optoelectronic element is arranged on the lead frame section, a mold material is applied at least on a first face of the lead frame section and adhesively connected to the lead frame section by the first face, the lead frame section consists of a predetermined material, a part of the first face of the lead frame section is provided with a coating, a region of the first face is free of the coating, and the mold material connects to the material of the lead frame section in the free region.